Silex Microsystems has entered into a definitive agreement to acquire a 200 mm integrated circuit fab in Pennsylvania, USA, from Semiconductor Components Industries, LLC. The purchase consideration amounts to USD 40 million. The acquisition, which follows the non-binding letter of intent previously disclosed by the Company, marks Silex's entry into U.S. manufacturing and is a key step in the Company's growth strategy. The facility will be converted into a MEMS fab ("Silex U.S. Fab"), with estimated capital expenditure, including the purchase consideration and investments required for conversion into MEMS capacity, expected to amount to approximately SEK 1,600 million, of which SEK 1,000 million between 2026 and 2027 and approximately SEK 200 million per year in 2028 through 2030. The objective is for the facility to reach break-even at EBIT level between 2029 and 2030, and achieve revenue and profitability levels comparable to the 2025 levels of Silex's Swedish 200 mm fab by 2034. Closing is expected around year-end 2027, subject to customary conditions, including approval from the Committee on Foreign Investment in the United States ("CFIUS").
Edvard Kälvesten, CEO and Founder of Silex Microsystems, comments: “We are proud to have moved from words to action in a short period of time and to now take the next step in our growth strategy. By establishing MEMS manufacturing capacity in the United States, we are further strengthening our position as the world’s leading pure-play MEMS foundry. This brings us closer to our U.S. customers, shortens lead times and reduces geopolitical exposure, which has become increasingly important to our customers. We look forward to beginning our expansion in the United States and capturing the growth opportunities it creates.”
Background and rationale
Establishing a U.S. manufacturing footprint is a key part of Silex’s long-term growth strategy. Many of Silex’s largest customers are located in the United States, and local manufacturing capacity enables faster response times, closer customer integration and reduced geopolitical exposure.
Silex’s U.S. expansion strategy is to acquire an existing integrated circuit fab and convert it into a MEMS facility. This approach represents a capital-efficient and lower-risk alternative to establishing local manufacturing capacity through a greenfield project. Leveraging existing infrastructure, equipment, personnel and customer commitments, materially reduces execution risk.
Transaction overview
The acquired integrated circuit fab is a 200 mm wafer fabrication facility located in Mountain Top, Pennsylvania, USA (the "U.S. IC Fab"). The facility comprises approximately 3,000 square metres of existing cleanroom space, with an additional approximately 12,000 square metres available for future expansion. Silex U.S. Fab is expected to have approximately twice the cleanroom space of Silex’s existing facility in Sweden, providing significant headroom for future MEMS production growth.
The acquisition is structured as an asset purchase and includes the production facility, real property, infrastructure and manufacturing equipment. No legal entity is being acquired. The purchase consideration amounts to USD 40 million, of which USD 10 million is payable as deposit at signing, and the remaining USD 30 million is payable at closing. The acquisition has been preceded by customary technical, legal, tax and environmental due diligence.
Closing is subject to customary conditions, including CFIUS clearance. If clearance is not obtained, the transaction may be terminated, in which case the Seller would retain USD 2.5 million of the deposit.
The definitive agreement follows the non-binding letter of intent regarding the U.S. IC Fab disclosed in the Company's prospectus dated 27 April 2026.
Timeline and financial impact
Silex has gained access to the U.S. IC Fab premises in connection with the signing of the definitive agreement and will gain ownership of the assets at closing, which is expected around year-end 2027. Silex will not assume Onsemi’s existing revenue from integrated circuit production.
During 2026 and 2027, Silex intends to progressively establish MEMS operations at Silex U.S. Fab through product qualifications, knowledge transfer and implementation of the Company’s operating model. The establishment includes training of U.S.-based engineers, transfer of operational know-how and process expertise, and adaptation of Silex’s systems, infrastructure and processes to the U.S. facility.
When Silex has gained ownership of the U.S. IC Fab, Silex intends to offer employment to existing employees at the U.S. IC Fab, currently approximately 130 people, and scale up production. The objective is for Silex U.S. Fab to reach break-even at EBIT level between 2029 and 2030, and achieve revenue and profitability levels comparable to the 2025 levels of Silex's Swedish 200 mm fab by 2034.
Investments and financing
The estimated capital expenditure for Silex U.S. Fab, including the purchase consideration for the U.S. IC Fab and the investments required for conversion into MEMS capacity, is expected to amount to approximately SEK 1,600 million, of which approximately SEK 1,000 million between 2026 and 2027 and approximately SEK 200 million per year in 2028 through 2030 based on customer demand. The investments will be financed through a combination of existing cash and funds available under current debt financing agreements.
