Beyond Design: How Signals Survive the Hostile PCB Environment
Altium Education Celebrates First Mayan-on-Chip Cohort in Yucatán
Altium, a global leader in software and solutions for the electronics industry, announced the successful completion of the first Mayan-on-Chip cohort...
Cadence, Samsung Foundry Deepen 2nm and 3D-IC Collaboration for AI Infrastructure Demand
Cadence and Samsung Foundry announced development of a full portfolio of Memory and Interface IP, and expanded certification of Cadence’s agentic...
Valeo, Zuken Join Forces to Redefine Automotive Electronic Design
Valeo, a global leader in mobility technologies, and Zuken, a pioneer in Electronic Design Automation (EDA) software, announce a major strategic...
Synopsys Posts Financial Results for Q2 Fiscal Year 2026
Synopsys, Inc. reported results for its second quarter of fiscal year 2026. Revenue for the second quarter of fiscal year 2026 was $2.276 billion,...
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BOOK EXCERPT: The Printed Circuit Assembler’s Guide to...Design for Test, A Practical Guide to Test and Inspection, Chapter 1
June 4, 2026 | I-Connect007
Over the last two to three decades, the electronics industry has experienced a significant transformation. Circuit card assembly (CCA) and printed circuit board (PCB) design have become highly automated and digitized, allowing for faster development and increased design reuse. Engineers can now easily build on existing, proven architectures. Despite these advancements, one key area often falls behind: test and inspection.
Manufacturing Readiness and Scaling Flex–Packaging Integration, Part 4
June 4, 2026 | Anaya Vardya, American Standard Circuits
Parts 1–3 of this series examined the technical foundations, application landscape, and strategic imperatives surrounding the convergence of flexible PCBs and advanced semiconductor packaging. Part 4 turns to the factory floor: What must change in manufacturing processes, equipment, and quality systems to bring this convergence from prototype to production scale?
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Target Condition: The Modern Masters of Signal Integrity and AI-driven Design
May 21, 2026 | Kelly Dack, Target Condition
Signal integrity (SI) in PCB design has moved from a niche engineering concern to the defining factor in whether modern electronics succeed or fail. As data rates push beyond PAM4 (4-level 112G) gigabit territory and SerDes components...
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
May 7, 2026 | Matt Stevenson, Connect the Dots
When designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality....
The Pulse: Caught in the Crosshatch—A Cautionary Tale of Detective Work
April 29, 2026 | Martyn Gaudion, The Pulse
A chance meeting at a family wedding the other week led to a conversation about numbers, an introduction to a book entitled Humble Pi, and how numeric misinterpretation can lead to all kinds of unexpected outcomes, some just costly,...
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