Global PCB Connections: Understanding Your Fabricator’s Capabilities (or Niche)
NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
The Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center,...
Cadence Giving Foundation Announces Multi-Year Commitment to Expand the AI Hub at San José State University
The Cadence Giving Foundation today announced a multi-year commitment to expand the AI Hub at San José State University (SJSU) to equip students...
Electronics U Expands Global Workforce Training for the Electronics Industry
The Global Electronics Association unveiled Electronics U, the new name and expanded vision for its workforce training and certification...
Click Here for More News
We search high and low to find the best news for you, our valuable readers…
If you have news you would like to publish here please send your news item to: news@iconnect007.com
Click here for press release tips
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
October 10, 2025 | Nolan Johnson, I-Connect007
I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
October 9, 2025 | I-Connect007
I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
MORE ARTICLES
The Shaughnessy Report: Watt About Power Integrity?
October 8, 2025 | Andy Shaughnessy, The Shaughnessy Report
Yes, that headline is the equivalent of a dad joke, but editors can’t pass up a chance to inject a little humor into a headline, and I had to take my shot. Power integrity (PI) problems are no joke. Current power demands are...
Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
October 1, 2025 | John Watson, Elementary, Mr. Watson
For the September 2025 issue of Design007 Magazine on signal integrity, I explored how the PCB is similar to a military obstacle course: walls that sap energy like impedance mismatches, barbed wire that cuts like crosstalk, and mud...
Target Condition: Rethinking the PCB Stackup Recipe
October 1, 2025 | Kelly Dack, Target Condition
Marie Antoinette is attributed with saying, “Let them eat cake,” but historians now agree she likely never said it. It was probably revolutionary propaganda to paint her as out of touch with the starving masses. Yet, the phrase...
Are you missing out?
Customize your section here.
Edit List Settings
