Barry Olney, In-Circuit Design Pty. Ltd.
Barry focuses on advanced PCB design, signal integrity, and EMC design techniques.
Latest Column: Beyond Design: AI-driven Inverse Stackup Optimization
Matt Stevenson, ASC Sunstone Circuits
Matt Stevenson covers solutions to help your PCB projects succeed.
Latest Column: Connect the Dots: Designing for Reality—Solder Mask and Legend
Dan Beaulieu, DB Management
Dan Beaulieu reviews new and classic books on succeeding in business.
Latest Column: Dan’s Biz Bookshelf: ‘Innovation X: Why a Company’s Toughest Problems Are Its Greatest Advantage’
Dana Korf, Korf Consultancy LLC
Dana's columns focus on IPC-2581 as well as PCB front-end tooling, data quality, DFM processes, etc.
Latest Column: Dana on Data: Merging 2D Electrical, 3D Mechanical Worlds
Patrick Crawford, IPC
Patrick Crawford provides updates on IPC Design activities.
Latest Column: Design Circuit: Green Ambition for the Electronics Manufacturing Industry
Vern Solberg, Consulting
This column will focus on technical issues related to PCB and Flex circuit design, etc.
Latest Column: Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
John Watson, Palomar College
John Watson covers a variety of tips that designers need to know.
Latest Column: Elementary Mr. Watson: How to Reinvent Your Professional Journey
Dan Feinberg, FeinLine Associates, Inc.
End-user technology and special features on end-user high technology products.
Latest Column: Fein-Lines: CES 2025—Highlighting the Future With Sony and NVIDIA
Joe Fjelstad, Verdant Electronics
As author of the Flexible Circuit Technology books, Joe covers everything to do with flexible interconnections in this column.
Latest Column: Flexible Thinking: Another PCB Design Paradigm Shift in the Works
IPC Education Foundation, IPC
IPC Education Foundation updates on programs and activities.
Latest Column: Foundations of the Future: Awarding Scholarships and Awards in 2023
Team NCAB, NCAB Group
A variety of field application engineers from NCAB Group's technical team explore fresh PCB concepts.
Latest Column: Fresh PCB Concepts: PCB Stackup Strategies—Minimizing Crosstalk and EMI for Signal Integrity
Tom Yang, CEE PCB
Tearing down the walls and cultural silos to make the world a better place for PCB manufacturing.
Latest Column: Global Citizenship: The Future of U.S.-China Collaborations
Jerome Larez, CEE PCB
An American field engineer talks technology from the point of view of working for an Asian PCB fabricator selling in North America.
Latest Column: Global PCB Connections: The Future of HDI PCBs
Dan Beaulieu, DB Management
This weekly column is focused on helping electronics companies enhance their professional and technical image through sales and marketing, and, of course, common sense.
Latest Column: It’s Only Common Sense It’s Not the Market’s Fault—Take Responsibility for Your Business
John Mitchell, IPC
John will cover issues affecting the entire global electronics industry supply chain.
Latest Column: One World, One Industry: Mastering Technology Prognostication
Istvan Novak, Samtec
Focusing on signal and power integrity issues related to PCB design and design engineering.
Latest Column: Quiet Power: An Evolution in PCB Design Costs
Anaya Vardya, American Standard Circuits
This column strives to make all facets of printed circuit board technology clear and easy to understand.
Latest Column: Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Kelly Dack, EPTAC Corporation
Kelly’s column pursues the need for stakeholder advocacy in the printed circuit industry head-on, deliberating topics essential for helping one another achieve 100% acceptability in PCB engineering, design, procurement, sales, manufacturing, test and inspection.
Latest Column: Target Condition: Advanced Packaging Technologies—Look Before You Leap
Mehul Davé, Linkage Technologies
Mehul's column explores issues surrounding globalization and the electronics supply chain.
Latest Column: The Big Picture: The Shift From China to Southeast Asia
Chris Mitchell, IPC, Global Government Affairs
In this column, IPC VP of Global Government Affairs Chris Mitchell and his team provide news and views on government policies that affect the electronics industry and its supply chain.
Latest Column: The Government Circuit: How IPC Drove Industry Progress Through Public Policy Advocacy in 2024
Brittany Martin, I-Connect007
Lighting up the industry with marketing ideas that connect, engage, and inspire.
Latest Column: The Marketing Minute: Building Connections in the Electronics Industry
Martyn Gaudion, Polar Instruments
In his column, Martyn discusses signal integrity and impedance design test.
Latest Column: The Pulse: Commonsense Cost Cutting
Andy Shaughnessy, I-Connect007
Andy Shaughnessy discusses topics that are important to the community of PCB designers and design engineers.
Latest Column: The Shaughnessy Report: The Designer of Tomorrow