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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Dana on Data
Column from: Dana Korf
Currently the principal consultant at Korf Consultancy LLC, Dana Korf works with companies to improve PCB fabricator front-end engineering processes. Dana is senior director of technology for Victory Giant Technology. He also works with OEMs and ODMs to create design rules and technology roadmaps, assist with supplier selection/qualification, and reduce DFM cycles. Dana previously worked in China for over seven years at Multek in Zhuhai as senior director of manufacturing engineering and NPI and at Huawei Technologies in Shenzhen as director of PCB technology where he was responsible for PCB technology ranging from mobile phones to RF antennas, base stations, and high-speed digital servers and switches; before that, he worked for Samina-SCI, HADCO, and Zycon as director of product engineering. He has been awarded the IPC President’s Award, chaired many high-speed IPC committees, and was a co-chair for the iNEMI Data Convergence project, which has become IPC-2581. Dana graduated from Washington State University with a BSEE, and he enjoys following college and professional football and golf.