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Advanced Electronics Packaging Digest

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GlobalFoundries Selected to Operate Two New York Fabs Under US-Japan Initiative

10/15/2026 | Globe Newswire
GlobalFoundries announced it has been selected as the technology provider and operator for two new semiconductor manufacturing facilities (fabs) at its Malta, New York, site under a U.S.-Japan initiative providing up to $21 billion in funding.

KONGSBERG to Build Polish Plant for Counter-Drone Systems

10/13/2026 | KONGSBERG
Kongsberg Gruppen ASA (KONGSBERG) is establishing a new manufacturing facility for sustainment and manufacturing of Counter-Unmanned Aerial Systems (CUAS) systems in Poland.

Global 300mm Fab Equipment Spending to Reach $227 Billion in 2029 as Buildout Accelerates

10/13/2026 | SEMI
Global 300mm front-end fab equipment spending is projected to reach $149 billion in 2026, up 31% year-over-year, SEMI reported today in its latest 300mm Fab Outlook. Investment is expected to continue growing at double-digit rates through 2029, reaching $227 billion.

Global Electronics Association Names Jason Palmi Chief Financial Officer

10/06/2026 | Global Electronics Association
The Global Electronics Association announced that Jason Palmi has joined the organization as Chief Financial Officer.

EMD Electronics Opens Wisconsin R&D Facility for Semiconductor Materials

10/02/2026 | Globe Newswire
EMD Electronics, the North America electronics business of Merck KGaA, Darmstadt, Germany, announced the opening of a new 38,000-square-foot research and development facility at its Sheboygan Falls, Wisconsin site, expanding the company’s ability to develop and scale advanced materials for next-generation semiconductor manufacturing.
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