Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Samsung Electro-Mechanics Signs KRW 360.5 Billion Package Substrate Supply Deal

10/21/2026 | Samsung Electro-Mechanics
Samsung Electro-Mechanics has signed a long-term supply agreement (LTA) worth KRW 360.5 billion for 'Memory Semiconductor Package Substrates' with a global major corporation.

Optimizing the Interconnect with Dr. John T.C. Lee

10/21/2026 | Marcy LaRont, I-Connect007 Magazine
When Dr. John T.C. Lee talks about the evolution of electronics, he keeps coming back to the interconnect. As CEO and President of MKS Inc., he saw growing complexity in the connections between increasingly powerful devices as both a manufacturing challenge and a business opportunity. That thinking helped drive MKS’ acquisition of Atotech in 2022, bringing process chemistry and electroplating together with MKS’ existing strengths in lasers, optics, and precision motion, and giving substance to a strategy the company calls Optimize the Interconnect™.

I-Connect007 Releases New Podcast Episode Exploring the Role of Flexible Circuitry in Consumer Electronics

10/21/2026 | I-Connect007
I-Connect007 is pleased to announce the release of the fourth episode of On the Line With... Qnity: Engineering What’s Next, a six-part podcast series, featuring Bruce Lee, business development and strategy leader, AFT, ICS. In this episode, I-Connect007’s Marcy LaRont explores how advances in flexible circuitry and materials are helping manufacturers meet the growing demands of today's consumer electronics market.

Dymax to Highlight Adhesive and Light-Curing Solutions for Next-Generation Electronics at SMTA International

10/20/2026 | Dymax
Demonstrating technologies that help electronics manufacturers improve reliability, efficiency, and process consistency.

Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough

10/14/2026 | Chandra Gupta -- Column: Below the Surface
In previous columns, I’ve described the ceramic substrate itself, talking about why material choice matters so deeply in electronics, RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, and stability across temperature and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise. But focusing only on the substrate is a bit like judging a city solely by its geology. Bedrock matters, of course.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in