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March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
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Cadence Recognized as a Platinum Employer on the Where You Work Matters List
We're proud to be named a 2026 Platinum Employer on the Where You Work Matters List. This recognition reflects our commitment to building...
Companion Guide to Popular UHDI Podcast Series Now Available for Download
The companion guide to On the Line With…American Standard Circuits: Ultra High Density Interconnect (UHDI) explores how UHDI is reshaping PCB...
Siemens Launches Fuse EDA AI Agent for Chip and PCB Workflows
Siemens announced the Fuse™ EDA AI Agent system, a purpose-built domain-scoped autonomous AI agent that plans and orchestrates multi-tool and...
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Educational Highlights From the APEX EXPO 2026 Show Floor
March 27, 2026 | Kimberly Kutnick, Global Electronics Association
APEX EXPO 2026 featured many legacy treasures, but it was the inaugural year for the Technology Pavilion, which featured 10 speakers over two days. It was just one feature on the show floor that specifically highlighted technical learning and innovation. Topics presented at the Technology Pavilion included copper nanoparticle inkjet printing on rigid PCBs, how AI and collaboration can level up an electronics supply chain, accelerating the design-to-manufacturing flow, and automated spatial micro-sectioning.
Elementary, Mr. Watson: Navigating the Dreaded DFX Triangle
March 26, 2026 | John Watson, Elementary, Mr. Watson
After being in both industry and academia for more years than I’d like to say (before tape and Mylar, it felt like rock slabs and chisels), I’ve noticed a belief that PCB design is a linear process. Even experienced PCB designers assume you just begin with requirements, move to schematic capture and layout, and create the documentation package. Now their job is done, right? They throw it over the fence, and “magically” the finished PCB ends up on their desks a few weeks later.
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Designers Notebook: Heterogeneous Interposer Design Challenge, Part 3
March 16, 2026 | Vern Solberg, Designer's Notebook
In just about any industry, time-to-market will establish the difference between the leaders and followers. Any new electronic product introduced into the market must meet or exceed stated performance criteria and provide reliable...
Elementary, Mr. Watson: APEX EXPO—The Ghosts of Past, Present, and Future
March 5, 2026 | John Watson, Elementary, Mr. Watson
On the eve of APEX EXPO 2026, the Anaheim Convention Center in California rests in a rare and fragile quiet. The lights are dimmed, the escalators are still, and the long corridors echo with only the distant sounds of crews finishing...
Beyond Design: Demystifying Common‑Mode Radiation
February 24, 2026 | Barry Olney, Beyond Design
Common-mode radiation is a major contributor to unwanted electromagnetic interference (EMI). It arises when equal-phase currents flow on conductors without an opposing return current to cancel their fields. The resulting imbalance...
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- When Layout Learns: This Is Not Your Mother’s Auto-router with Ben Jordan
- Make the Smart Move by Stephen V. Chavez
- Understanding Tolerances in Flexible Circuit Design by Chris Clark, FCT
- ASTER and Siemens: Design for Test Gets ‘Real’ with Michael Alum and Patrick Hope
- Don’t Call It Ground; Call It Return by Kristin Moyer