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March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
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Barry Olney, In-Circuit Design Pty. Ltd.
Barry focuses on advanced PCB design, signal integrity, and EMC design techniques.
Latest Column: Beyond Design: ReRAM–The Industry's Next Game-Changer
Matt Stevenson, ASC Sunstone Circuits
Matt Stevenson covers solutions to help your PCB projects succeed.
Latest Column: Connect the Dots: Designing for the Future of Manufacturing Reality—Strip-Etch-Strip
Dan Beaulieu, DB Management
Dan Beaulieu reviews new and classic books on succeeding in business.
Latest Column: Dan’s Biz Bookshelf: 'Breakneck: China’s Quest to Engineer the Future'
Dana Korf, Victory Giant Technology and Korf Consultancy LLC
Dana's columns focus on IPC-2581 as well as PCB front-end tooling, data quality, DFM processes, etc.
Latest Column: Dana on Data: Best Practices in Interpreting Drawing Notes—‘Use Latest Revision’
Patrick Crawford, Global Electronics Association
Patrick Crawford provides updates on IPC Board Design Standards activities.
Latest Column: Design Circuit: Green Ambition for the Electronics Manufacturing Industry
Vern Solberg, Consulting
This column will focus on technical issues related to PCB and Flex circuit design, etc.
Latest Column: Designers Notebook: Heterogeneous Interposer Design Challenge, Part 3
John Watson, Palomar College
John Watson covers a variety of tips that designers need to know.
Latest Column: Elementary, Mr. Watson: Navigating the Dreaded DFX Triangle
Dan Feinberg, FeinLine Associates, Inc.
End-user technology and special features on end-user high technology products.
Latest Column: Fein-Lines: CES 2025—Highlighting the Future With Sony and NVIDIA
Joe Fjelstad, Verdant Electronics
As author of the Flexible Circuit Technology books, Joe covers everything to do with flexible interconnections in this column.
Latest Column: Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Global Electronics Association Education Foundation, Global Electronics Association
IPC Education Foundation updates on programs and activities.
Latest Column: Foundations of the Future: Awarding Scholarships and Awards in 2023
Team NCAB, NCAB Group
A variety of field application engineers from NCAB Group's technical team explore fresh PCB concepts.
Latest Column: Fresh PCB Concepts: Dynamic Solder Mask Compensation in PCBs
Tom Yang, CEE PCB
Tearing down the walls and cultural silos to make the world a better place for PCB manufacturing.
Latest Column: Global Citizenship: Together for a Perfect PCB Solution
Markus Voeltz, CEE PCB
Markus is known for his expertise in business development and strategic sales, focusing on providing innovative and reliable solutions to customers in various industries.
Latest Column: Global PCB Connections: Understanding Your Fabricator’s Capabilities (or Niche)
Dan Beaulieu, DB Management
This weekly column is focused on helping electronics companies enhance their professional and technical image through sales and marketing, and, of course, common sense.
Latest Column: It’s Only Common Sense: Speed Is a Strategy that Wins Customers
John Mitchell, Global Electronics Association
John will cover issues affecting the entire global electronics industry supply chain.
Latest Column: One World, One Industry: Attending APEX EXPO 2026 Critical for Electronics Manufacturing Leaders
Brian Buyea, Remtec Inc.
Brian explores the technologies in material science that make high-power electronics possible.
Latest Column: Powering the Future: How Packaging Choices Make or Break Performance
Istvan Novak, Samtec
Focusing on signal and power integrity issues related to PCB design and design engineering.
Latest Column: Quiet Power: An Evolution in PCB Design Costs
Anaya Vardya, American Standard Circuits
This column strives to make all facets of printed circuit board technology clear and easy to understand.
Latest Column: Standard of Excellence: The Supply Chain Test—Excellence Under Pressure
Kelly Dack, Pioneer Circuits Inc.
Kelly’s column pursues the need for stakeholder advocacy in the printed circuit industry head-on, deliberating topics essential for helping one another achieve 100% acceptability in PCB engineering, design, procurement, sales, manufacturing, test and inspection.
Latest Column: Target Condition: Adaptation Is the New AI Advantage
Mehul Davé, Linkage Technologies
Mehul's column explores issues surrounding globalization and the electronics supply chain.
Latest Column: The Big Picture: Our Big ‘Why’ in the Age of AI
Chris Mitchell, Global Electronics Association
In this column, Global Electronics Association VP of Global Government Affairs Chris Mitchell and his team provide news and views on government policies that affect the electronics industry and its supply chain.
Latest Column: The Government Circuit: USMCA Review—A Crucial Opportunity to Fortify North American Electronics
Brittany Martin, I-Connect007
Lighting up the industry with marketing ideas that connect, engage, and inspire.
Latest Column: The Marketing Minute: Your Marketing Funnel Has a Memory Problem
Martyn Gaudion, Polar Instruments
In his column, Martyn discusses signal integrity and impedance design test.
Latest Column: The Pulse: Ultra-high Stakes—Will UHDI Enter the Mainstream for Low- and Mid-volume?