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Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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Finding and Training the Designers of Tomorrow: Design007 Magazine, February 2025
02/10/2025 | I-Connect007 Editorial Team
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Welcome to the Newest I-Connect007 Columnist Brittany Martin
01/14/2025 | I-Connect007 Editorial Team
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January 2025 Issue of Design007 Magazine: The Designer of the Future
01/13/2025 | I-Connect007 Editorial Team
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American Standard Circuits' John Johnson to Speak at Ultra HDI Symposium
01/06/2025 | American Standard Circuits
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The Companion Guide to 'Designing for Reality' by Matt Stevenson Now Available
12/19/2024 | I-Connect007
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I-Connect007 Releases New Episode of Meet the Author Podcast: Spotlight on Complex PCB Design
12/10/2024 | I-Connect007
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Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
12/09/2024 | I-Connect007 Editorial Team
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PCB Designers: Enhance Your Listening Experience With New Companion Download to the DFR Podcast Series
11/11/2024 | I-Connect007
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Keysight Collaborates with Siemens EDA to Enable the Next Generation of Wireless Design
10/23/2024 | Keysight Technologies
Pulsonix Version 13 Extends MCAD Integration with the IDX Collaboration Interface
10/11/2024 | Pulsonix
Department of Defense Awards $30 Million to Expand Domestic Printed Circuit Board and Substrate Production
10/01/2024 | U.S. Department of Defense
EMA Webinar: Maximize Your Design Productivity in OrCAD X and Allegro X
09/26/2024 | EMA Design Automation
ASC Sunstone Circuits to Present Lunch and Learn and Exhibit at PCB West 2024
09/24/2024 | ASC Sunstone
Routing, Final Fab, and QC: Don’t Miss the Final Episode of On the Line With… Designing for Reality
09/23/2024 | I-Connect007
EDA Market to Grow $8.7 Billion (2024-2028) with AI's Rising Impact on Trends
09/19/2024 | PRNewswire
ASC Sunstone Circuits to Exhibit at the Anaheim Electronics & Manufacturing Show (AEMS) 2024
09/16/2024 | ASC Sunstone
Surface Finish: Tune in to the Latest Podcast Episode of On the Line with… ASC Sunstone
09/04/2024 | I-Connect007
Cadence Launches Fem.AI, Pledges $20M to Kickstart Gender Equity in the AI Workforce
08/23/2024 | Cadence Design Systems
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