Beyond Design: Demystifying Common‑Mode Radiation
DesignCon Taps NASA, Purdue, and Agentrys for Keynote Slate
DesignCon, the premiere event for the latest in high-speed design tools, technologies, and developments, has announced the keynote speakers for the...
APEX EXPO 2026, Flagship Event for the Global Electronics Association, Showcases the Future of Advanced Electronic Packaging
First APEX EXPO following IPC’s transition to the Global Electronics Association features expanded technical program, industry-leading keynotes,...
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Elementary, Mr. Watson: Why You Can’t Afford to Miss APEX EXPO 2026
February 26, 2026 | John Watson, Elementary, Mr. Watson
APEX EXPO is one of those rare events where the whole industry comes together in one place: design, fabrication, assembly, materials, reliability, equipment, and standards. It’s where some of the most respected voices in the industry take the stage: researchers, practitioners, and thought leaders who are shaping what comes next. Between the technical sessions and keynote presentations, attendees are gaining insight directly from the people driving innovation and setting direction across the electronics ecosystem.
DesignCon 2026: From Copper to Quantum to Agentic AI
February 26, 2026 | Kelly Dack, I-Connect007
Greetings from “balmy” Santa Clara, where DesignCon 2026 is officially underway. The conference began in 1995 as Design SuperCon, and now in its 31st year, remains Silicon Valley’s annual summit for signal and power integrity pros. As I walked into the hotel next to the Santa Clara Convention Center, I could sense echoes of the thousands of football fans who packed the area just weeks ago for the Super Bowl. For me, though, DesignCon is the big game, where our industry’s MVPs take the field to show how fast the technology playbook is evolving.
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Connect the Dots: The Future of Designing for Reality—Pattern Plating
February 5, 2026 | Matt Stevenson, Connect the Dots
Last month, I discussed the outer-layer imaging process and offered tips for designers to help ensure smooth manufacturing and high-quality output. The next step in the manufacturing process is copper pattern plating, where...
Beyond the Board: The Benefits of Early PCB Engagement in Aerospace and Defense Programs
February 3, 2026 | Jesse Vaughan, Beyond the Board
Aerospace and defense programs don’t operate on commercial timelines. Once a platform is qualified, it may remain in production, sustainment, or upgrade cycles for decades. Yet many of the most consequential decisions affecting that...
Elementary Mr. Watson: Where the PCB Ends and Advanced Packaging Begins
January 29, 2026 | John Watson, Elementary, Mr. Watson
Change sits at the center of almost everything in PCB design. From the earliest days of printed circuits to today’s highly integrated electronic systems, stability does not define this discipline; evolution does. Materials change,...
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