Will Your Vias Survive the Heat? New Book From I-Connect007 Has the Answers
I-Connect007 is excited to announce the release of The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability,...
ESD Alliance Names Two Executives to Governing Council, Adds Companies to Member Roster
The Electronic System Design Alliance (ESDA), a SEMI Technology Coalition, appointed Ankur Gupta, Executive Vice President, IC Portfolio, Siemens...
Siemens, ASU Launch PCB Design Microcredential
Siemens, in collaboration with Arizona State University (ASU) has announced a new online microcredential program in printed circuit board (PCB) design - ‘PCB Design Fundamentals: From Discovery to Production’ - offering...
Cadence Reports Q2 2026 Financial Results
Revenue of $1.584 billion, compared to revenue of $1.275 billion in Q2...
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
July 31, 2026 | Michelle Te, I-Connect007
When I first came to the electronics industry, I was coming from the outside. Over time, I learned that this is not an industry that can be understood from just one angle. What happens in design affects manufacturing. Material choices affect reliability. Supply chain decisions influence business strategy, and advances in technology create new challenges and opportunities throughout the entire ecosystem. That complexity is one of the things I appreciate most about covering this industry. Each week, I’m reminded that there is always another layer to explore.
Connect the Dots: Total Value Manufacturing Solutions
July 30, 2026 | Matt Stevenson, Connect the Dots
In my last column, I discussed total value management, an approach to the quality-versus-cost balancing act that integrates components of total quality management (TQM) and Lean manufacturing. Like those other methodologies, total value management prizes customer focus, continuous improvement, and employee empowerment.
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Fresh PCB Concepts: IPC-6012 Class 3 and High-reliability PCB Manufacturing
July 23, 2026 | Team NCAB, Fresh PCB Concepts
IPC-6012 Class 3 is widely recognized as the benchmark for high-reliability manufacturing. Compared to Class 2, it establishes tighter requirements for plated holes, annular rings, copper wrap, conductor integrity, and inspection...
Elementary, Mr. Watson: The Display Revolution, Now With Fewer Tiny Keys
July 23, 2026 | John Watson, Elementary, Mr. Watson
From the earliest days of electronics, engineers have worked within some shared assumptions about how systems should be built and how people should interact with them. These assumptions often feel so natural that they are rarely...
Beyond Design: Skip-layer Routing—The Waveguide Structure That Makes 224G Possible
July 9, 2026 | Barry Olney, Beyond Design
As data rates climb from 112G PAM4 toward 224G PAM4 and beyond, electronics designers are discovering that traditional stripline and microstrip geometries are no longer sufficient. The physics simply break. Rise times are now in the...
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