Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
The EEcosystem and Dr. Eric Bogatin Launch Free Masterclass for Electronics Engineers
The EEcosystem, a podcast media and education brand serving professional electronics engineers, is proud to announce the launch of a new online...
Explore Thermal Management Solutions in Latest Podcast Series—New Episode Now Available
I-Connect007 is excited to share the latest episode in our new podcast series! In this episode, Ryan returns to discuss practical strategies for...
Cadence Reports Q1 2025 Financial Results
Quarter-end backlog was $6.4 billion and current remaining performance obligations ("cRPO"), contract revenue expected to be recognized as revenue in the next 12 months, was $3.2...
Electronic System Design Industry Posts $4.9 Billion in Revenue in Q4 2024
Electronic System Design (ESD) industry revenue increased 11% to $4.9 billion in the fourth quarter of 2024 from the $4.4 billion reported in the...
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
May 2, 2025 | Marcy LaRont, PCB007 Magazine
In our industry, this week’s must-read features include CEE’s Tom Yang and his perspective on having a global business amidst tariff talk and other challenges. Joe Fjelstadt talks to the “Flexperts,” Nick Koop of TTM and Mark Finstead of Flexible Circuit Technologies. Nolan Johnson interviews the McGucken Group about the importance of empathic leadership in BANI times. NCAB’s Ryan Miller writes about reliability and compliance for building PCBs for medical applications, and surprise, more news from Siemens.
Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
May 1, 2025 | Team NCAB, Fresh PCB Concepts
As a field application engineer with many years of experience, I’ve conducted thousands of designs for manufacturing (DFM) analyses on printed circuit boards (PCBs). From basic one-layer boards to complex high density interconnect (HDI) designs, I’ve provided technical advice across a wide spectrum of technologies.
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Designers Notebook: Layer Stackup Planning for RF Circuit Boards
April 17, 2025 | Vern Solberg, Designer's Notebook
When designing multiple layer circuits requiring impedance control, the circuit board designer will work closely with an engineering specialist cognizant of RF printed circuit board design and layout, including mixed-signal...
The Shaughnessy Report: Always With the Negative Waves
April 9, 2025 | Andy Shaughnessy, The Shaughnessy Report
When I started covering PCB design in the ‘90s, RF designers comprised a small percentage of the design community. Other than cellphones and handheld GPS devices, RF wasn’t seen very often outside of military, aerospace, and law...
Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch
March 27, 2025 | Jerome Larez, Global PCB Connections
As a field application engineer for a major Chinese PCB company, I see firsthand the challenges and, more excitingly, the trends shaping our industry. Talking to engineers, designers, and procurement teams worldwide, one thing is...
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