Fresh PCB Concepts: Don't Let Over-specification Come Back to Haunt You
Breaking News: I-Connect007 Releases New Guide Expanding on Qnity’s Engineering What’s Next Podcast Series
I-Connect007 is pleased to announce the release of The Companion Guide to... Engineering What’s Next, an On the Line with... podcast series, a new...
Cadence Unveils Maestro AI Model Portfolio to Advance Agentic Chip and System Design
Cadence announced the Maestro™ AI Model Portfolio, which powers Cadence® AI Super Agents across semiconductor and system design...
Cadence InnoStack AI Agent Supports Socionext’s 3nm SoC Design
Socionext Inc., a global leader in custom SoC design and development, is actively advancing its SoC design and development capabilities through...
The Supplier’s Job Has Changed: Turning PCB Supply Chain Uncertainty into Action
October 26, 2026 | Dan Thau, Millennium Circuits Limited
Information about what's happening in the PCB supply chain is abundant. Customers know materials are constrained and that lead times can change quickly. They know tariffs, geopolitical uncertainty, shifting manufacturing capacity, and growing demand from emerging technologies are creating pressure throughout the electronics supply chain. Another market update won’t solve their problem. What customers need is someone who can tell them what it all means for their program, and what they should do about it. I believe that's where the role of PCB suppliers is changing.
3 Key Takeaways: Understanding the Promise and Practical Limits of ELIC
October 26, 2026 | I-Connect007
As semiconductor packages become smaller and more complex, PCB designers face increasing pressure to accommodate higher interconnect densities within tighter space constraints. Every layer interconnect (ELIC) technology offers a way to overcome some of the limitations of traditional HDI construction, but achieving greater density introduces new challenges in fabrication, reliability, and cost. In his white paper, ELIC: Every Layer Interconnect—The Promise, the Pain, and the Practical Limits, ASC President and CEO Anaya Vardya examines the advantages of ELIC architecture, the manufacturing challenges that accompany it, and the design decisions that determine whether a board can be produced reliably at scale.
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Elementary, Mr. Watson: Waking Up Europe's PCB Giants
September 30, 2026 | John Watson, Elementary, Mr. Watson
When I wrote "The Rise and Fall of Europe’s PCB Design Community,” for the September issue of I-Connect007 Magazine, I wasn't suggesting Europe had suddenly solved its PCB problems; far from it. The region still faces high costs,...
Connect the Dots: Getting the PCB Quote Right
September 30, 2026 | Matt Stevenson, Connect the Dots
Once the PCB design moves from the designer’s hands to the fabricator, the quote process becomes much more than a matter of price. It’s where we determine what it will take to build your board successfully, from materials and...
Powering the Future: What Engineers Get Wrong About Designing for Reliability
October 7, 2026 | Brian Buyea, Powering the Future
One question I hear more than almost any other is: How do I design electronics for high reliability? It’s a fair question. In industries like aerospace, defense, EV, and industrial power, reliability isn’t a feature; it’s the...
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