Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Summit Interconnect Acquires Mega Circuit, Expanding RF and Microwave Capabilities

11/09/2026 | Summit Interconnect
Acquisition strengthens Summit’s domestic manufacturing network with dedicated expertise in PTFE-based printed circuit boards for defense and commercial applications.

Apple Expands US Manufacturing Partnerships with Qnity for iPhone 18 Pro Camera Technology

10/20/2026 | BUSINESS WIRE
Apple® announced new and expanded partnerships with American companies that are supplying critical materials and components for iPhone Duo® and iPhone 18 Pro.

TP-Link, Key Tronic Plan US Router Assembly

10/19/2026 | BUSINESS WIRE
TP-Link Systems Inc., a global leader in networking and smart home solutions, announced that it has entered into a Letter of Intent (LOI) with Key Tronic Corp., a premier U.S.-based electronics manufacturer, to bring next-generation product assembly to the United States.

American Made Advocacy: While Congress Debates, America’s PCB Competitors Invest Billions

10/20/2026 | Shane Whiteside -- Column: American Made Advocacy
The story of offshoring is all too familiar in the electronics industry. For decades, PCB manufacturing shifted overseas, taking advantage of foreign subsidies, making it difficult for U.S. companies to compete. America once boasted more than 2,000 PCB shops. Today, that number has shrunk to less than 140. This is not simply the marketplace at work. As I have said repeatedly to our elected officials in Washington, American companies are not losing to their foreign competitors; they are losing to foreign governments.

GlobalFoundries Selected to Operate Two New York Fabs Under US-Japan Initiative

10/15/2026 | Globe Newswire
GlobalFoundries announced it has been selected as the technology provider and operator for two new semiconductor manufacturing facilities (fabs) at its Malta, New York, site under a U.S.-Japan initiative providing up to $21 billion in funding.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in