Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets. Once the design moves into fabrication, metallization—particularly the plating of traces to precise specifications—is what enables the intended signal speed and integrity to be realized.

PCB007 Features
Additive Metallization and Signal Integrity by Marcy LaRont
The Consequences of Additive Metallizing on Etching Steps by Don Ball

Rewriting Metallization, One Ink at a Time with Melbs LeMieux, Electroninks

Direct Metallization: A Strategic Enabler for Advanced PCB Manufacturing by Carmichael Gugliotti, MacDermid Alpha

Inkjet Solder Mask: Notion Systems Takes the Mic with Celia Wenzler 

Innovative Flash Copper Plating Technology for Enhanced mSAP Via Reliability, HDI Manufacturing Efficiency, and Advanced Production Control by Andreas Schatz, Mustafa Özkö, MKS Atotech

Articles

The AI Tipping Point: Transforming Global Materials Supply Chains by Marcy LaRont

How New Metals Tariffs Impact the Electronics Industry by James Kim

From Dilution to ZLD: Optimizing Used Process Water Management by Richard Nichols, GreenSource Engineering

UHDI Fundamentals: Manufacturing Readiness and Scaling Flex–Packaging Integration, Part 4 by Anaya Vardya, ASC-Sunstone

Don’t Buy AI, Learn It: A Fabricator’s Guide to Getting Started, Part 1 by Sean Patterson, CrossGen AI

Columns
The Role of Organic Solderability Preservatives (OSP) and Its Role in Advanced Packaging by Mike Carano
Digital Twins: Integrating Design and Manufacturing by Happy Holden

Five Years of Educating, Advocating, and Influencing Legislation and Policy by Shane Whiteside

Design007 Features
How Signals Survive the Hostile PCB Environment by Barry Olney
The Modern Masters of Signal Integrity and AI-driven Design by Kelly Dack 

Common Mode vs. Differential Mode and Signal Integrity by Kristin Moyer
Controlled Impedance—When Connecting the Dots Stops Working by John Watson

Mastering Return Path Discontinuities for Robust Signal Integrity by Stephen Chavez

And More...

Cybersecurity Roundtable with Hiroyuki Watanabe, Ali Pabrai, and Divyash Patel

Rethinking Reinforcement Materials for Advanced Packaging by Ivana Ivanovic, Flexiramics

A Necessary Shift From Gerber to IPC-2581 by Tracy Riggan
Reliability by Design: Aligning Intent With Fabrication Reality with Paul Cooke, Summit Interconnect 

Looking Ahead to Where Integration Actually Happens by Chandra Gupta, Remtec

What Designers Should Know About Non-conductive Via Fill by Matt Stevenson

What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.

PCB007

Features

• Marcy’s Musings: Operating Without a Rulebook by Marcy LaRont
• The Chemical Connection: When the Industry Moves Faster Than the Standards by Don Ball
• Jiva Soluboard Getting the Attention It Deserves with Stephen Driver
• Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional by Michael Carano

Articles

• Standardization, Workforce, and the Road Ahead for Flex–Packaging Integration, Part 3 by Anaya Vardya
• Hall of Fame Spotlight: Karen McConnell by Dan Feinberg
• Is China Plus One Still Happening in the PCB Industry? by Manfred Huschka
• Volatile Metals Market Creates PCB Pricing Headache by Nolan Johnson
• The Journey From Dilution to Zero Liquid Discharge by Richard Nichols

Columns

• The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation by Steve Willliams
• American Made Advocacy: Rebuilding America’s Military Stockpiles Begins with Microelectronics by Shane Whiteside
• Driving Innovation: Selecting the Right Laser Source by Simon Khesin and Stefan Rung

Design007

Feature Articles

• A Designer’s Focus on High Density with Vern Solberg
• Rethinking Stackup, Materials, and Tolerances in Modern Designs by Kristin Moyer
• Designing Without a Rulebook: When Engineering Becomes Innovation by Stephen V. Chavez

Feature Columns

• Target Condition: When Design Outpaces Manufacturing by Kelly Dack
• Elementary, Mr. Watson: DFX—Basically a Bucket of Crabs With Spreadsheets by John Watson

Columns

• The Pulse: Caught in the Crosshatch—A Cautionary Tale of Detective Work by Martyn Gaudion
• Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish by Matt Stevenson

Special Sections

• APEX EXPO Photo Gallery
• Take the Mic!
• Featured Short: Advanced Materials Roundtable with Mark Goodwin, Ed Kelley, and John Fix (Audio)

In the spirit of March Madness, the latest issue of I-Connect007 Magazine tackles a full bracket of topics engineers face on real boards, from AI-powered design tools and cumulative tolerances to copper pours, etch factors, flexible circuits, and solder mask details.

We also explore the bigger forces shaping the industry, including U.S. microelectronics manufacturing efforts, new legislation, and the role of UL certification in ensuring reliability.

You’ll meet Emily Daley, the Student Board Member for the Global Electronics Association, who’s helping represent the next generation of industry leaders, and read about Steve Williams’ career journey through the PCB world. We also look at emerging technologies such as ReRAM and novel copper extraction, along with coverage from DesignCon 2026.

Features

• Marcy’s Musings: Our Own March Madness by Marcy LaRont
• When Layout Learns: This Is Not Your Mother’s Auto-router with Ben Jordan
• Make the Smart Move by Stephen V. Chavez
• Understanding Tolerances in Flexible Circuit Design by Chris Clark, FCT
• ASTER and Siemens: Design for Test Gets ‘Real’ with Michael Alum and Patrick Hope
• Don’t Call It Ground; Call It Return by Kristin Moyer

Articles

• From Classroom to Boardroom: One Year Yields a World of Perspective with Emily Daley
• New, Greener Solutions for Etch: Novel Copper Extraction by Richard Nichols
• Webinar Review: The Challenges of UL Certification for Flex and Rigid-Flex PCBs by Marcy LaRont
• Applications, Challenges, and the Future of Flex–Packaging Integration, Part 2 by Anaya Vardya
• DesignCon 2026: From Copper to Quantum to Agentic AI by Kelly Dack
• The Electronics Foundation with Charlene Gunter and Gentry Manning
• The Power of Apprenticeship with Cory Blaylock and Vicki Hawkins

Columns

• The Chemical Connection: Managing Cumulative Process Variations for Fun and Profit by Don Ball
• Happy’s Tech Talk #47: Automation for Complex Multilayer Fabrication Stackups by Happy Holden
• American Made Advocacy: American Microelectronics Power the Future of High Technology by Shane Whiteside
• Flexible Thinking: Designing Flex Circuits for Dynamic Reliability by Joe Fjelstad
• Connect the Dots: Designing for the Future of Manufacturing Reality—Solder Mask and Legend by Matt Stevenson
• Target Condition: An Exploration of Flooding PCB Layers by Kelly Dack
• Designers Notebook: Heterogeneous Interposer Design Challenge, Part 3 by Vern Solberg
• Beyond Design: ReRAM–The Industry's Next Game-Changer by Barry Olney
• The Right Approach: Reflections on 50 Years in the Business, Part 3 By Steve Williams

This month, I-Connect007 Magazine takes you inside APEX EXPO 2026, highlighting exhibitors and special events on the show floor, insights from the technical conference, updates on apprenticeships and keynotes, and progress in critical standards development. For PCB designers, we go beyond the dreaded auto-router, diving into practical AI-driven design tools that are actually shaping real-world workflows.

Design and fabrication have always been closely connected, but the rising demands for reliability, performance, and cost efficiency now require a closer alignment than ever before. The new I-Connect007 Magazine brings all of the pieces together for a more integrated electronics manufacturing landscape.