Custom Interconnect is excited to exhibit at Microelectronics UK 2026 on Stand H60, at ExCeL London on 29 and 30 September.
Now in its second year, Microelectronics UK brings together three conferences covering semiconductors, photonics and embedded systems. The show also works in association with the Department for Science, Innovation and Technology and the Department for Business and Trade, with more than 4,000 attendees and 175 exhibitors expected.
At Stand H60, Custom Interconnect will showcase how its UK-based team supports reliability, supply chain confidence and sovereign capability across microelectronics design, manufacturing and test (OSAT). From two sites in Andover, the company brings together semiconductor packaging, advanced PCBA, power electronics and full product build, giving customers a joined-up route from development, modelling, design, prototyping to finished assemblies.
Visitors will have the opportunity to see a range of packaged and assembled samples, including QFN Plastic Overmold parts and SiC and GaN power modules, and speak directly with the engineers behind the work.
"Microelectronics UK gives us a valuable opportunity to showcase the capabilities we have built in Andover and connect with engineers, OEMs and partners from across the sector. We look forward to showing visitors how our UK team brings packaging, assembly and test together under one quality system. Our numbers speak for themselves, 240 million component placements, 600,000 die attached and 72 million wirebonds performed per annum, makes CIL the UK's largest OSAT provider" - John Boston, Managing Director, Custom Interconnect.
