The International Microelectronics Assembly and Packaging Society (IMAPS) will host the 59th International Symposium on Microelectronics (IMAPS Symposium 2026) from September 28 to October 1, 2026, at the Encore Boston Harbor in Everett, Massachusetts.
The Symposium theme, “Intelligent Packaging for the AI Era: Heterogeneous Integration and Photonics,” will bring together industry leaders, researchers, and innovators to explore the latest advancements in microelectronics, advanced packaging, AI, high-performance computing, and photonics.
The event opens on September 28 with Professional Development Courses, a panel discussion on next-generation measurement techniques featuring NIST and industry perspectives, and special student-industry sessions for high school students, parents, faculty, and high school administrators to learn more about careers in microelectronics.
The technical conference, running September 29 through October 1, will feature five technical tracks, 4 keynote presentations from leaders at Qualcomm, Cerebras Systems, IBM, and Marvell Technology, technical papers, poster sessions, networking opportunities, and a panel discussion on Supply Chain Shortages Driven By the Growth In the AI Era, featuring speakers from Toppan, Brewer Science, and AMD.
Attendees will also have access to the sold-out Exhibition Hall on September 29-30, showcasing the latest products, materials, equipment, technologies, and services from across the global microelectronics and advanced packaging supply chain.
Event Details
- Conference: September 28 - October 1, 2026
- Exhibition: September 29 - 30, 2026
- Professional Development Courses: September 28, 2026
- Location: Encore Boston Harbor, 1 Broadway, Everett, MA 02149
Then following the IMAPS Boston Symposium, from October 1-2, the IMAPS Si-Photonics Packaging Summit will commence, at the Encore Boston Harbor Hotel. This summit is dedicated to advancing the state of the art in silicon photonics and co-packaged optics. Bringing together leaders from across the silicon photonics ecosystem, including IDM and fabless companies, foundries and OSATs, EDA and equipment/material suppliers, academia, research institutes, and market research organizations, the summit aims to provide a focused forum for sharing insights, discussing challenges, and fostering collaborations in silicon photonics packaging.
Both the 59th International Symposium on Microelectronics (IMAPS Symposium 2026) and the Si-Photonics Packaging Summit offer premier opportunities to learn about emerging technologies, connect with industry experts, and stay at the forefront of microelectronics packaging innovation.
