Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Top Business Groups Urge Congress to Extend, Expand Successful Semiconductor Tax Credit

05/14/2026 | SIA
The Semiconductor Industry Association (SIA) and a broad coalition of 17 other top business and trade groups in a letter urged Congress to extend the Advanced Manufacturing Investment Credit (AMIC) – a highly impactful tax credit for chip production that is set to expire at the end of this year – and expand it to cover semiconductor design and other critical R&D activities.

Siemens Expands EDA Software Access Through EuroCDP Project

05/14/2026 | Siemens
Siemens has become the first software provider to sign a strategic framework agreement with the European Chips Joint Undertaking (Chips JU) which aims to bolster Europe's semiconductor industry by fostering collaboration between the EU, member states and the private sector, through the European Chips Design Platform (EuroCDP) project.

More Than a Field Trip: Young Students Step into the World of Electronics and Semiconductors

05/13/2026 | Michigan Tech Electronics Hub
The energy is electric at Michigan Technological University as 164 fourth graders from Michigan’s western Upper Peninsula trade their traditional desks for a day of high-tech exploration. The students are here to pilot Stories & Semiconductors, a new educational series. By following the adventures of characters who solve problems through electronics, young students don’t just read about technology; they build it themselves.

FPGA AI Chip Market to Surpass $100M Shipments by 2031 Amid Rapid ASP Decline

05/07/2026 | JPR
Jon Peddie Research (JPR), the market research and consulting firm covering graphics, AI processors, and visual computing, released FPGAs in AI, a new market intelligence report analyzing the emerging class of field-programmable chips designed for AI inference at the edge and in the cloud, and for IoT.

SEMI 3D & Systems Summit to Advance AI, Hybrid Bonding, and Chiplet Ecosystem

05/06/2026 | SEMI
Global experts in advanced semiconductor packaging and 3D integration will convene at the annual SEMI 3D & Systems Summit, June 17–19, 2026, in Dresden, Germany.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in