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Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024
Electronic System Design (ESD) industry revenue increased 8.8% to $5,114.5 million in the third quarter of 2024 from the $4,702.4 million registered...
Welcome to the Newest I-Connect007 Columnist Brittany Martin
In today’s fast-paced world of electronics marketing, staying ahead of the curve requires creativity, strategy, and a deep understanding of...
January 2025 Issue of Design007 Magazine: The Designer of the Future
As we enter the new year, it’s a great time to be a PCB designer. The job is more complex than ever, and a lot of fun too. We can only wonder what...
IPC Announces New Training Course: PCB Design for Manufacturability
This three-week online program, taught by an industry expert with over 40 years of experience, is designed to equip PCB designers with the knowledge...
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See You in Vienna: Speaker Spotlight on PEDC
January 16, 2025 | I-Connect007 Editorial Team
Vienna, Austria, is known for its amazing architecture, art museums, and classical music scene. But from now on, Vienna might also be known for its PCB design conference. IPC and FED have partnered to create a new PCB design conference in there. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30, 2025 at the NH Danube City hotel in Vienna.
The Marketing Minute: Building Connections in the Electronics Industry
January 16, 2025 | Brittany Martin, The Marketing Minute
Welcome to the first edition of The Marketing Minute. As someone deeply immersed in the electronics industry, I’ve seen how this field is not just about circuits and semiconductors; it’s about connections—between components, ideas, and people. Marketing in this niche requires the same principles: building authentic and powerful connections.
MORE ARTICLES
Connect the Dots: Designing for Reality—Solder Mask and Legend
January 2, 2025 | Matt Stevenson, Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we discussed the strip, etch, and strip process. At this point, we have a functioning board, but we still need to protect the PCB from environmental effects and...
Target Condition: Advanced Packaging Technologies—Look Before You Leap
January 2, 2025 | Kelly Dack, Target Condition
Every so often, I’m disappointed by a high expectation that didn’t work out. Some of these disappointments in the PCB design and manufacturing industry have been related to “new and advanced” PCB design products or services...
Beyond Design: AI-driven Inverse Stackup Optimization
December 26, 2024 | Barry Olney, Beyond Design
Artificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's...
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- PCB Designers of the Future—and Their Software Tools, with David Wiens
- Dan Beeker on the Design Engineer of the Future
- The PCB Designer of the Future: Blending Innovation, Technology, and Sustainability, by Stephen Chavez
- An Inspiring Journey From Animation to PCB Design, with Melissa Martinez
- EDA Tools and the Designer of the Future, with Bob Potock
- Addressing Future Challenges for Designers, by Vern Solberg