FEATURED ARTICLES AND COLUMNS:

Twenty microns does not leave much room for error. As advanced packaging increases functional density, the distance between neighboring devices is shrinking to dimensions that create an entirely new set of inspection challenges. In some system-in-package (SiP) applications, components approximately 200 to 300 µm tall can be separated by gaps of only 20 to 30 µm. Measuring those spaces accurately requires considerably more than simply increasing camera magnification. The challenge is optical access.

Advanced packaging is becoming the foundation for semiconductor scaling in the AI era. As monolithic processors encounter practical limits around reticle size, yield, memory bandwidth, power, and cost, the industry is moving toward architectures built from multiple compute dies, HBM stacks, I/O chiplets, and heterogeneous packaging solutions. The result is that semiconductor scaling is no longer determined only by how much functionality can be integrated into a single die, but by how much silicon can be integrated efficiently within a package.

---

---

---

---

---

---

---

---

MORE ARTICLES