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The U.S. advanced semiconductor packaging strategy is beginning to take a more recognizable shape. Recent developments point to three interconnected trends: advanced packaging is moving closer to traditional electronics assembly, high-bandwidth memory (HBM) packaging is becoming part of U.S. industrial policy, and photonics is emerging as another important layer of heterogeneous integration. These trends could strengthen the U.S. position in the global advanced packaging economy. They also illustrate that much of the underlying supply chain remains incomplete.

This is the first in a three-part series exploring scale-up, scale-out, and scale-across in advanced packaging. Scale-up focuses on increasing compute capability, memory capacity, and communication bandwidth within tightly integrated computing systems. Scale-out expands computing capacity by connecting multiple servers, compute nodes, and racks through high-speed networks. Scale-across focuses on integrating and coordinating diverse computing resources, technologies, and workloads across data centers to improve overall efficiency and resource utilization.

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