Latest News
EDA Tools Market to Reach $26.9 Billion by 2030 on AI and Chip Complexity Growth
New Today | Globe Newswire
MacDermid Alpha Shares Advanced Metallization Expertise at IMPACT and TPCA Show 2026
10/15/2026 | MacDermid Alpha
High Density Packaging User Group and Global Electronics Association Announce New Copper Profile Test Method
10/15/2026 | Global Electronics Association
GlobalFoundries, TSMC Agree on U.S. Silicon Interposer Supply for AI Packaging
10/12/2026 | GlobalFoundries
Global Electronics Association, Purdue University Establish Strategic Partnership to Advance Electronics Innovation
10/09/2026 | Global Electronics Association
Qnity Introduces High-Temperature Sealing Solution for Semiconductor Manufacturing
10/06/2026 | BUSINESS WIRE
E&R Engineering to Open Malaysia Plant for Packaging Materials and Local Services
10/05/2026 | PRNewswire
EMD Electronics Opens Wisconsin R&D Facility for Semiconductor Materials
10/02/2026 | Globe Newswire
SK hynix Indiana Groundbreaking: Bringing Next-Generation AI Memory to the U.S.
10/01/2026 | SK hynix
Global Electronics Association and Fraunhofer Group for Microelectronics Sign MoU to Support Advanced Packaging Industrial Adoption
09/30/2026 | Global Electronics Association
Indium Experts to Present Advanced Packaging, AI, and High-Performance Computing Materials Solutions at IMAPS Symposium
09/28/2026 | Indium Corporation
Nordson Electronics Solutions to Showcase Dispensing and Plasma Systems at SEMICON West 2026
09/25/2026 | Nordson Electronics Solutions
Tata Electronics, Enomoto Sign MoU to Strengthen India Semiconductor Packaging
09/24/2026 | Tata Electronics
Valens Semiconductor, onsemi Collaborate on Cost-Optimized MIPI A-PHY Sensor
09/23/2026 | Valens Semiconductor
Fujifilm to Showcase Semiconductor Materials and India Commitment at SEMICON India 2026
09/17/2026 | Fujifilm
Trio-Tech Secures 3-Year Automotive Semiconductor Burn-In Contract Worth $4.7M Minimum
09/17/2026 | BUSINESS WIRE
REPORT: Closing the European Gap in Data Centre, Cloud, and AI Infrastructure Manufacturing
09/17/2026 | Global Electronics Association
Koh Young Brings Advanced Packaging Inspection and Metrology Solutions to SEMICON West 2026
09/15/2026 | Koh Young
Beyond the Chip: Indium Highlights AI Materials Solutions at SEMICON Taiwan 2026
09/04/2026 | Indium Corporation
Sivers Invests $30 Million to Expand European Photonics Manufacturing for AI Datacenters
09/03/2026 | Sivers Semiconductors AB
Battalion Advanced Technology, Penn State Launch National Security Research Collaboration
09/02/2026 | PRNewswire
Everspin, Teledyne HiRel Partner to Accelerate MRAM Adoption in Aerospace and Defense
09/02/2026 | BUSINESS WIRE
EV Group Addresses Critical Manufacturing Challenges for Next-Generation Co-Packaged Optics
09/01/2026 | PRNewswire
Indium to Explore the Critical Materials and Packaging Process Connection at CPRIM 2026
09/01/2026 | Indium Corporation
Indium Expert to Present AI Packaging and High-Power Consumption Solutions at SEMICON Taiwan
08/31/2026 | Indium Corporation
GigaDevice Expands EMEA and Southeast Asia Reach with Rutronik Partnership
08/31/2026 | BUSINESS WIRE
MacDermid Alpha Addresses Advanced Packaging Materials Challenges at SEMICON Taiwan 2026
08/26/2026 | MacDermid Alpha Electronics Solutions
Indium to Present Materials Solutions for the Next Wave of Power Electronics at CIPA 2026
08/26/2026 | Indium Corporation
Koh Young Advances the Measurement Conversation at Electronics Packaging Symposium 2026
08/26/2026 | Koh Young Technology
Baya Systems Expands to Japan to Support Next-Generation AI Semiconductor Design
08/26/2026 | BUSINESS WIRE
MKS’ Atotech Showcases Copper Via-Fill Solutions for Next-Gen RDL at SEMICON Taiwan
08/25/2026 | Atotech
Qnity Expands AI-Driven Advanced Packaging with End-to-End Process Solutions
08/25/2026 | BUSINESS WIRE
Indium to Present Next Gen Semiconductor Packaging Solutions at PCIM Asia
08/24/2026 | Indium Corporation
NHanced Semiconductors & University of Florida to Present on Advanced Packaging for Photonics at the 2026 SMTAI Conference
08/24/2026 | NHanced Semiconductors
Nordson Test & Inspection Opens State-of-the-Art Center of Excellence
08/21/2026 | Nordson Test & Inspection
NHanced Semiconductors, UF to Present Advanced Photonics Packaging at SMTAI 2026
08/18/2026 | PRNewswire
NXP Semiconductors Breaks Ground on Assembly and Test Site Expansion in Malaysia
08/14/2026 | NXP Semiconductors
Advanced Chip Packaging Technologies Market to Reach $87.6 Billion by 2030
08/11/2026 | Globe Newswire
DOCOMO, Samsung Electronics Achieves Successful Validation of User-level AI-RAN Technology
08/10/2026 | JCN Newswire
Indium to Present Advancements in Two Industry-Defining Solutions at ICEPT 2026
08/03/2026 | Indium Corporation
Global Electronics Association Strengthens Taiwan Technical Leadership in Advanced Electronic Packaging
08/03/2026 | Global Electronics Association
Trump Administration Secures an Additional $100B U.S. Semiconductor Manufacturing Investment for a Total of $265B from TSMC
07/16/2026 | U.S. Department of Commerce
Silex Establishes U.S. Manufacturing Capacity – Acquires Semiconductor Fab in Pennsylvania
07/07/2026 | Silex Microsystems
ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
07/07/2026 | BUSINESS WIRE
Call for Participation Now Open for the Global Electronics Association’s Advanced Electronic Packaging Conference at APEX EXPO 2027
07/06/2026 | Global Electronics Association
Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
07/02/2026 | Applied Materials
MacDermid Alpha Launches ATROX® CD 560-1: Zero PFAS Alternate Silver Filler Die Attach Paste
06/18/2026 | MacDermid Alpha Electronics Solutions
TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the US
06/16/2026 | BUSINESS WIRE
Applied Materials Expands Singapore Manufacturing to Support AI Chip Demand
06/11/2026 | Applied Materials
Schneider Electric Launches Uniflair XCA Chiller Line for High-Density AI Data Centers
06/09/2026 | Schneider Electric
MKS’ Atotech, ESI to Highlight Integrated PCB and Advanced Packaging Solutions at JPCA 2026
06/08/2026 | MKS’ Atotech
Cadence, Samsung Foundry Deepen 2nm and 3D-IC Collaboration for AI Infrastructure Demand
05/29/2026 | Cadence Design Systems
ASE Launches Automated 310mm Panel-Level Packaging to Accelerate AI Innovation
05/27/2026 | BUSINESS WIRE
Asahi Kasei Develops Photosensitive Polyimide Film for Panel-Level Semiconductor Packaging
05/21/2026 | BUSINESS WIRE
MacDermid Alpha to Address Silver Price Volatility Solutions at ECTC 2026
05/15/2026 | MacDermid Alpha
Intel Foundry Push Gains Momentum With Apple as Potential Customer
05/13/2026 | I-Connect007 Editorial Team
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE Group
SCHMID Launches 'Any Layer ET' for Panel-Level Advances Packaging, to Present at ECTC 2026
04/30/2026 | SCHMID Group
Silicon Box Joins imec Automotive Chiplet Program to Strengthen Next-Gen Vehicle Supply Chains
04/22/2026 | PRNewswire
Koh Young Technology Brings Proven 3D Metrology Expertise to the Advanced Packaging Stage at ECTC 2026
04/21/2026 | Koh Young America
Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS
04/15/2026 | Indium Corporation
Global Electronics Association, MIMOS Berhad Sign MoU to Advance Malaysia’s Electronics and Semiconductor Ecosystem
03/31/2026 | Global Electronics Association
Wolfspeed Launches Next-Gen AI Data Center Packaging with 300mm SiC Technology
03/26/2026 | Wolfspeed
Arm Expands Compute Platform to Silicon Products in Historic Company First
03/26/2026 | Arm Holdings plc
AEM, ASE Enter Strategic Partnership to Accelerate AI and HPC Test Innovation
03/23/2026 | ACN Newswire
Ventec Showcases Glass Free Revolution and Launches Chiplam Portfolio at APEX EXPO 2026.
03/11/2026 | Ventec International Group
APEX EXPO 2026 Show Floor Sells Out – 416 Exhibitors – Largest Manufacturer Lineup in Six Years
03/06/2026 | Global Electronics Association
Kurtz Ersa Goes Semiconductor: Expanding Competence in Microelectronics & Advanced Packaging
03/06/2026 | Kurtz Ersa Corp.
SCHMID Delivers First InfinityLine H+ for Panel-Level Packaging to Leading U.S. Tech Firm
03/05/2026 | SCHMID Group
Semiconductor Ceramic Packaging Market to Reach $2.78B by 2030, Growing at 8.5% CAGR
03/04/2026 | Globe Newswire
SPG Opens New Austin Facility to Expand Engineered Packaging Capabilities and Regional Support
03/04/2026 | BUSINESS WIRE
ACM Research Receives Multiple Advanced Packaging Equipment Orders from Leading Global Customers
03/03/2026 | Globe Newswire
Baya Systems and Aion Silicon Partner to Accelerate Next-Generation SoC and Chiplet Designs
02/24/2026 | BUSINESS WIRE
Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs
02/23/2026 | BUSINESS WIRE
Advanced Electronics Packaging Digest Expands Its Reach With New Substack Presence
02/23/2026 | I-Connect007
The Global Electronics Association and ISC3 Announce Strategic Partnership to Advance Circular and Sustainable Electronics
02/18/2026 | Global Electronics Association
$3.5 Million Award to Advance Power Device and Electronic Module R&D
02/17/2026 | University of Arkansas
Cadence Launches ChipStack AI Super Agent for Next-Gen Chip Design
02/16/2026 | Cadence Design Systems
American Standard Circuits Manufactures IC Substrate Designs Featuring 5–7 Stacked Microvias
02/13/2026 | American Standard Circuits
FICG Highlights Advanced Packaging Integration for Optical Transceivers at APE 2026
02/04/2026 | PRNewswire
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