Remtec Announces the Industry's Most Complete Suite of Plating Capabilities Including PCTF Technology for Advanced Electronic Packaging

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Remtec, a leader in advanced metallized ceramic substrates and electronic packaging solutions, is proud to announce the availability of what is believed to be the industry's most comprehensive portfolio of plating surface finish technologies for thick film ceramic circuits and advanced electronic assemblies.

As electronic devices continue to become smaller, more powerful, and more demanding, engineers require surface finishes that deliver exceptional solderability, wire bondability, reliability, conductivity, and long-term performance. Remtec now offers an unmatched range of precious metal plating options designed to meet the unique requirements of aerospace, defense, medical, telecommunications, RF, power electronics, automotive, and sensor applications.

Built upon Remtec's proven PCTF® technology (Plated Copper Thick Film technology) where thick film silver technology and copper plating combinations provide high thickness pad/interconnects that exceed the capability of traditional thick film processes. This makes it well suited for demanding high-current applications. The company's extensive plating surface finishes portfolio includes Electroless Nickel Immersion Gold (ENIG), Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG), Electrolytic Nickel/Gold (Ni/Au), Electrolytic Gold, Immersion Gold, and numerous Nickel, Palladium, Platinum, Tin, and Gold-Tin finish combinations.

"Our customers often face highly specialized performance requirements that cannot be met with a one-size-fits-all plating solution," said Brian Buyea, President and CEO of Remtec. "By offering a complete range of  plating technologies, we can tailor surface finishes to optimize wire bonding, soldering, die attachment, corrosion resistance, wear resistance, and sensor performance. This flexibility allows our customers to achieve the exact electrical and mechanical characteristics their applications demand."

Among the many options available, ENIG provides an excellent solderable and aluminum wire bondable surface, while ENEPIG serves as a universal finish supporting gold, aluminum, and copper wire bonding. Electrolytic Nickel/Gold delivers superior gold wire bond performance and long-term reliability. Additional precious metal finishes, including palladium and platinum, support highly specialized sensor and high-performance electronic applications.

Remtec's plating capabilities include:

• Electroless Gold
• Electroless Nickel (High and Mid Phosphorus)
• Electroless Palladium
• Electrolytic Copper
• Electrolytic Gold
• Electrolytic Gold-Tin
• Electrolytic Nickel
• Electrolytic Tin
• Electrolytic Palladium
• Electrolytic Platinum
• Immersion Gold

This broad selection enables engineers to optimize substrate performance for applications ranging from high-frequency RF modules and power electronics to hermetic packages, optoelectronics, medical devices, aerospace systems, and next-generation sensor technologies.

With decades of experience in thick film ceramic technology, Direct Bond Copper (DBC), Active Metal Brazed (AMB) substrates, power modules, RF packaging, and advanced assembly services, Remtec continues to invest in manufacturing capabilities that help customers solve increasingly complex design challenges.

"The ability to offer virtually every major plating options under one roof gives our customers greater design freedom, faster development cycles, and a trusted partner capable of supporting both prototype and production requirements," added Buyea. "When engineers need the right finish for mission-critical applications, Remtec has the expertise and technology to deliver it."

For more information about Remtec's range of plating capabilities and advanced ceramic packaging solutions, visit our remtec.com.