-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Old School vs. New School
The rules are changing. Explore the technologies, design strategies, and manufacturing innovations challenging conventional wisdom while revealing which fundamentals remain critical to success.
Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Murata, Synopsys Team Up on Ansys Simulation Models
Murata Manufacturing Co., Ltd. announces a new collaboration with Synopsys, Inc., enabling users of Synopsys' simulation tools to navigate directly...
Flexible Circuit Technologies Expands Global Manufacturing Footprint with Thailand Operations
Flexible Circuit Technologies (FCT), a leading global provider of flexible circuit design, advanced interconnect solutions, and electronics...
Altium Education Celebrates First Mayan-on-Chip Cohort in Yucatán
Altium, a global leader in software and solutions for the electronics industry, announced the successful completion of the first Mayan-on-Chip cohort...
Click Here for More News
Send your news item to: news@iconnect007.com
Click here for press release tips
Target Condition: Signal Integrity Without Borders
June 24, 2026 | Kelly Dack, Target Condition
I started my PCB design career in 1980, long before “signal integrity” became a formal discipline. Back then, we were trying to “connect the dots” on simple, two-sided PCB layouts using the new $80,000 interactive graphics terminals we called a CAD system. By the time PCB design conferences emerged in the 1990s, signal integrity had begun to formalize into a discipline of its own. Much of the early, visible thought leadership came from North America and parts of Europe.
One Design, Many Minds: From Concurrent to Co-design
June 23, 2026 | Marcy LaRont, I-Connect007 Magazine
For decades, hardware development has often looked like a relay race: Work is handed from the mechanical team to the electrical team to the RF team, and eventually back again, hopefully without too many expensive surprises waiting at the finish line. But as products become smaller, faster, smarter, and far more complex, that old-school “over-the-wall” workflow is starting to show its cracks.
MORE ARTICLES
Elementary, Mr. Watson: PCB Education in the Midst of the Storms
June 17, 2026 | John Watson, Elementary, Mr. Watson
I should probably begin with an apology, because this may be a tough pill to swallow and not the small vitamin kind. This is one of those honking, huge pills that could choke a mule. My goal is not to criticize students, dismiss...
Beyond Design: How Signals Survive the Hostile PCB Environment
June 3, 2026 | Barry Olney, Beyond Design
Modern digital signals exhibit behavior more characteristic of RF waveforms than the slow logic transitions of the past. With fast rise times, a PCB is no longer a collection of copper traces, but a distributed electromagnetic system....
Connect the Dots: What Designers Should Know About Non-conductive Via Fill
May 28, 2026 | Matt Stevenson, Connect the Dots
The rapid advance of technology is driving changes in electronics that require increasingly smaller boards capable of handling higher signal speeds and supporting more robust software applications. Manufacturers are increasingly...
Are you missing out?
Customize your section here.
Edit List Settings
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
- Every Layer Interconnect — The Promise, the Pain, and the Practical Limits by Anaya Vardya
- Base Material Properties and Microvia Reliability by Ed Kelley
- Building Better HDI Boards: Driving Quality Through Lamination with Ralph Jacobo
- One Design, Many Minds: From Concurrent to Co-design with Kristin Moyer
- Elementary, Mr. Watson: Builders of the Dream by John Watson
- The PCB Designer's Blind Spot: No Feedback, No Progress by Stephan Schmidt