This month, we asked our expert contributors to address these questions: Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What disciplines will the designers of the future need to understand and master to deal with tomorrow’s technology?

Features

• Back to the Future by Andy Shaughnessy
• Here’s Looking at You, Kid with Kris Moyer and John Watson
• One Designer's Journey With IPC Apprenticeships, by Cory Blaylock
• How to Discover and Equip the Next Generation of Talent, by Stephen Chavez
• ‘Boomer to Zoomer: Do You Copy?’ by Kelly Dack
• Recruiting the Next Generation of PCB Designers at Garmin with Laura Beth Yates
• Finding and Training the Next Design Engineers with Bill Hargin

Extras

• UHDI Fundamentals: UHDI Advances Neurotechnology, by Anaya Vardya
• Imagine the Possibilities: Tech Conference 2025 with Stan Rak and Udo Welzel
• Designing for Reality: Routing, Final Fab, and QC, by Matt Stevenson
• Flexible Circuit Technology: Looking Back and Forward, by Joe Fjelstad

As we enter the new year, it’s a great time to be a PCB designer. The job is more complex than ever, and a lot of fun too. We can only wonder what the PCB designers of 1975 would think about the typical PCB designer’s workday. What will the designers' job be like in the future?

This month, our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.

Features 

• The Designer of Tomorrow, by Andy Shaughnessy
• PCB Designers of the Future—and Their Software Tools, with David Wiens
• Dan Beeker on the Design Engineer of the Future
• The PCB Designer of the Future: Blending Innovation, Technology, and Sustainability, by Stephen Chavez
• An Inspiring Journey From Animation to PCB Design, with Melissa Martinez
• Electro-optical Circuit Boards, by Barry Olney
• Ultra Upgrade Unknowns: What’s Coming for UHDI? by Martyn Gaudion
• EDA Tools and the Designer of the Future, with Bob Potock
• Addressing Future Challenges for Designers, by Vern Solberg
• Mind-tapping Into the Future, by Joe Fjelstad

More...

• UHDI Fundamentals: UHDI Bleeding-edge Entertainment Applications, Part 2, by Anaya Vardya
• See You in Vienna: Speaker Spotlight on PEDC
• Designing for Reality: Surface Finish, by Matt Stevenson

This month, expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI. We learn that with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.

Features

• A Stack of Advanced Packaging Info, by Andy Shaughnessy
• Effects of Advanced Packaging on Stackup Design, with Kris Moyer
• Are Our Rules No Longer Valid? by Cherie Litson
• AI-driven Inverse Stackup Optimization, by Barry Olney
• Advanced Packaging Technologies: Look Before You Leap, by Kelly Dack
• Advanced Semiconductor Packaging Impact on PCB Stackup, by Vern Solberg

Columns

• Designing for Reality: Solder Mask and Legend, by Matt Stevenson
• Another PCB Design Paradigm Shift in the Works, by Joe Fjelstad

Articles

• IPC, FED Partner for New Design Conference in Vienna, with Peter Tranitz
• UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 2, by Anaya Vardya

This month, we delve into rules of thumb—which ones work, which ones should be avoided, and when it’s time to “do the science.” As our contributors point out, rules of thumb are a great place to start—a default position—but designers should have a good understanding of the mechanics that these rules are built upon.

Features

• A Handy Look at Rules of Thumb, by Andy Shaughnessy
• Rules of Thumb: A Primer, with Kris Moyer and Kelly Dack
• Rules of Thumb for PCB Layout, by Scott Miller
• High-speed Rules of Thumb, by Barry Olney
• PCB Layout Rules of Thumb for Consideration, by Patrick Davis
• Rules of Thumb: A Word to the Wise, by Joe Fjelstad
• Rules of Thumb: Guidelines vs. Principles for PCB Design, by John Watson
• If You Can Define It Right, You Can Design It Right, with Chris Young

Columns and Articles

• Designing for Reality: Strip-Etch-Strip, by Matt Stevenson
• UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 2, by Anaya Vardya
• From Construction Work to PCB Design in Under a Year, with Jon Smith

Partial HDI refers to the targeted use of HDI, usually on one section of one layer of the board. It offers designers an avenue for escape routing from BGAs with a pitch of .5 mm or less, when a mechanically drilled plated through-hole is impossible. With HDI relegated to one layer of the board, fabricators can avoid the expense of sequential lamination cycles. This month, our expert contributors provide a complete, detailed view of partial HDI. Most experienced PCB designers can start using this approach right away. But you need to know these tips, tricks and techniques first.

Features

• Are you Partial to Partial HDI? by Andy Shaughnessy
• Partial HDI: A Complete Solution, with Kris Moyer
• Implementing HDI and UHDI Circuit Board Technology, by Vern Solberg
• Novel Ultra HDI Architectures, by Happy Holden
• One Partial HDI Technique: mSAP, with Chris Hunrath
• Partial HDI: A Delicate Balance, with Stephen Chavez
• Musings on High Density Interconnections, by Joe Fjelstad

Columns and Articles

• Designing for Reality: Pattern Plating, by Matt Stevenson
• Optimizing mSAP to Produce Flex for Biofluid Sensor Probes, by Dean Neuburger
• ‘UHDI’ Bleeding-edge Entertainment Applications, Part 1, by Anaya Vardya

Traditionally, most designers of PCBs and ICs have operated in separate silos, unaware of much of what is happening just upstream or downstream. IC designers did their thing and PCB designers did theirs, and everything worked. Until recently, that is.

Now, the increase in complexity in electronics is driving technologists throughout the electronics supply chain to adopt a “silicon to systems” outlook. Advanced packaging systems are causing PCB designers problems with signal integrity, power delivery requirements, and thermal issues. Sub-nanosecond edge rates in ICs are wreaking havoc with signal integrity engineers at the board level.

This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain. Will designers eventually be required to understand everything from semiconductors through system level and final assembly?

Features

• Silicon to Systems: The Walls Are Coming Down, by Andy Shaughnessy
• From Silicon to Systems, with Matt Kelly, Devan Iyer, and Kris Moyer
• PCB Designers: ‘Level Up’ IC, Packaging Knowledge, with Soo Lan Cheah
• Integrated Circuit to PCB Integration, by Barry Olney
• Silicon to Systems: Collaboration Between IC and PCB Design Continues, with Stephen Chavez
• Cross-domain Design: The Key to Managing Complex Methodologies, with John Park
• Heterogeneous Integration and High-density System-in-Package Technologies, by Vern Solberg
• Silicon to Systems: A Wake-up Call for the Industry, with Duane Benson

Columns

• Designing for Reality: Outer Layer Imaging, by Matt Stevenson
• Revisiting ‘The Calf Path,’ by Joe Fjelstad

Because three quarters of the manufacturing costs of a product are determined in the design cycle, every decision a designer makes has some effect—good or bad—on the manufacturing cost, as well as the cost of the final product.

Fortunately, cost adders can be kept at bay: Designers can employ hundreds of tips, tricks, and techniques to keep costs down.

In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value. When every decision has ramifications downstream, the more you know, the better.

Features

• Watch Out For Cost Adders, by Andy Shaughnessy
• Hidden (and Obvious) Design Mishaps With Big Cost Impacts, by Jen Kolar
• Hidden Cost Drivers in PCB Design, by Cherie Litson
• Commonsense Cost Cutting, by Martyn Gaudion
• My Anti-venom to PCB Cost Adders, by Kelly Dack
• A Comprehensive Guide to Navigating Cost Drivers and Sustainability in PCB Production, by Michael Marshall
• An Evolution in PCB Design Costs, by Istvan Novak

Columns

• Integrated Passive Devices: Design Solutions With Many Benefits, by Joe Fjelstad
• Designing for Reality: Electroless Copper, by Matt Stevenson

Articles

• Impact of the Altium-Ansys Partnership on PCB Design, by Josh Moore
• Asymmetric Hybrid Printed Circuit Board Design–Warpage Considerations, by Kaspar Tsang et al
• Cost Optimize Your PCB Design and Specifications, by Erik Pedersen and Richard Koensgen
• Dan Beeker: Outstanding in his ‘Fields,’ a conversation with Dan Beeker
• UHDI Applications for Aerospace, by Anaya Vardya

What does mechatronics have to do with PCB design? More and more PCB design jobs require that applicants have some experience in mechatronics. Gone are the days of ECAD and MCAD experts operating in separate silos, and mechatronics is playing a key role in bridging the gaps between these silos. In this issue, our expert contributors discuss the advent of mechatronics in PCB design, the challenges and opportunities this creates for PCB designers, and the benefits—to the employee and the company—of becoming a mechatronics engineer.

Features

• Mechatronics: Designers Need to Know it All, by Andy Shaughnessy
• The Need for Cross-disciplined PCB Designers, with John Watson
• Exploring the Interdisciplinary World of Mechatronics, with Dylan Nguyen
• Keys to Successful ECAD-MCAD Collaboration, by Stephen Chavez
• PCB Design and IPC-CFX for Assembly Automation, by Vern Solberg
• Mechatronics in a Flex World, by Joe Fjelstad

Interviews & Articles

• McCauley Design Group Spreads the CAMM2 Gospel, with Charlene McCauley and Terrie Duffy
• Alex Burt: From Internship to Innovator
• Elevate Your Career With Technical Skills Training, by Kelly Allen
• UHDI for RF/Microwave Applications, by Anaya Vardya

Columns

• Does Current Deliver the Energy in a Circuit? by Barry Olney
• Taking the Stand at Your Own Design Review, by Kelly Dack
• Navigating the Intricacies of PCB Drilling, by Matt Stevenson

PCB designers could learn quite a bit from NASA and the private companies that develop spacecraft: Every one of these vehicles is a testament to the value of collaboration among disparate stakeholders. Without a collaborative culture, the rocket might never get off the ground.

A lot of designers are still tossing their design “over the wall” and hoping for the best. They don’t talk to the fabricator or the assembly provider, and definitely not the component supplier. They’re just out there winging it, because that’s how they’ve always done it, and it’s worked out most of the time. For this month’s issue, we asked our expert contributors to weigh in on collaboration, why communication with stakeholders is so critical, and how to set up a collaboration culture in your company.

Features

• All Together Now: The Value of Collaboration, by Andy Shaughnessy
• The Collaboration Culture with Charlie Capers
• Collaboration Station with Kelly Dack
• Collaboration in PCB Design: Enhancing Innovation and Efficiency, by Stephen Chavez
• A Great Recipe: Collaboration, Motivation, and Design Classes with John Watson and Mehdi Kacem
• Do You Collaborate With Your Component Supplier? with Duane Benson

Columns

• Termination Planning, by Barry Olney
• Artificial Intelligence in PCB Design, by Hannah Grace
• Designing for Reality—Lamination and Materials, by Matt Stevenson

Article

• UHDI Applications for Medical Devices, by Anaya Vardya

Do you need specialty materials for your high-speed designs? Maybe not. Improvements in resins mean designers of high-speed boards can sometimes use traditional laminate systems instead of high-speed materials, saving time and money while streamlining the fab process. In this issue, our contributors explain how to avoid overconstraining your materials when working with high-speed boards.

Feature Interviews

• Don’t Overconstrain Your High-speed PCB Materials, with Kris Moyer and Ed Kelley
• Traditional Materials, High-frequency Boards? with Ed Kelley
• Underconstraining Your Materials? Leave It to the Experts, with Filbert Arzola
• Overconstrain? Underconstrain? Selecting Materials for High-speed Designs with Stephen Chavez

Feature Columns

• Break The Constraints of Your High-speed Materials, by Andy Shaughnessy
• Dielectric Material Selection Guide, by Barry Olney
• Overconstraining: Short, Slim and Smooth, by Martyn Gaudion

Columns

• Going in the Archives, by Tim Haag
• Designing for Reality: The Physical Manufacturing Phases, by Matt Stevenson

Articles

• UHDI Applications for Wearable Electronics, by Anaya Vardya

In this issue of Design007 Magazine, our contributors—many of them IPC staff members—discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, designing for flex test, design for reality, chiplet design, and DFM. If you don't come to the conference, you're missing out.

IPC APEX EXPO has been known for years as the largest PCB fabrication and assembly show in the U.S. But in the past decade, the conference portion of IPC APEX EXPO has been increasing its design content, and this year’s event in Anaheim, California offers a cornucopia of PCB design curriculum. And as the IPC Design Competition at APEX moves into its third year, with entrants competing from all over the world in the final heat, this show is shaping up as the place to be for PCB designers and design engineers.

If you don't come to the conference, you're missing out.

Features

• Design Takes Center Stage at IPC APEX EXPO, by Andy Shaughnessy
• IPC Design Competition: On Your Mark, Get Set, Go! with Patrick Crawford and Kris Moyer
• PCB Design Engineering Now ‘Official Occupation’, by Cory Blaylock
• What’s New in Design Education at IPC APEX EXPO? with Kelly Allen
• IPC Focuses on Education and Onboarding, with Carlos Plaza
• Time to Think Like an Engineer, with Filbert Arzola
• Design Classes Abound at IPC APEX EXPO, with Graham Blacksmith
• IPC's Vision for Empowering PCB Design Engineers, by Robert Erickson

Columns

• What Designers Need to Know About Manufacturing, Part 2, by Vern Solberg
• Drilling Down on Documentation, by Martyn Gaudion
• Designing for Reality: The Pre-Manufacturing Process, by Matt Stevenson

Articles

• Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 2, by Yash Sutariya

If you look at the current state of PCB design, there are a lot of positive indicators. We have almost full employment, and you can make good money as a designer without ever going to college. But designers are retiring in droves, just when we need experienced folks more than ever to deal with high speeds, fast rise times, and UHDI.

On top of that, there are very few young PCB designers in the pipeline waiting to take their place. Most high school guidance counselors are still unaware that this career even exists, but we are seeing more PCB design curriculum at colleges and universities. It’s basically a supply and demand situation, but it’s a serious one. What can we do to reverse this situation?

In this issue, we asked our expert contributors to discuss the many challenges and opportunities in the PCB design community, and they shared their thoughts on what can be done to grow the numbers of PCB designers—and design instructors. Join us: We truly need your help. How do you think we can attract more young people into the PCB design segment?

Features

• The Myriad Opportunities—and Challenges, by Andy Shaughnessy
• The Challenges, Opportunities, and Future Specialties of PCB Design, by Stephen V. Chavez
• Great Opportunities—and Challenges, with John Watson
• Being the Best Design Engineer, with Bill Hargin
• The Art of Technical Instructions, by Tim Haag
• The Art of Presenting PCB Design Courses, by Barry Olney
• PCB Designers Still Wanted, by Joe Fjelstad

Articles

• PCBflow Helps Designers Choose Best Manufacturer for the Job, with Susan Kayesar, Evgeny Makhline, and Peter Tranitz
• Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1, by Yash Sutariya
• ASC Sponsors Ultra High Density Interconnect Symposium, by Anaya Vardya
• Designing Electronics for High Thermal Loads, by Akber Roy

Columns

• Designing for Reality: Prioritizing Manufacturability, by Matt Stevenson

Our expert contributors have laid down the foundation of knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. The many design and manufacturing hurdles that can trip up designers who are new to this technology and provide an array of solutions are discussed in the pages of this issue.

Features

• In Bed With Embedded, by Andy Shaughnessy
• Every Designer Needs to Understand Embedded with Kris Moyer
• Embedded Design: Materials Matter, by John Andresakis
• Tips and Tricks for Embedding Resistor Components, by Vern Solberg
• Unleashing the Power of Embedded Components, by Stephen Chavez
• Embedded Capacitors for PCBs, Chips, and Packages, by Cody Stetzel
• Embedded Capacitance Material, by Barry Olney
• Embedded Design: A Term With Multiple Meanings, by Joe Fjelstad

Columns

• Are You Ready for 2024? by Matt Stevenson

Articles

• Talking UHDI With John Johnson, Part 5, by Steve Williams
• Reassessing Surface Finish Performance for Next Generation Technology, Part 2, by Frank Xu
• Design Guidelines for Flexible Printed Circuits, by Chris Keirstead

The PCB development process is an intertwining relationship between design, fabrication, and assembly. But designers, sitting at the front end of the entire development cycle, must have more than a passing understanding of the processes downstream from them. Some analysts estimate that 70% of the cost of the final board is determined during the design cycle. That’s a lot of responsibility. So, this month, we asked our expert contributors to share their thoughts on the absolute “must-know” aspects of fab, assembly and test that all designers should understand. In the end, we’re all in this together.

Features

• Pulling Together, by Andy Shaughnessy
• What Do You Know About Manufacturing? with Tony Bell
• What Designers Need to Know About Manufacturing, Part 1, by Vern Solberg
• Beyond Blueprints: Early Involvement Shapes Superior Fab Outcomes, by Lea Maurel
• Talking Digital Twin and DFT with Dean Poplett of Aster
• PCB Design and Manufacturing: Let’s Work Together, by Tim Haag
• How PCB Manufacturing, Assembly Details Affect SI and PI Board Performance, by Istvan Novak
• Save Your Design by Understanding Fab Processes, with Laura Martin
• New Designer’s (Partial) Guide to Fabrication, by Martyn Gaudion
• What Designers Should Know About Test, with Bert Horner

Columns

• Five Best Practices for Designing Flex and Rigid-flex PCBs, by Matt Stevenson
• What Matters When Designing Next-generation Products? by Joe Fjelstad

Interview

• IPC Design Competition: Third Time’s the Charm with Kris Moyer and Patrick Crawford

Remember when PCBs were all shaped like squares and rectangles? Things were so much simpler in the olden days. Now boards are designed, fabricated and assembled in all shapes, including stars, human hands, octopuses, triangles, and cursive signatures, just to name a few. And the wearables segment is driving the development of PCBs in odd shapes.

In this issue of Design007 Magazine, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.

Features

• Trace Oddity, by Andy Shaughnessy
• Unconventional Geometry Design Techniques, a conversation with Kris Moyer and Kelly Dack
• EDA Tools and Unconventional Geometries, by Stephen Chavez
• Consider Physics When Designing Non-traditional Geometries, by John Watson
• Designing Unconventional Geometries, by Kelly Dack

Columns

• Controlled Impedance and Calculations for Microstrip Structures, by Matt Stevenson
• Return Path Optimization, by Barry Olney

Articles

• Controlled Calculations for Impedance Microstrip Structures by Matt Stevenson
• Return Path Optimization, by Barry Olney
• Talking UHDI With John Johnson, Part 2, by Anaya Vardy
• Flexible Printed Circuits: A Design Primer, by Chris Keirstead

How much money and labor are wasted annually because of PCB designs that are over-constrained or otherwise needlessly complex? It had to be millions of dollars, or maybe even tens of millions. Over constraining happens for a variety of reasons: increasing signal speeds, faster rise and fall times, and shrinking silicon technologies. How can designers avoid creating PCBs that are needlessly complex but still able to meet today’s technological and manufacturing requirements?

In this month’s issue, our expert contributors explain how to design PCBs without making them complex and over-constrained—whatever the level of technology. We also discuss the effect your decisions and tradeoffs have on design complexity, as well as the need to thoroughly understand how electrical and manufacturing limitations can lead to over-constraining your board.

Features

• Simply Speaking, by Andy Shaughnessy
• Simplifying Your Design: An Overview, with Kris Moyer
• Simplest Stackups Specified, by Martyn Gaudion
• Your Thermal Designs Are Inefficient, by D. Brooks and J. Adam
• 8 Simple Rules for Streamlining Your Design, by Chris Young
• Avoid the ‘Ferrari Problem’ and Simplify Your PCB Design, by Zach Peterson
• Take It From Scotty: Simple Really is Better, by Tim Haag

Extras

• Best Practices for Ensuring PCB Design Manufacturability, by Matt Stevenson
• Just a Matter of Time, by Barry Olney
• Talking UHDI with John Johnson, Part 1, by Steve Williams

IPC standards offer blueprints for a successful PCB design—one that will likely cruise through your fabricator’s production line. But standards can seem confusing to anyone who is new to the industry. How many standards are there, anyway?

So, in this issue of Design007 Magazine, our expert contributors discuss how PCB designers can utilize standards to save time and money, not to mention frustration. We also discuss the updated version of the IPC Checklist, a handy guide that illustrates which standards cover which topics, from front-end design through assembly.

Features

• What Are the Standards of Design? by Andy Shaughnessy
• IPC Standards: Ticket to a Safe Passage, with John Watson
• IPC Launches Additive Standards, by Dana Korf
• A Standards-driven Design Environment, with Jen Kolar and Cory Grunwald
• Got Questions? Standards Have the Answers, with Gerry Partida
• What the Heck? A PCB Tech Spec Check, by Kelly Dack
• Design Success With IPC Standards, by Barry Olney
• Managing Design Standards, by Patrick Crawford

More Content...

• Choosing the Right CAD Tool, by Matt Stevenson 
• Ultra HDI Pushes PCB Manufacturing Capabilities, by Anaya Vardya 
   

Not long ago, rigid-flex was considered a niche market. Now, analysts predict that the rigid-flex market will top $5 billion by 2026, lead in part by the adoption of IoT and the need to connect a variety of smart devices. Rigid-flex circuits are everywhere: servers, cameras and pacemakers all use rigid-flex, just to name a few.

In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered! And, as Kris Moyer says in his feature, “Don’t fear rigid-flex.”

Features

• Rigid-flex Design: No Longer a Niche, by Andy Shaughnessy
• An Overview of Rigid-flex Design, with Kris Moyer
• Rigid-flex DFA, Q&A with Kris Moyer
• Rigid-flex Stackup: It’s a 3D World, by Bill Hargin
• Design for Manufacturing Principles for Flexible Circuits, by Vern Solberg
• Unlocking the Key to Rigid-flex Design Success, by Joe Fjelstad
• Rigid-flex Design Guidelines, by Cherie Litson
• Selecting a Rigid-flex Fabricator, by Mike Morando
• Human Ingenuity and the Rigid-flex PCB, by Tim Haag

Columns

• Best Practices for Prototyping, by Matt Stevenson

Articles

• Three Ways to Improve High-Speed PCB Signoff, Part 2, by Brad Griffin
• Empowering Your Supply Chain for Success, by Léa Maurel
• A Primer on UHDI, by Anaya Vardya

Getting today’s designs “right the first time” is critical, especially with costly advanced PCBs. Simulation and analysis software tools can help you in the fight to eliminate respins. They’re not magical, but they can predict the future of your design. And if you’re designing high-performance, high-speed boards without using these tools, I predict that you’re on your way to respins.

As we learn in this month’s issue, AI is already making inroads into the design cycle—and learning from its successes and missteps. Today’s simulation tools are now benefiting from machine learning and artificial intelligence. We’re still a long way from “push-button” operation, but as AI becomes more “intelligent” and learns from its design mistakes, there’s almost no limit to what AI could potentially offer PCB designers and engineers in the not-too-distant future.

Features

• Simulation, Analysis, and AI, by Andy Shaughnessy
• Integrating AI Into the PCB Design Flow, by Barry Olney
• How Far Can We Trust AI? by Sheldon Fernandez
• PCB Design, Digital Twin, and Digital Transformation, a conversation with David Wiens
• Three Ways to Improve High-speed PCB Signoff, Part 1, by Brad Griffin
• 3D Electromagnetic Analysis, by Yuriy Shlepnev
• Circuit Simulation, SPICE, and AI, by John Watson
• Challenges in Modern PCB Design and Analysis, by Steve Watt
• Model Citizens: Modelithics, by Chris DeMartino

Columns

• Best Drilling Practices for Better PCB Manufacturing, by Matt Stevenson
• Growth of Flex and Flex-hybrid Electronics in Mil-Aero Application, by Joe Fjelstad

PCB designers tend to be unconventional folks, to put it mildly. But some designers are really “out there.” They like to push the limits of their design abilities. They don’t like the status quo; they enjoy the challenges inherent in this job. They don’t shy away from new ideas, new materials, and new techniques. These designers look for ways to bend the laws of physics to meet their needs. If you match that description, you’re in luck.

This month, our contributors focus on designing PCBs with advanced, complex and emerging technologies. We investigate design strategies for boards that are on the cutting edge of technology, or crazily complex, or so new that designers are still writing the rules as they go, like Wyatt Earp and his brothers taming a lawless cow town.

Features

• Advanced, Complex, and Emerging Design Strategies, by Andy Shaughnessy
• RF Antenna Design on the Bleeding Edge, a conversation with Albert Gaines
• Honey, I Shrunk the PCBs, by John Watson, CID
• Designing High-Current PCBs That Won’t Melt, by Kelly Dack, CID+
• Designing Cavities to Reduce Skyline, by Kris Moyer, CID+
• Standing Waves in Multilayer PCB Plane Cavities, by Barry Olney
• Rough Roughness Reasoning, by Martyn Gaudion
• PCB Designer’s Guide to Heterogeneous Chiplet Packaging, by Vern Solberg
• How I Learned Advanced Design Strategies, by Tim Haag
• Designing and Manufacturing Wearable Biosensors, by Rick Ramos

Columns

• Playing the ISO ‘Game’ for Better Quality, by Jamin Wilson
• Stretching Conductors—and Design Possibilities, by Joe Fjelstad

Articles

• Stiffeners for Flex Circuits, by Mike Morando

In this month’s Design007 Magazine, we share the top PCB design challenges from a variety of viewpoints—PCB designers, fabricators and assembly providers. The three challenges most often cited by contributors revolve around DFM, communication, and data—all of which are interrelated. We think you’ll find this compilation of design challenges useful.

If you’re wondering why there is a tortoise on the cover of this issue, in one of the most popular Aesop’s Fables, ‘The Tortoise and the Hare’, the slow and steady reptile beat his much faster opponent by taking his time and persevering. Judging from what our expert contributors have to say in this issue, many PCB design problems could be precluded if designers simply took their time. (Yes, designers even called themselves out for this.)

Features

• Slow and Steady Wins the Race, by Andy Shaughnessy
• Design Challenges—From the Designers’ Side
• Design Challenges—From the Fabricators’ Side
• Design Challenges—From the Assemblers’ Side
• Keeping Your Design on the Road, by Kelly Dack
• Balancing Trade-offs for Optimal PCB Design, by Barry Olney
• Avoiding Five Common Pitfalls of Parts, by Matt Stevenson

Columns

• Millimeter-Wave Properties and PCB Design Challenges, by John Coonrod
• The Adjacent Possible, by Joe Fjelstad

Articles

• Reassessing Surface Finish Performance for Next Generation Technology, by Frank Xu, Martin Bunce, and John Coonrod
• Rigid-flex, Rigidized Flex, and Hybrid Flex, by Mike Morando Challenges of DFM Analysis for Flex and Rigid-flex Design, Part 3, by Mark Gallant

This month, our expert contributors examine the development of IPC slash sheets and the need for new, robust material guidelines created specifically for PCB designers. We also discuss the dangers of over-specifying materials, particularly for offshore manufacturing, as well as the many risks and trade-offs associated with laminate selection.

Features

• A New Materials Paradigm, by Andy Shaughnessy
• Slash Sheets and Material Selection, a conversation with Doug Sober
• Select Dielectric Material With Precision, by Barry Olney
• Stop Over-specifying Your Materials, by Kelly Dack
• Slash Sheets: Don’t Fall Into the Trap, by Geoffrey Hazelett
• Batter Up: Stepping Up to the Substrate, by Tim Haag
• Selecting Flex Materials: Do Your Homework, by Mike Morando

Columns

• 3D Effects in Power Distribution Networks, by Istvan Novak
• Industry Organizations Keep Knowledge Alive, by Martyn Gaudion

Articles

• DFM101: Cost Driver Summary, by Anaya Vardya
• Challenges of DFM Analysis for Flex and Rigid-flex Design, Part 2, by Mark Gallant

Tribal knowledge is present in every organization, no matter what size. Tribal knowledge isn’t always bad, but there’s a lot of inaccurate tribal knowledge floating around out there. How do we distinguish tribal knowledge from documented facts? In this issue, our expert contributors will provide readers with the tools and methodologies needed to identify tribal knowledge, as well as when to question such information, and how to document and transform tribal knowledge into a process.
 
Features

• Tribal Knowledge: Friend or Foe? by Andy Shaughnessy
• With Tribal Knowledge, Trust but Verify, a conversation with Tamara Jovanovic
• Tribal Knowledge: Not the Villain You Thought, by Tim Haag
• Material Matters and Tribal Knowledge, by Alun Morgan
• Instilling an Informal Information Culture, by Martyn Gaudion
• If Not You, Then Who? by John Watson
• The Tale of Five CAD Monkeys, by Kelly Dack
• Tribal Knowledge: A Personal Perspective, by Joe Fjelstad

Columns

• The Interaction of Electromagnetic Fields, by Barry Olney
• The Power of Forward Thinking, by Matt Stevenson
• PCB Design for Bare Board Testing, by Vern Solberg

Articles

• DFM101: Final Finish Design Guidelines, by Anaya Vardya

SPECIAL COVERAGE: 2023 IPC DESIGN COMPETITION

• IPC APEX EXPO: A Focus on PCB Design by Andy Shaughnessy
• IPC Design Competition Wrap-up with Kris Moyer
• Q&A With the IPC Design Competition Winner with Sathish Vijayakumar
• Runner-up Discusses IPC Design Competition with Adam Thorvaldson
• Forcing Designers Out of Their Comfort Zone with Paul Brionez
• Tips and Tricks in Today’s Designs with Filbert Arzola
• Solid Design Methodologies for Avoiding Obstacles with Christian Dominguez

The need for designers to understand EM effects is greater than ever as silicon continues to shrink, driving up signal speeds and rise times. In this issue, readers will learn the causes and effects of silicon shrinkage, including the need to better manage EM strategies—as well as signal integrity—on their PCB designs.

Feature Interviews

• Shrinking Silicon, Growing Signal Integrity Challenges with Kris Moyer
• Shrinking Geometries: Back to Fundamentals to Fight EMI with Dan Beeker
• Shrinking Silicon, EMI, and SI with Todd Hubing

Feature Columns

• Shrinking Silicon: A Warp Speed Facilitator, by Andy Shaughnessy
• Displacement Current—The Key to Electromagnetic Energy Propagation, by Barry Olney, with Special Advisor Rick Hartley

Columns

• Medical Technology—How PCBs Help Save Lives, by Matt Stevenson
• Test Vehicles for PCB Electrical Material Characterization, by John Coonrod
• A Once and Future Idea, by Joe Fjelstad

Articles

• Are You Offering Options in Your Bill of Materials? by Jason Sciberras
• DFM 101 Final Finishes: OSP, by Anaya Vardya
• Book excerpt: The Printed Circuit Designer’s Guide to... Designing for Reality, by Matt Stevenson

The year 2022 might be remembered as the Year of Advanced Packaging. The Department of Defense got the ball rolling last summer with the CHIPS Act, and the IPC Advanced Packaging Symposium helped outline the hurdles we’re facing with complex packaging. So, we asked a variety of experts to discuss the challenges and trade-offs that PCB designers and design engineers are seeing today with advanced packages.

We start off this issue with an article by Kris Moyer, who focuses on the routing techniques necessitated by advanced packaging. Next, Lee Ritchey discusses a challenge that’s facing aerospace PCB designers who use stacked microvias, and he offers a variety of methods for circumventing this problem, including using staggered microvias. Columnist Tim Haag shares his take on designing complex packaging, and he tracks how complicated some designs have become over the past few decades. Chris Hunrath discusses the use of films and resin systems for high-reliability and advanced technology designs. Ashutosh Mauskar breaks down the nearly “perfect storm” of drivers affecting the semiconductor industry and packaging trends, including supply chain issues, artificial intelligence, EVs and autonomous vehicles. And columnist John Watson explains why packaging is likely to continue shrinking and pushing Moore’s Law to its limits: “We are simply running out of room.”

We also have columns from our regular contributors Barry Olney, Matt Stevenson, Joe Fjelstad, Anaya Vardya, and Saskia Hogan. And we have articles from Zachariah Peterson and an interview with Ventec’s Alun Morgan and Mark Goodwin.

Features

• PCB Design and Advanced Packaging, by Andy Shaughnessy
• Advanced Packaging Means Advanced Routing Issues, by Kris Moyer
• A Challenge Facing Aerospace Designers in 2023, by Lee Ritchey
• Threading the Needle Through Advanced Packaging, by Tim Haag
• Advanced Packaging Not a Passing Fad, by John Watson
• Scaling Beyond Silicon, by Ashutosh Mauskar

Columns

• The Eye Diagram, by Barry Olney
• Demystifying Multilayer PCBs, by Matt Stevenson
• Automotive Conformal Coating Applications, by Saskia Hogan
• A Patently Innovative Revolution, by Joe Fjelstad

Articles & Interviews

• PCB Designers Are Really Product Designers, by Zachariah Peterson
• Everyone Wants Change: Who Wants to Lead the Way? with Alun Morgan and Mark Goodwin
• DFM 101—Final Finishes: HASL, by Anaya Vardya

If you ask anyone in this industry to describe IPC APEX EXPO, they’ll probably call it a PCB manufacturing show. But next year’s event has more content than ever targeted at PCB designers and design engineers—it’s becoming a show within a show. In this issue, IPC organizers and Professional Development instructors discuss their drive to provide more—and greater—curriculum for today’s PCB designers and design engineers. Check out the specials on this year’s menu!

Feature Interviews

• A New Gathering Place for Designers with Kris Moyer
• The Battle of the Boards with Patrick Crawford
• Designing a Sustainable Future with Carlos Plaza
• A Sneak Peek with Jim van den Hogen
• Workflow Challenges in Fabrication with Paul Cooke
• Altium Focuses on Design Education with Rea Callender

Columns 

• A Show Within a Show, by Andy Shaughnessy
• The Recipe for Customer Service Success, by Matt Stevenson
• Green Coats Are In, by Saskia Hogan
• Optimum Thermal Stability Considerations, by John Coonrod
• Flexible Circuits for In-line SMT Assembly Processing, by Vern Solberg
• A Primer on Using Flexible Circuits in Printed Electronics, by Happy Holden
• Flexible Circuits: A Road Less Traveled, by Joe Fjelstad

Articles

• Where Exactly Is the Signal? by Douglas Brooks, PhD 
• ICAPE: Solutions With No Limits, interview by Nolan Johnson 
• Final Finishes: Electrolytic Nickel/Gold, by Anaya Vardya 

Lately, we’ve heard quite a few design experts say, “PCB design is all about physics. Designers should focus more on understanding the laws of physics and less on circuit theory.” Perhaps designers should return to the fundamentals of electrical and electromagnetic theory—pioneers such as James Maxwell, Georg Ohm, and Joseph Fourier. We investigated a few cover ideas for this issue: “What if we had James Maxwell and Gordon Moore boxing on the cover, in a Faraday cage match? Let’s get ready to rumble!”

That led us to the Rock ‘Em Sock ‘Em robots that now grace our cover. Of course, Maxwell and Moore aren’t really on opposite sides of the ring in the electronics discussion. They’re more like two sides of the same coin. Today’s designers need to study the laws of physics and electrical circuit theory, both individually and as they work together.

Features

• It’s All About Physics—Or Is It? by Andy Shaughnessy
• The Physics of PCB Design, a conversation with Eric Bogatin
• My Experience With Maxwell, by Happy Holden
• Electronics vs. Physics: Why Vias Don’t Get Hot, by Doug Brooks and Johannes Adam
• Forget What You Were Taught, by Barry Olney
• Fitting Physics to Fact, by Martyn Gaudion
• Physics, Electrical Engineering, and PCB Design, by Tamara Jovanovic

Columns

• Leveraging Digital Automation to Accelerate PCB Design, by Stephen V. Chavez
• Managing Solder for Fewer Heat Sink Failures, by Matt Stevenson
• Encapsulation Resins: PU vs. Epoxy by Beth Massey
• What More Do We Need to Know? by Tim Haag

Articles

• DFM 101—Final Finishes ISn, by Anaya Vardya
• Analyzing Gerry Partida’s ‘Significant’ Microvia Reliability Paper by Happy Holden
• DownStream Flexes in Rigid-Flex, a conversation with Joe Clark and Mark Gallant

It is tough to get much smaller than ultra HDI. This is a whole new level of miniaturization for most PCB designers and fabricators. UHDI folks speak in terms of microns, not mils. And everything changes when you start working with 15-micron lines and spaces. For this issue, we asked some of the top UHDI experts to share their knowledge about designing and fabricating these tiny features.

Features

• Let’s Get Small, by Andy Shaughnessy
• Ultra HDI Primer with Herb Snogren
• A Designer’s Point of View, by Cherie Litson
• The Learning Curve of Ultra HDI, by Tara Dunn
• Ultra High-Density Circuit Board Design, by Vern Solberg
• Forming Standards for Ultra HDI, by Jan Pedersen
• Scaling PCB Design to the Power of 10, by Kelly Dack

Columns

• Routing Strategies to Minimize Radiation, by Barry Olney
• The ABCs of Clean Schematics, by Matt Stevenson
• Thermal Management Isn’t Getting Easier, by John Coonrod
• Noise Mitigation in Power Planes, by Istvan Novak
• Avoiding Conformal Coating Pitfalls, by Saskia Hogan
• Unblocking Innovation With a Component Digital Thread, by Matt Walsh
• The Chameleon of Interconnection Technologies, by Joe Fjelstad

Articles

• Market and Tech Convergence: Electrically Conductive Inks, by Stan Farnsworth
• The Printed Electronics Roundtable, Part 3, with Kevin Miller, Tom Bianchi, Mike Wagner, John Voultos

In our August issue of SMT007 Magazine,“supply pain management" was the topic of discussion. This reminds us of the question that doctors often ask: “What’s your pain level on a scale of 1–10?”

Designers and design engineers have learned to navigate this supply chain craziness, snatching up components that are in short supply or making do with lower-tech parts that are available.

Supply chain management is a dynamic situation, with a number of global forces that can create pain for PCB designers. In this issue, we speak with a variety of experts and bring you up-to-the-minute insight about designing PCBs in this ever-changing environment.

Features

• Working Through the Design Pain, by Andy Shaughnessy
• A New Sourcing Paradigm, a conversation with Kelly Dack
• Some Relief, but Hold Off on the Party, with Chintan Sutaria
• Altium’s EDDI Report Tracks Components’ Availability—Today and Historically, a conversation with Dan Schoenfelder
• Designing Through Supply Chain Pain, by Chris Young

Columns

• Utilizing a Field Solver for Stackup Planning, by Barry Olney
• Examining the Benefits of Laser Direct Imaging, by Trina Taylor
• Optimizing Co-design Across Multiple Domains, by Dave Wiens
• Success Begins With a Little Confidence, by Tim Haag
• Comparing Traditional and Bio-based Resins, by Beth Massey and Beth Turner
• The Rapidly Expanding Realm of Stretchable Circuits, by Joe Fjelstad

Articles

• DFM101: Final Finishes—ENEPIG and IAg by Anaya Vardya
• The Chip Shortage Leads to Innovation, by Malcolm Thompson
• The Printed Electronics Roundtable, Part 2, with John Lee, Kevin Miller, Tom Bianchi, Mike Wagner, and John Voultos

The supply chain issues plaguing our industry don’t seem to be going away any time soon. Like an annoying mother-in-law, they’ve moved into our guest room, rearranged the furniture, and generally overstayed their welcome.

We’re seeing all sorts of interesting tactics for dealing with 50-week lead times. One of the most basic concepts that we’ve heard about lately is material conservation—why not just design PCBs with fewer parts? As we point out in this issue, sometimes less is more.

Features

• Designing for Material Conservation, by Andy Shaughnessy
• Material Conservation Demands Stakeholder Buy-in, a conversation with Happy Holden
• Happy’s Design Tips for Material Conservation, by Happy Holden
• PCB Design Strategies to Reduce Costs, by Barry Olney
• Design Tips for Lowering Costs of Fab and Assembly, by Cherie Litson
• Material Conservation: The PCB Designer’s Role, a conversation with Alun Morgan
• Design for Material Conservation Means Changing Attitudes, a conversation with Dana Korf
• Design Tips for Inflationary Times by John Watson
• Benefits of High-performance Hybrid Multilayer PCBs by John Coonrod
• Practical Packaging Density in PCB Design, by Kelly Dack

Columns

• Controlled Impedance: The Devil Is in the (Math) Details, by Matt Stevenson
• All Resins Are Not Created Equal, by Beth Massey

Articles

• Webinar Review: Thermal Integrity of High-performance PCB Design, by Andy Shaughnessy
• The Printed Electronics Roundtable, Part 1, a conversation with John Lee, Kevin Miller, Tom Bianchi, Mike Wagner, John Voultos

When we first started planning this issue on field solvers, one thing became clear right away: Field solvers can be fairly difficult tools to use, even for veteran SI specialists, and it’s even tougher to make sure that you’re using the correct data so that you get the results that you need. Signal integrity experts we spoke with said that even experienced engineers could wind up with “garbage in, garbage out” (GIGO) if they aren’t careful. And for a non-degreed PCB designer, learning to use a field solver might feel like drinking from a firehose.

So, for this issue, we asked our expert contributors to share their thoughts on field solvers, and what new users need to know to get up to speed.

Features

• With Field Solvers, GIGO Hurts, by Andy Shaughnessy
• Surveying the Land of Field Solvers, a conversation with Todd Westerhoff and Bill Hargin
• The Great Divide in PCB Simulation Software, by Zach Peterson
• Field Solver Finesse for Modelling Transmission Lines by Martyn Gaudion
• Cadence Provides “Clarity” in Design Tool, a conversation with Brad Griffin
• 2D Field Solver—An Essential Tool for High-Speed PCB Design, by Barry Olney
• The Practical Side of Using EM Solvers, by Heidi Barnes

Columns

• Supply Chain Resilience, Part Two—The Solution, by Stephen Chavez
• Can Solvent-free UV Cure Coatings Increase Stability and Throughput? By Saskia Hogan
• Manufacturing Documentation—Keep the Builder in Mind, by Tim Haag

Articles

• Final Finishes—ENIG and ENIPIG, by Anaya Vardya
• The Importance of Rigid-flex PCB Design Guidelines, by Cody Stetzel

In our industry, we just love our acronyms. Especially the “design fors” such as DFM, DFA, and DFT. We now have DFX, DFR, and even DFSC—design for supply chain.

The newest example is DWM, design with manufacturing, and this “design for” could wind up having a real effect on the PCB development process. If designers and manufacturers actually embrace this concept, DWM could do what DFM was never able to do: Create a transparent communication environment for designers, fabricators, assemblers, and component and materials suppliers.

Now, DWM promises to get every stakeholder on the same sheet of music, from the beginning of the design process through box-build. You would know your fabricator’s sweet spot and preferred format for data package handoff. He would know your design intent from the word “go,” help you craft the perfect layer stackup, and be aware of your impedance needs before the 11th hour.  And your EMS provider would know about any tough-to-find components far before your bare board arrived.

So, this month, we asked our contributors to shine a spotlight on DWM: How do we initiate it, and what does DWM look like in action? Why should you embrace DWM? How can DWM succeed where DFM fell short, despite the industry’s best-laid plans? And when is DWM not necessary and just a waste of your fabricator’s time?

Features

• Will DWM Unite the Product Development Family? by Andy Shaughnessy
• What Happens When You Assume? a conversation with Dana Korf
• Designing With the 5Ws and Other Acronyms, by Kelly Dack
• DWM: A Rose by Any Other Name, by Patrick McGoff
• Altimade Puts Designers and Manufacturers Together, with Ted Pawela and Misha Govshteyn
• Mastering the Art of Communication With Manufacturers, by Kyle Burk
• Is DWM Just Another Buzzword? by Tara Dunn
• Producing Diverse Designs in Concert With Manufacturing, by Scott Miller

 
Columns

• Copper Pours in High-Speed Design, by Barry Olney
• Bringing PCB Quoting to the 21st Century, by Matt Stevenson
• Supply Chain Resilience, Part One—The Supply Chain Problem, by Stephen Chavez
• An Overview of Copper Foils, by John Coonrod
• Optimize Your Thermal Management, by Jade Bridges
• The Many Benefits of Eliminating (Most) Solder, by Joe Fjelstad

Do you ever feel like you’re designing in a vacuum? If so, you are not alone.

This month’s topic came to us during an editorial meeting. We were discussing some of the PCB design classes at recent industry conferences—classes on signal integrity, supply chain management, DFM, and EMC. But after talking with designers who have grown accustomed to laying out boards without knowing where their boards would be manufactured, not to mention such info as impedance requirements, it dawned on us... What the design community really needs to do is focus on designing in a vacuum. Is DIV the next industry acronym?

Our contributors provide tips for?designing in a vacuum, as well as the total costs (in time, respins and other resources) of working in the dark, and some strategies for getting out of the vacuum.?We have an interview with Jen Kolar and Cory Grunwald of Monsoon Solutions, who discuss some of the tricks they’ve developed for filling in missing information, including the art of making accurate assumptions.

Features

• Are You Designing in a Vacuum? by Andy Shaughnessy
• Tips for Designing in—and Escaping From—the Vacuum, a conversation with Jen Kolar and Cory Grunwald
• Designing in a Vacuum Q&A: Mark Thompson, a conversation with Mark Thompson
• Happier in a Vacuum: The Design Narcissist, by Kelly Dack
• Designing in a Vacuum Q&A: From a Service Bureau Perspective, a conversation with Nick Barbin
• Designing in a Vacuum Q&A: Carl Schattke, a conversation with Carl Schattke

Columns

• Reflecting on Reflections, by Barry Olney
• Enabling a Digital Thread Across IC/Package/PCB Design, by Dave Wiens
• The Benefits of a Parts Library, by Matt Stevenson
• Green Ambition for the Electronics Manufacturing Industry, by Patrick Crawford
• Today's Preparations for Tomorrow's PCB Designs, by Tim Haag
• Why Some Conformal Coatings Fail in Service, by Phil Kinner

Webinar Review

• A Textbook Look: Signal Integrity and Impedance, a webinar review by Pete Starkey

Flex007

Aluminum has been around for hundreds of years, and we may have only scratched the surface of its many uses. In this column, Joe Fjelstad explains how this inexpensive metal may hold the key to making solderless rigid-flex circuits a reality. Aluminum may once again prove to be more valuable than gold.

Feature

• Blue Skying it With Aluminum Rigid-Flex, by Joe Fjelstad

Note: This month marks the last installment of Flex007 as a sub-section of Design007 Magazine. Flexible circuit columns and articles will be incorporated into our future issues of Design007 Magazine, PCB007 Magazine and SMT007 Magazine as deemed appropriate.

It seems like there’s never a dull moment in the design segment. That’s what makes this career exciting—and occasionally stressful. There’s a lot of change going on in PCB design—some positive, some negative. In this issue of Design007 Magazine we focus on some of the changes coming in PCB design, and how to react when you’re thrust into a new, confusing situation, such as moving to a new company, switching to a new EDA tool, or dealing with new, cutting-edge technology.

Our contributors discuss some of the changes they see happening in the industry, especially those changes that seem to be happening to them, not with them. As Stephen V. Chavez says in his article, when you’re undergoing a change in your department or company, it’s easy to imagine the voice of the Star Trek entity the Borg saying, “Resistance is futile.” Do you resist or become assimilated and join the hive mind?

Features

• Resistance is Futile. Or Is It? by Andy Shaughnessy
• PCB Design Challenges: Change is Good by Barry Olney
• Keep the Change? No, Embrace It by Tamara Jovanovic
• Design Milestones: More Than Signposts Along the Road with Happy Holden, Kelly Dack and Bob Tise
• Changes on the Horizon: Is Resistance Futile? by Stephen Chavez
• SAP—Changing the Way You Look at PCB Design by Tara Dunn

Columns

• Livin’ in a PCB Stakeholder’s Paradise by Kelly Dack
• Selecting Prepreg for Millimeter-wave PCB Applications by John Coonrod
• Design for Test, Part 2 by Vern Solberg
• How to Select the Best Resin Category for Your Application by Beth Turner
• Managing Risk With Model-Based Engineering by David Wiens
• The PCB Design Secret Sauce for RF Applications by Matt Stevenson

Article

• DFM 101: Plating Methods by Anaya Vardya

FLEX007
The flexible circuit segment is constantly evolving. What constitutes a state-of-the-art flex or rigid-flex circuit today? This month, we bring you a chapter from the new Siemens book, The Printed Circuit Designer’s Guide to... Stackups: The Design within the Design, written by Bill Hargin and published to the I-007eBooks library. This chapter provides a working outline for designing a cutting-edge rigid-flex stackup. We also bring you a variety of video interviews with flexible circuit technologists from IPC APEX EXPO 2022.

Features

• Book Excerpt: Rigid-Flex Materials by Bill Hargin
• Interview: Kris Moyer Discusses New IPC Design Role

“Don’t let the smoke out!” That’s one of the PCB designer’s unspoken objectives, albeit a sarcastic one. The idea is that there’s a cloud of smoke inside each printed circuit board, and if you don’t design the board correctly, you’ll let all the smoke out. And in high-voltage boards, you might say that there’s a lot more smoked trapped inside, just waiting to get out and set your schedule back a few weeks.

As more than one PCB designer has said, “Managing design data is a lot like herding cats.” It’s no wonder: schematics, footprints, BOMs, netlists, fab notes, assembly notes—millions of petabits (no pun intended) of data are used to design and engineer PCBs, and readers cite mismanaged data as a constant source of heartburn.

In the past, we’ve dedicated issues of Design007 Magazine to specific steps for handling one type of design data, such as fab notes, datasheets, or footprints. But this month, we wanted to step back and look at data management in general, from a more macro level than in previous issues.

These are just a few of the questions we asked this month’s contributors to address:

• To paraphrase our Founding Fathers, what data management truths are self-evident?
• Who owns the data in the first place?
• What are the best methods for ensuring traceability throughout the design process?
• Should you trust data that originates outside your company?

Features 

• Data Management: It’s A Lot Like Herding Cats, by Andy Shaughnessy 
• A PCB Design Data Management Overview, a conversation with John Watson, Dugan Karnazes, and Patryk Akhurst 
• Manage Your Data and Document Everything, by Tamara Jovanovic 
• Say 'No' to File Hoarding: Data Management Tips, by Tim Haag 
• Solid Data Management Key to Accurate Quotes, by David Gronner  
• IP Reuse Enables a Digital Transformation, by David Wiens 
• Cost of Compliance and How Data Transfer Standards Can Help, by Patrick Crawford 

• The Impact of Filled Vias on Thermal & Signal Integrity, by Barry Olney 
• A Grand Announcement, by Kelly Dack  
• Diving Into the Chemical Processes of PCB Manufacturing, by Matt Stevenson 

• DFT and Test Strategies Shouldn’t Be an Afterthought, by Will Webb 
• 45+ Years of PCB Manufacturing Experience, a conversation with Kim O’Neil 
• American Standard Circuits on the Fundamentals of RF and Microwave PCBs, by Pete Starkey

When we started planning this issue on design data transfer formats, we knew what we were getting into. While most of the topics we cover involve objective discussions with designers—i.e., “Here’s the best way to do this”—any conversation about data formats is bound to be a subjective affair.

Gerber, ODB++, and IPC-2581 all have enthusiastic advocates, and all three are being used to produce circuit boards. Which brings us to these questions: Is there really a problem with having three perfectly good design data formats? Does the industry have to unite around one? Or do we all just like a good horse race? These are just a few of the questions that our contributors discuss in the October issue of Design007 Magazine.

In this issue, we start off our interviews with representatives of each format: Cadence’s Ed Acheson of the IPC-2581 Consortium, Patrick McGoff of Siemens EDA for ODB++, and Ucamco’s Karel Tavernier and Eurocircuits’ Dirk Stans for Gerber. They all make their cases for their formats, with surprisingly little “smack talk” about the other formats. Matt Stevenson has a feature column on finding the value of Gerber files. Jen Kolar of Monsoon Solutions explains how her company decides which data format to select for each job. Hemant Shah and Patrick Davis delve into the advantages of IPC-2581, including being open and neutral. Gene Weiner discusses the role of tribal knowledge in the data format conversation. Sunny Patel of Candor Industries talks about the data formats that he sees each day, and we have another short piece by Matt Stevenson discussing the ins and outs of Gerber and ODB++.

We also have columns from regular contributors Barry Olney, Martyn Gaudion, Tara Dunn, John Coonrod, Kelly Dack, Beth Turner, and Joe Fjelstad. And this month, we’re launching a new Siemens column, Digital Transformation, which will focus on the drive to digitize PCB design and manufacturing data.

Featured Interviews

• The Case for Gerber with Karel Tavernier and Dirk Stans
• The Case for ODB++ with Patrick McGoff and Max Clark
• The Case for IPC-2581 with Ed Acheson
• Who Selects the Design Data Format, and Why? with Jen Kolar
• Sunstone Circuits: Use the Design Data Format That Gives You the Best Results with Matt Stevenson
• Sunny Patel on Design Data Formats

• Data Formats: Designers Like What They Like, by Andy Shaughnessy
• IPC-2581: An Open, Neutral, Efficient PCB Design Data Format, by Hemant Shah and Patrick Davis
• Finding Value in Gerber Files, by Matt Stevenson
• Tribal Knowledge and Design Data Formats, by Gene Weiner

Columns

• The Impact of No-Clean Flux Residue on Signal Integrity, by Barry Olney
• Overview of Test Methods to Determine Material Dk and Df, by John Coonrod
• Fake Fudged Facts—Using Software Tools to Get the Right High-Speed Answer, by Martyn Gaudion
• Are Encapsulation Resins Suitable for EV Applications? by Beth Turner
• Electronics Data Format Collaboration—Help Wanted, by Kelly Dack
• It’s Happening Everywhere—Be Ready, by AJ Incorvaia
• Additive Electronics—Are You One of the Curious? by Tara Dunn

Article: • DFM 101: PCB Via Structures, by Anaya Vardya

Flex007
The typical challenges found in rigid board design pale in comparison to the issues designers face with flexible and rigid-flex circuits. This month, Pete Starkey discusses his RealTime with… interview with Anaya Vardya and David Lackey of American Standard Circuits, which focuses on flex and rigid-flex design and manufacturing. And columnist Joe Fjelstad explains why flexible circuits can be a “catalyst for technical evolution.”

Features

• RealTime with... American Standard Circuits: Approaches to Flex and Rigid Flex PCBs, by Pete Starkey
• Flexible Circuits—A Catalyst for Technological Evolution, by Joe Fjelstad

• Collaboration by Design, by Andy Shaughnessy 
• Collaboration: The Key to Streamlining Your Design Process, a conversation with Patrick Davis 
• PCB Design: It’s a Team Sport, by John Watson 
• The Power of Designer and Manufacturer Collaboration, by Ian Huibregtse 
• Collaboration by Design: The Role of EDA Tools, by Rich Tighe 
• The Collaborative PCB Design Process—A Necessity for Efficient Manufacturing, by Tim Haag 
• Collaboration to Shorten the Learning Curve, by Tara Dunn 

• How to Increase the Reliability of Conformal Coatings, by Phil Kinner 
• PDN Trends and Challenges, by Barry Olney 
• Interaction—The Cure for Industry Contraction, by Kelly Dack  
• Designing PCBs for Electronic Hardware Products, by Matt Stevenson

• Applying DFM Analysis to Flexible PCBs, by Patrick McGoff 
• Intellectual Property—How It Works for the Benefit of All, by Joe Fjelstad

This month, we asked a variety of expert contributors, seasoned and not-so-seasoned, to describe their path to becoming successful PCB designers and their advice to new designers seeking to continue their education. If you’re a new PCB designer today, you may feel like a first-level fighter in Dungeons and Dragons. You thrive on the variability and complexity of this career but, moving up to the next level is often the result of a series of choices that you will have to make—often without knowing what’s going on.

But there is one thing that you can control: Your education. And the more you know, the more control you have over your career.

Features:

• Education and Training for Today and Tomorrow, a conversation with Susy Webb
• My Road to Becoming a Great Designer, by Tomas Chester
• My PCB Design Education: A Continuous Process, by Tamara Jovanovic
• Hiring a Young PCB Designer: What’s the Break-even Point? a conversation with Patrick Davis
• You Can’t Learn PCB Design on Your Own, by Tom Hausherr
• Seeking Out Design Education Resources, by Michael Steffen
• Unfolding Altium’s Design Educational Platforms, a conversation with Judy Warner
• PCB Design Education: What They Don’t Tell You, by Martyn Gaudion
• Educational Accolades for Our Chapter Liaison, by Kelly Dack
• The Benefits of Understanding Engineering Disciplines for PCB Design, by John Coonrod

Columns

• Design Education: Not a Roll of the Dice by Andy Shaughnessy
• Fly-over Technology: When it All Gets Too Fast, by Barry Olney
• The Split Planes Challenge, by Matt Stevenson Selecting Resins for Effective Resistance in End-Use Environments, by Beth Turner

Technical Article

• The Impact of Via Structures on Multi-Gigabit Signal Transmission, by Chang Fei Yee

Flex007

Flexible and rigid-flex circuits offer an array of advantages for technologists and inventors who are seeking to push the proverbial envelope. This month, Flex007 looks into the modus operandi of today’s flexible circuit innovators, and the need to ask both “Why?” and “Why not?” when developing new electronic interconnect technologies.

Feature:

• The Importance of Asking ‘Why Not?’ When Inventing, by Joe Fjelstad

We want to help PCB designers do their jobs better, faster, and easier. When you get right down to it, that’s really the whole point of this magazine’s existence—to give you design information that you can use right away.

We can’t think of a better way to help the readers get the info they need right now than by going right to the “horse’s mouth,” as the old axiom goes. We decided to let the readers pose their questions to our team of industry experts. We asked our readers to send in their questions, and they responded with queries from across the spectrum: DFM, stackups, supply chain issue, education, signal integrity—you name it.

This month, we put your burning questions to our expert team of PCB designers and design engineers: Lee Ritchey, Carl Schattke, Rick Hartley, Heidi Barnes, Stephen Chavez, Eric Bogatin, Cherie Litson, Chris Young, and Happy Holden. The entire issue is packed with answers to questions that designers like you are wrestling with right now. Enjoy!

Features

• Ask the Design Experts, by Andy Shaughnessy
• Meet the Expert
• Ask the Experts: 16 of Your Burning Questions... Answered
• Ask the Experts—PDN Filters, by Istvan Novak

Columns

• Switchbacks in Tuned Routing, by Barry Olney
• Some Timely Advice, by Tim Haag
• The Board Thickness Challenge, by Matt Stevenson
• Resins—Fundamental Considerations for Circuit Designers, by Beth Turner
• Say What You Do—Do What You Say, by Kelly Dack

Articles

• DFM 101: PCB Controlled Impedance, by Anaya Vardya
• Whizz Systems: The Silicon Valley CM, a conversation with Muhammad Irfan and Dan Williams

Flex007

This month, our Flex007 contributors delve into ways to reduce respins in rigid-flex designs. At rigid-flex’s price point, you definitely don’t want to pay for respins if they can be avoided.

Features

• Rigid-Flex Design Without Respins—A Webinar Review, by Andy Shaughnessy
• The Calf Path—Redux, by Joe Fjelstad

These are the voyages of the PCB designer. Their ongoing mission: to explore strange new vias, to seek out land patterns and new base materials. To boldly go where no PCB designer has gone before.

William Shatner recently celebrated his 90^th birthday, and much like the Star Trek franchise that he’s famous for, Shatner has aged well. No matter how many one-act plays he does on Broadway, he will always be Captain James Tiberius Kirk.

For many boomers, it’s hard to remember a time before Star Trek; it’s part of our DNA. The best thing about Star Trek was the technology. Who didn’t want to build their own transporter? When you bought your first flip phone, didn’t you try to snap it open in a hurry like Capt. Kirk being chased by a Romulan?

So, this month, we’re helping Shatner celebrate his birthday with an issue devoted to Star Trek. Our intrepid Trekkie contributors delve into some of the technological marvels introduced on the show, and they take a look back at how far PCB design and manufacturing technology has come since that first episode, “The Man Trap,” debuted in 1966, winning its time slot in the Nielsen ratings.

Incidentally, William Shatner chose StoryFile to preserve his incredible legacy, with a conversational video and AI platform. Learn more.

Features

• A Lifetime of Star Trek, by Andy Shaughnessy
• Star Trek, the Original Series: An Homage from a Fan, by Happy Holden
• My Life in PCB Design, by Cherie Litson
• Hewlett-Packard’s Adoption—and Controversy—of Plated Through-Holes, by Clyde F. Coombs
• The Trouble with Tribbles, by Dana Korf
• There is No Final Frontier for PCB Design, by Matt Stevenson
• It’s FR-4, Jim, But Not as We Know It! by Alun Morgan
• Star Trek: Laying a Path for Technology of Tomorrow, Today, by Alex Belelovsky

Columns

• High-Speed Serial Link PCB Design, by Barry Olney
• Managing Risk in PCB Design, by John Watson
• Some ‘Exotic’ PCB Processes Could Soon be Commonplace, by John Coonrod
• PCB Engineering on the Move, by Kelly Dack
• A Review of Additive Electronics, by Tara Dunn
• Embedding Resistor Elements—Part 2, by Vern Solberg
• The IPC PCB Design Desk Reference is On Its Way, by Patrick Crawford
• Thermal Management—Good Design Practice for Heat Dissipation, by Jade Bridges

Article

• DFM 101: PCB Panelization, by Anaya Vardya

FLEX007
This month, our Flex007 contributors look at which electronic marvels from the original Star Trek have come into fruition, which have not, and whether flexible embedded circuits would have been part of the Federation uniforms of 2265. After all, their uniforms did measure and transmit data about each crew member’s health—a trick that doesn’t seem so far-fetched today.

Features

• Star Trek Memories, by Joe Fjelstad
• Star Trek’s Impact on Innovation, by John Talbot

When we started planning this month’s issue, we decided to survey our readers regarding their most common design challenges. We assumed, as with previous surveys, that we could easily identify the most “popular” challenge and then direct our content toward that topic. We were mistaken. Readers reported many of the same miscues, missteps and mishaps, including “simple” board-level issues, DFM, signal integrity and EMI.

It’s safe to say that there is no Number 1 PCB design challenge; it’s more like a multiverse of problems, to borrow a term from Marvel’s movie franchise. So, this month, we asked a select group of expert designers and design engineers to discuss some of the many ongoing problems that they face with each design.

Features

• PCB Design Challenges: Designing With DDR, Interview with Rick Hartley and Barry Olney
• The Top Five Reasons Products Fail EMI Testing, by Ken Wyatt
• Planning and Communication: Keys to Optimizing Your Design Time, by Chris Young
• My Ongoing Journey Toward DFM, by Kelly Dack
• My Top Six Design Challenges, by Mark Thompson
• Meeting the Challenge With Design Reuse, by Stephen V. Chavez

Columns

• What Are Your Top Design Challenges? by Andy Shaughnessy
• A Closer Look at Surface Finish, by Matt Stevenson
• DDR Routing—and Other Big Fish in the Lake of Technology, by Tim Haag
• Test for Design—How Do You Measure Up? by Kelly Dack
• Pin-Out Challenge: Re-think the Solution, by Tara Dunn
• Conformal Coating vs. Encapsulation Resin, by Phil Kinner

Article

• Analyzing Complex High-Density PCBs With Online DFM, by Pol Ghesquiere and Oren Manor

Flex007

The challenges facing rigid board designers pale in comparison to those that their flexible brethren must contend with. Flex designers work their black magic in a dynamic, 3D environment, and almost every design could be considered a custom build. This month, we look into a new process for using copper-filled vias for HDI flex designs.

Features

• Designing Via-in-Pad for Higher-Density Flexible Circuits, by John Talbot
• Process Flow for Occam QFN Test Vehicle, by Joe Fjelstad

When we started speaking with SI experts for this issue, we were surprised to find that there were several schools of thought regarding simulation. Should you try to get by without simulating your design and only call a third-party consultant when it’s almost too late? Should your company invest in a simulation tool, which also means hiring someone with years of experience to operate it? Or should you eliminate the need for simulation from the start by managing your electromagnetic fields properly? This month we asked some of the industry’s premier experts on simulation to weigh in on this critical topic.

Features

• Barry Olney’s High-Speed Simulation Primer, Interview with Barry Olney
• Bridging the Simulation Tool Divide, Interview with Todd Westerhoff
• Simulation Stackup and Signal Integrity, by Martyn Gaudion
• Why We Simulate, by Bill Hargin
• Alternatives to Simulation, by Dan Beeker
• Using Simulation to Assist With PCB Design, by John Coonrod

Columns

• A Simulating Conversation by Andy Shaughnessy
• Growth and Trends in the Thermal Management Market, by Jade Bridges
• Friends and Enemies in Power Distribution, by Istvan Novak
• Embedding Resistor Elements, Part 1, by Vern Solberg
• The Power Behind the (PCB) Throne—Power Supply Design Tips, by Matt Stevenson
• Back-to-Back Chapter Meetings and More, by Kelly Dack
• Additive Electronics—Next-Generation PCB Capabilities, by Tara Dunn

Interviews

• Jan Pedersen: Getting Into Ultra-HDI With IPC Committees, by Andy Shaughnessy
• PCEA Expands in its Sophomore Year, by Andy Shaughnessy

Flex007

There are a variety of ways to terminate and connect a flexible circuit to a rigid board. But the stress on the flex circuit must be considered to avoid broken connections, and many flex connectors come with long lead times. This month, we look at some of the best techniques for terminating flexible circuits. One tip: Work out your connection strategy well in advance of beginning the design process.

Features

• Termination of Flex Circuits, by John Talbot
• Book Excerpt: Chapter 2 From—The Printed Circuit Designer’s Guide to... Flex and Rigid Flex Fundamentals, by Dave Lackey and Anaya Vardya

Keeping bad data out of your design involves a lot of detective work. Designers and design engineers need to assess the accuracy and completeness of data at every step of the design process. If one small error in a footprint or schematic goes unnoticed, the CAM engineer may be calling with bad news on Friday afternoon. This month, we asked our expert contributors to discuss their special operations and tactics for keeping bad data out of their designs.

Features

• The Key to Eliminating Bad Design Data: Constant Vigilance, a conversation with Jen Kolar and Mark Thompson
• Detecting PCB Design Teams’ Experience Level, by Dana Korf
• Turning ‘Garbage In, Garbage Out’ into ‘Good In, Good Out,’ by Tamara Jovanovic
• Mysteries of Incoherent Information, by Tim Haag
• Eliminating ‘Garbage In, Garbage Out’ With Checks and Balances, by Nick Barbin

Columns

• Validating Your Data Supply by Andy Shaughessy
• Dampening Plane Resonance With Termination, by Barry Olney
• Messages from the Chairmen, by Kelly Dack
• The Role of Resins and Conformal Coatings, by Phil Kinner
• IoT is Changing How We Design PCBs, by Matt Stevenson
• IPC-2231A—Insights From the IPC 1-14 DFX Subcommittee, by Patrick Crawford

FLEX007
Keeping bad data out of your supply chain is no simple task with flexible circuits, and it’s even trickier with rigid-flex circuits. This month, we look at how IPC-2581 Revision C takes the guesswork out of conveying build intent by digitizing much of the rigid-flex design data handoff, and what this means to flex designers.

Articles

• IPC-2581 Revision C: Complete Build Intent for Rigid-Flex, by Ed Acheson
• With Flex, Sometimes You Gotta Break the Rules, by Tony Plemel

Columns

• Simplified Assembly of Aluminum Flexible Circuits, by Tara Dunn
• Reaching the Limit on Stiffeners, by John Talbot

Many designers count footprints among their most common headaches. This is a critical point in the design process; errors at this stage can wind up having ramifications far downstream. Something as simple as an incorrect pad size can lead to bad solder joints or components floating during reflow. So, this month, we asked our expert contributors to share their thoughts on proper footprint creation and CAD library management.

Plus, don’t miss our IPC APEX EXPO 2021 pre-show special installment!

Features

• Best Practices for Footprint Design and CAD Library Management, a conversation with John Watson, CID
• Footprint Design Techniques: Don’t Trust Datasheets, a conversation with Tom Hausherr, CID+
• Managing Footprints with Integrated EDA Tools, by Matt Walsh, Siemens EDA
• A Library Management Cautionary Tale, by Stephen V. Chavez, CID+
• Footprints: A Distributor’s Viewpoint, by Geof Lipman
• Circuit Material Library Considerations, by John Coonrod
• The Case for Expansive Parts Libraries, by Bob Tise
• Footprints—Small Steps with a Giant Impact, Kelly Dack, CID+

Columns

• Footprints and Library Management, by Andy Shaughnessy
  
• Developing Panel-Level Semiconductor Packaging, by Vern Solberg
• Avoiding ‘Blushing’ and ‘Bubbling’ in Conformal Coatings, by Phil Kinner
• Closing the Gap Between College and Industry with PCEA, by Dugan Karnazes, CID
• Stackup Configurations to Mitigate Crosstalk, by Barry Olney

Flex007
Managing and creating footprints for rigid boards can be a complex task, but flexible and rigid-flex circuits offer their own set of distinct issues. If you’re new to flex design, all of this can seem intimidating. This month, we break down the ins and outs of footprint design, and what it means to flex designers.

Features

• IC Footprints: Why So Many, and How Many is Enough? by Joe Fjelstad
• PCB Technologies We Need Now and Later, by John Talbot

Designers routinely say that PCB stackup design is one of their more pressing challenges. With proper communication between the fabricator and OEM, coupled with today’s CAD tools’ stackup functions, stackup design shouldn’t be such a problem. But there’s still very little agreement about best practices. This month, we peel back the layers and ask, “Who owns the design stackup?”

Features

• TTM’s Approach to Stackup Design: Train the Customer, a conversation with Julie Ellis and Richard Dang
• Conquering Layers of Challenges in PCB Stackups by Tim Haag
• The Magnitude of Stackup Considerations by Mike Creeden
• Seven Tips for Your Next Stackup Design by Eric Bogatin
• Layer Stackup, Short and Sweet by Cherie Litson
• OEMs Must Own the Stackup, a conversation with Bill Hargin
• Stackups: Properly Conveying Your Info to the Fabricator by Mark Thompson
• Stackup Design Considerations a conversation with Martyn Gaudion
• Stackup Planning—Three Decades of Innovation by Barry Olney

Columns

• How Does Your Stackup Stack Up? by Andy Shaughnessy
• Now, Where Were We? by Kelly Dack
• Six Design Tips to Avoid Part Fit Problems by Bob Tise and Matt Stevenson
• 2021 Updates to IPC Design by Patrick Crawford

FLEX007
Designing stackups for flexible and rigid-flex circuits presents a slew of unique challenges that rigid designers usually don’t have to worry about. But as we illustrate in this issue, there’s nothing too mysterious about flex stackup design. It all comes down to following the process.

Columns

• Demystify Flexible Stackups by Tara Dunn
• Flexible Circuits Versus Flexible Hybrid Electronics—Where’s the Line? by Joe Fjelstad
• PCB Industry Statistical Data by Dominique Numakura
• Advancements in Printed Circuit Manufacturing Equipment by John Talbot

Designers have been talking about eliminating PCB design respins for decades. Cutting respins was just one of the many benefits that were slated to accrue when PCB designers began adopting solid DFM practices in the 1990s. But today, OEMs routinely go through two, three, or more PCB design respins. This month, we delve into the idea of reducing respins by one: x = x_c – 1.

Features

• What If We Reduced Respins by One Globally? by Andy Shaughnessy
  
• Lee Ritchey on Reducing Respins by One Interview with Lee Ritchey
• Cutting Respins: Journey to the Single-spin PCB by Chris Young
• There’s No Excuse for Bad DFM Practices Interview with Michael Ford

Articles

• Transforming Electronic Systems Design by David Wiens
• Lorain County Community College’s Successful MEMS Program Interview with Johnny Vanderford and Courtney Tenhover

Columns

• Don’t Ignore DC Trace Resistance by Martyn Gaudion
• To Coat or Encapsulate: Making an Informed Choice for Electronics Protection by Phil Kinner
• PCEA 2020: Small Rearview Mirror, Big Windshield by Kelly Dack
• Simulation Slashes Iterations by Barry Olney
• Is 2020 Really Coming to an End? by Matt Stevenson
• Understanding Material Interactions With PCB Fab Processes by John Coonrod

FLEX007
Flexible and rigid-flex circuits are a double-edged sword. They offer a multitude of dynamic options that rigid boards can’t match—and far more ways to wind up with costly, unnecessary respins. With flexible circuits, solid DFM techniques are more critical than ever.

Features

• Communicating Outside the Box Is Key to Flex DFM by Tara Dunn
• Buried Capacitance Power Planes by John Talbot

There has been quite a bit of activity in the world of vias, especially microvias. Military contractors have been experiencing microvia failures that occur during reflow but remain undetectable at room temperature. A failure that you can’t detect is never a good thing, especially if you’re building PCBs for missiles or fighter planes.

For this issue, we lined up a group of expert contributors to discuss the best methods for designing reliable vias and microvias. First, we start with an interview with PCEA Chairman Stephen Chavez, Happy Holden, and Dan Feinberg, who discuss everything from microvia failures to the challenges the designers face when laying out ever-shrinking traces and components. Next, James Hofer of Accurate Circuit Engineering explains the problems he encounters with customers’ HDI designs, particularly with PTFE laminates, and some of the remedies he utilizes, such as landless vias.

We have a really informative “Stacked Microvia/Weak Interface Reliability Study” edited by Happy Holden, which provides a snapshot of the investigation into the military microvia failures and what work remains to be completed from Marc Carter’s IPC High-Reliability Forum presentation. Tim Haag discusses the many ways that vias can alleviate pain on one part of the board but can cause trouble elsewhere if designers don’t follow best practices. Mark Thompson, CID+, offers a wide-ranging look at the design and fabrication of vias and microvias and shares examples that illustrate why attention to detail and communication are so vital to via design. And Joe Fjelstad dons his professorial blazer with elbow patches as he shares a brief history of vias from the 1950s on.

We have an article by John McMillan of Mentor, a Siemens Business, that focuses on criteria for selecting your next PCB design software tool. And Chris Clark of Minco discusses how rigid-flex circuits are now driving innovation around the world. We also have columns from our regular contributors Jade Bridges, Barry Olney, Matt Stevenson, Kelly Dack, and Patrick Crawford.

Features

• Stephen Chavez and Happy Holden on Designing Reliable Vias An Interview with Stephen Chavez and Happy Holden
• HDI Design, Landless Vias, VeCS, and More An Interview with James Hofer
• Stacked Microvia/Weak Interface Reliability Study Edited by Happy Holden
• PCB Vias, ‘You Have a Go’ by Tim Haag
• The Fundamentals of Via Design by Mark Thompson, CID+

Columns

• Top Tips for a Successful Thermal Management Process by Jade Bridges
• Routing Strategies for High-Speed Design by Barry Olney
• The New Recipe for Customer Service Success by Matt Stevenson
• PCEA and Industry Leaders Who Happen to Be Women by Kelly Dack
• Failures of Imagination: A Column of Caution by Patrick Crawford
• Time to Make the Vias by Andy Shaughnessy

Article

• 7 Things to Consider When Buying a PCB Design Tool by John McMillan

Flex007
Flexible and rigid-flex circuits offer a variety of advantages over their rigid brethren. But there are dozens of potential hurdles awaiting the flex designer, especially those transitioning from the rigid world. Designing vias for a flexible circuit is a unique process with its own set of challenges.

This month, we start with a column by Joe Fjelstad, who shares a brief history of vias from the 1950s on. We also bring you an article by Chris Clark of Minco, as well as columns by John Talbot and Dominique Numakura.

Features

• A Brief History of Electrical Vias in PCBs by Joe Fjelstad
• Five Ways Rigid-Flex Is Driving Innovation by Chris Clark
• Future Flex Circuits as Robot Skin Sensors by John Talbot
• Next-Generation Flex Circuits: Printable Is Compatible With Flexible by Dominique Numakura

Even the most experienced hikers can get lost if they don’t have a map. The same holds true in the world of PCB design and manufacturing—if your company doesn’t have a technology roadmap, it’s hard to know where you’re going technologically. This month, we take a look at a variety of technology roadmaps related to PCB design, and some of the milestones that may be in our not-too-distant future.

For this month’s issue on technology roadmaps, we bring you several interviews with contributors involved with the IEEE Heterogeneous Integration Roadmap (HIR). Rita Horner of Synopsys offers a great overview of the HIR and the effects of heterogeneous integration on the technology of the future. Paul Wesling of IEEE explains the creative process that led to the development of the 584-page, 23-chapter HIR. Dr. José Schutt-Aine, professor of Electrical and Computer Engineering at the University of Illinois, takes us through his chapter in the HIR and explains how PCB designers can facilitate co-design at the IC and package level. And Jeff Demmin of Keysight Technologies discusses the effects of heterogeneous integration on the military and aerospace segments.

We also have a conversation with Todd Westerhoff of Mentor, a Siemens Business, who takes us in depth into Mentor’s plans for the high-speed design tools of the future. Michael Nopp of Cadence Design Systems discusses the company’s move toward creating the next generation of more electrically-aware PCB designers, and Leigh Gawne of Altium provides a roadmap for the company—and the Altium 365 platform, in particular.

We also have columns from Barry Olney, Kelly Dack, John Coonrod, Jade Bridges, and Matt Stevenson and Bob Tise.

Features

• Looking Into the Future With Progressive Design and Analysis, a conversation with Todd Westerhoff
• How Designers Can Help Facilitate Co-Design, a conversation with José Schutt-Aine
• IEEE’s Heterogeneous Integration Roadmap, Part 2, a conversation with Rita Horner
• Managing Information Key for Altium’s Next Generation of Tools, a conversation with Leigh Gawne
• Empowering Electrically-Aware Designers of Tomorrow, by Michael Nopp
• The Aerospace and Defense Chapter of the HIR, a conversation with Jeff Demmin
• How the HIR Impacts Design Through Assembly, a conversation with Paul Wesling

Columns

• The Future is Now, by Andy Shaughnessy
• Fringing Fields, by Barry Olney
• Unraveling the Mysterious BGA Routing Mess, by Bob Tise and Matt Stevenson
• Local Chapters: You Can Distance This Body But Not These Senses, by Kelly Dack
• Why Do High-Frequency Materials Have Different Dk Values? by John Coonrod
• Pushing the Boundaries of Thermal Management, by Jade Bridges

Flex007

Creating a technology roadmap is never a simple task; companies and organizations often spend years editing and fine-tuning their tech roadmaps. This task is exponentially tougher for a segment like flexible and rigid-flex circuits, which seems to be evolving constantly. Would you care to hazard a guess about where flex technology might be in five or 10 years?

This month, we have an interview with Carey Burkett and Mark Finstad of Flexible Circuit Technology, who share their thoughts on the direction of the company and some of the trends and challenges likely to face flex designers and manufacturers over the next few years. And Joe Fjelstad explains why technology roadmaps are so vital to technologists working to develop the processes of tomorrow. We also bring you a column by John Talbot.

This Month in Flex:

• Flexible Circuit Technologies Offers a Flex Roadmap for the Future, a conversation with Carey Burkett and Mark Finstad
• Technology Roadmaps in the Electronics Industry, by Joe Fjelstad
• Heavy-Copper Flex Circuits See Large Growth, by John Talbot

For much of the history of the printed circuit board, thermal management hasn’t exactly been top of mind for designers and design engineers. There were always more pressing issues that needed to be addressed immediately, such as signal integrity and DFM. The percentage of boards with thermal issues was fairly low; if your company’s boards had potential hot spots, you probably had a “thermal guy” on your team already.

But with the growth of electric and autonomous vehicles, along with telecom, military, and aerospace—not to mention the explosion of LEDs—thermal management and thermal design processes are becoming mainstream.

So, in this issue, our expert contributors share their thoughts on the best methods to “beat the heat.” We start out with an interview with Mike Jouppi, a pioneer in PCB thermal management. Mike was the champion behind the update of the old IPC current-carrying tables, which lead to IPC-2152. We also have a conversation with Johannes Adam and Doug Brooks, co-authors of PCB Trace and Via Currents and Temperatures: The Complete Analysis, who discuss the principles of thermal design and Johannes’ new TRM software tool. Doug also brings us an article explaining why trace temperature should not be equated with current density, and Johannes has a feature discussing why thermal engineers should not trust data sheets. And columnist Mark Thompson answers five common questions about improving thermal management.

Ventec’s Alun Morgan discusses the company’s IMS laminates, and how they can help mitigate many thermal concerns. Columnist Tim Haag has some advice about how designers can “stay out of the fire.” We have a conversation with Jeff Brandman of Aismalibar North America, who discusses the heat dissipation properties of the company’s thermal laminates. John Parry of Mentor, a Siemens business, shares some insight into the FloTHERM CFD software tool, and how it can save thermal engineers time and effort. And we have an excerpt from the newly published I-Connect007 book, The Printed Designer’s Guide to…Thermal Management: A Fabricator’s Perspective, by Anaya Vardya of American Standard Circuits.

We also bring you columns from our regular contributors Barry Olney, Alistair Little, Kelly Dack, Patrick Crawford, and Bob Tise and Matt Stevenson. And we have the second half of our fab notes conversation with Jen Kolar and Dan Warren of Monsoon Solutions.

Features

• Thermal Fundamentals with Mike Jouppi
• Thermal Management: Don’t Believe the Data Sheets, by Johannes Adam
• Stop Relating Trace Temperature to Current Density, by Doug Brooks
• Combatting Thermal Challenges With TRM Software, a conversation with Johannes Adam and Doug Brooks
• 5 Questions About Improving Thermal Management, by Mark Thompson
• IMS Materials for Improved Thermal Management, a conversation with Alun Morgan
• Everything You Need to Know to Beat the Heat, by John Parry
• Thermal Management for PCB Designers: Staying Out of the Fire, by Tim Haag
• Book Excerpt: The Printed Designer’s Guide to…Thermal Management: A Fabricator’s Perspective, by Anaya Vardya of American Standard Circuits
• Thermal Laminates: One More Tool in Your Toolbox, a conversation with Jeff Brandman

Columns

• Thermal Management is a Multi-Pronged Effort, by Andy Shaughnessy
• Stackup Planning, Part 6: Impedance Variables, by Barry Olney
• How to Know if a CAD Tool is Right for You, by Bob Tise and Matt Stevenson
• IPC-2231 Captures Board Design Best Practices, by Patrick Crawford
• Education Unlocks the Golden Door to Freedom, by Kelly Dack
• Key Benefits of Resins and Differences From Coatings, by Alistair Little

Interview

• Monsoon Solutions: Creating the Perfect Fab Notes, Part 2, a conversation with Jennifer Kolar and Dan Warren

Flex007

Thermal management is no simple feat for designers of rigid PCBs, but beating the heat in a 3D structure, such as a flexible circuit, takes things to another level entirely.

This month, the feature column by Joe Fjelstad explains why until recently, thermal issues had been the Rodney Dangerfield of PCB issues. We also bring you columns by John Talbot and Dominique Numakura and an article from Tony Plemel on the importance of documenting your flex circuit designs.

• Let’s Talk About the Basics of Flex, by John Talbot
• Thermal Management: Electronic Technology’s Rodney Dangerfield, by Joe Fjelstad
• Documenting Your Flex Circuit Design, by Tony Plemel
• Next-Generation Flex Circuits: Textile Base Flex, by Dominique Numakura

Do you hand off perfect fab notes to your fabricator? If this month’s content is any indication, the answer is likely, “No.” And you may not even know that your fab notes are incomplete or incorrect because your CAM engineers have been deciphering and fixing your data for so long that it’s become part of their job description. But this isn’t about designers handing off bad data; the problem goes much deeper than that.

This month, we decipher the process of creating fab notes, define what should and should not go into a design data package, and what can be done to eliminate that dreaded afternoon phone call.

Features

• Deciphering Fab Notes Interview with Dana Korf and Kelly Dack
• Mark Thompson’s Most Wanted: Accurate and Complete Fab Notes Interview with Mark Thompson
• Dear Designers: Please Include a Sanity Check Interview with Rick Almeida and Ray Fugitt
• Monsoon Solutions: Creating Perfect Fab Notes Interview with Jennifer Kolar and Dan Warren
• The Role of EDA Tools in Creating Fab Notes Interview with Patrick McGoff

Columns

• The Wavelength of Electromagnetic Energy by Barry Olney
• Be Aware of Default Values in Circuit Simulators by Istvan Novak
• The Nuts and Bolts of Electrical Testing by Matt Stevenson and Bob Tise
• How to Overcome Conformal Coating Challenges by Phil Kinner
• An Update on the Italian IPC Design Chapter by Patrick Crawford
• It’s Official:1,000+ PCEA Members Worldwide by Kelly Dack
• Utilizing mmWave Technology to Optimize High-Speed Designs by John Coonrod

Interview

• Things Designers Can’t Unsee Interview with Kelly Dack

Flex007

Getting your fab notes correct and complete can be challenging enough, but the task is amplified for flexible circuit designers, who must convey 3D flex design intent to the manufacturer. Communication is king here, and accurate fab notes are the currency of the realm.

This month, we start with a feature column by Tara Dunn, who illustrates how flex fab notes differ from their rigid PCB brethren and how the 3D structure of flex presents even more data challenges. Dominique Numakura brings us a follow-up to his column series on monocoque printed circuits. We also have a great article by Olga Scheglov, CID+, who lays out a series of design rules for new flex designers.

Features

• The Black Magic in the Business by Tara Dunn
• Next-Generation Flex Circuits: Monocoque Printed Circuits by Dominique Numakura
• Flex Design Rules for Beginners by Olga Scheglov

Since the COVID-19 outbreak, we’ve seen many PCB designers and design engineers moving out of their company offices and into their home offices. As we’ve discovered, not everyone likes working from home; some designers miss the interaction of face-to-face meetings or being able to leave their problems in the office each day. And many designers now find themselves working on sensitive ITAR projects from home, making cybersecurity more critical than ever.

For this issue, we asked a variety of experts to discuss their companies’ approach to working remotely, as well as some of the cybersecurity challenges related to having employees working from home.

Features

• Human Factors in Automation Interview with Bob Murphy
• When Working Remotely, Cybersecurity Is a Necessity, a conversation with Stephen V. Chavez
• Cyberattack! Think it Couldn’t Happen to You? Think Again! a conversation with Dave Ryder and Eric Cormier
• The Pros and Cons of Working Remotely, by Patrick Crawford
• Working From Home: The Benefits and Rewards, by Tim Haag

Columns

• Designing a New Work Environment by Andy Shaughnessy
• Alternative Series Termination Techniques, by Barry Olney
• There Is No Knowledge That Is Not Power, by Patrick Crawford
• Resins: Are They All About Chemistry? by Alistair Little
• Reassessing the Risk of Offshore PCB Manufacturing, by Bob Tise and Matt Stevenson
• The PCEA’s Grand Opening, by Kelly Dack

Articles

• New Solder Joint Technology From Schmartboard, a conversation with Neal Greenberg and Andrew Yaung

Flex007

Flexible circuit designers are at the tip of the spear, in many ways. Once considered a specialty technology, flex is now found in many of our handheld devices. And flex technologists are constantly seeking new applications—from autonomous vehicles to 5G—for these handy 3D circuits. But flex designers often have more questions than answers.

This month, we start off with an interview with Joe Fjelstad, who discusses his upcoming online workshop on flexible circuits. We have a great article by Emily McGrath of NextFlex that discusses ways to close the talent gap in our industry. And industry icon Happy Holden answers a variety of your questions about flexible circuits. We also have columns from our regular contributors Dominique Numakura and Joe Fjelstad.

Articles

• Joe Fjelstad Updates His Online Flex Workshop, a conversation with Joe Fjelstad
• Closing the Talent Gap: Work-Based Learning for Industry 4.0 and Beyond, by Emily McGrath
• Happy Holden Answers Your Flexible Circuit Questions, by Happy Holden

 Columns

• Next-Generation Flex Circuits: Transparent, by Dominique Numakura
• Designers at the Edge, by Joe Fjelstad

There’s a split in the PCB design community, and—as is often the case—the divide centers on data: app notes. Should designers trust app notes or assume that they’re incorrect? Are app notes kissing cousins to datasheets, or are they overly optimistic marketing collateral, with results you’re not likely to see in real-world operation? What should a young designer or engineer do when facing an unfamiliar app note?

This month, we asked a variety of experts to share their thoughts on app notes, datasheets, and when to trust this data. Rick Hartley and Dan Beeker start off by explaining why app notes should never be trusted unless they’ve been verified, and they present some great horror stories to back up their position.

Features

• What is the Proper Role of App Notes? a conversation with Rick Hartley and Dan Beeker
• App Notes: What are They Good For? a conversation with Geof Lipman
• Application Notes: Advice For Authors, by Martyn Gaudion
• With App Notes, Trust But Verify, a conversation with Clive “Max” Maxfield
• High-Frequency Circuit Material App Notes, by John Coonrod
• Clearing Up App Note Confusion, a conversation with Kelly Dack

Columns

• App Notes: To Trust or Not to Trust? by Andy Shaughnessy
• Do You Really Need That Ferrite Bead in the PDN? by Istvan Novak
• Split Planes: Reprise, by Barry Olney
• An Expectation of Collaboration, by Kelly Dack
• Thermal Management: Keeping Cool Starts From Within, by Jade Bridges
• An Update on IPC and IPC Design, by Patrick Crawford
• The Power of Forward Thinking, by Bob Tise and Matt Stevenson

Flex007 Columns
Designing and manufacturing rigid PCBs can be challenging. But flexible circuit technologists face a plethora of issues that their rigid counterparts never dreamed of. One advantage for the flexible circuit designer: the three-dimensional nature of flex allows for innovations that are impossible for rigid boards. Is flex really the new frontier?

• Lead-free Solder: Panacea or Pandemic? by Joe Fjelstad
• Next-Generation Flex Circuits: Elastic, by Dominique Numakura

“What do you expect from me?” How many times have you found yourself asking this question during your career? You’re not alone. Almost everyone involved in PCB design and manufacturing—especially fabricators—has had to deal with unmet expectations. This month, our experts discuss the expectations of technologists throughout the design cycle, the ramifications of not meeting expectations, and how to define requirements so that unmet expectations are (eventually) a thing of the past.

Features

• Dana Korf: What Fabricators Expect From Designers, a conversation with Dana Korf
• What Did You Expect From Me, Anyway? by Todd Westerhoff
• Navigating Industry Expectations by Tim Haag
• Communicating Materials From PCB Design to Fabrication, by Martyn Gaudion
• Albert Gaines: Fabricators Almost Expect Bad Data, a conversation with Albert Gaines

Columns

• Great Expectations by Andy Shaughnessy
• Life During COVID-19 ‘Wartime,’ by Kelly Dack
• Panel-level Semiconductor Package Design Challenges, by Vern Solberg
• Competition as a Tool for Growth, by Patrick Crawford
• Conformal Coating Enemies: Challenges Sabotaging Your Process, by Phil Kinner
• The Impact of Signal Rise Time on Bandwidth, by Barry Olney

Flex007
It’s tough enough achieve the results you expect when designing and manufacturing rigid PCBs. But flexible circuit designers face even more hurdles, and in three dimensions. This month, in our Flex007 section, our flex circuit experts discuss various ways to meet expectations upstream and downstream, and what to do when results just don’t match the requirements.

Features

• Checking in With Todd MacFadden of Bose, a conversation with Todd MacFadden
• When Expectations and Results Don’t Line Up, by Joe Fjelstad

You may have taken an economics course in school, but you probably won’t find many classes on PCB design economics. Not to worry. This month, our experts delve into the economics of PCB design: the total cost of each design, a variety of methods for controlling costs at each stage, metrics that help designers and engineers track costs, when it's time to outsource a design, and much more.

Features

• A Design Economics Primer, Interview with Chris Young
• Design Economics: The Buck Stops Where? Interview with Kelly Dack
• A Design Economics Horror Story, by Rick Hartley
• Design Economics With Optimum Design Associates, Interview Nick Barbin
• Understanding Dk Data Key to Cost-aware Design, by John Coonrod
• The Economics of Design, by Andy Shaughnessy

Columns

• Predicting and Measuring Impedance, by Barry Olney
• Onward! by Kelly Dack
• Thermal Management: Five Tips for Application Success, by Jade Bridges
• Increased Focus on Health and Wellness Transforms the PCB Industry, by Bob Tise and Matt Stevenson

Articles

• Counseling Startups From Design Through NPI, Interview with Richard Marshall
• When Your Fabricator is Late, Interview with John Watson

Flex007

The design economics related to creating flexible and rigid-flex circuits are similar to that of their rigid board counterparts, but the 3D nature of flex can lead to a variety of potential hurdles on the way to cost-aware design. This month, our expert contributors examine the economics of flexible circuit design from a variety of industry viewpoints.

Features

• DFM for Advanced Technology Rigid-flex, by MK Hicks
• DFM or Design With Manufacturing? by Joe Fjelstad

Column

• Mina: Enabling Soldering to Aluminum, by Tara Dunn

It’s easy to define profit, but it’s much more difficult to define exactly what “design for profitability” (DFP) means to today’s PCB designers and design engineers. How can technologists create profit in every design when the board’s stakeholders are often spread out across several time zones and continents? This month, we asked our experts to weigh in on the best DFP strategies and how this can affect the entire PCB development cycle.

We start with an interview with Al Neves of Wild River Technology, who explains why DFP is impossible without good processes, great management, and designers and engineers who continue to educate themselves, even after 30 years of experience. Next, Todd Westerhoff of Mentor, a Siemens Business, discusses how seemingly small problems can lead to increased costs and why accessible simulation tools can help designers make cost-aware decisions. Chris Banton of EMA Design Automation outlines why providing designers with the right data early on can make the difference between a profitable design and a train wreck. And Brad Griffin of Cadence Design Systems looks into how Cadence helps designers stay in the black by automating time-consuming tasks.

We also bring you columns by our regular contributors Barry Olney, Alistair Little, Stephen V. Chavez, Bob Tise and Matt Stevenson,

Feature Interviews

• Designing for Profitability: It’s up to You (and Your Management) with Al Neves
• Mentor: Managing Small Problems for Profitability with Todd Westerhoff
• EMA: Early Access to Data is Key to Cost-driven Design with Chris Banton
• Cadence Helping Users to Save Time, Money With Automation with Brad Griffin

Columns

• Design for Profitability Is Now a Part of the Process, by Andy Shaughnessy
• The Seven-year Etch, by Bob Tise and Matt Stevenson
• Transmission Line Termination, by Barry Olney
• The Foundation of the PCEA is Being Laid, by Stephen V. Chavez
• Resins: Five Tips for Potting and Performance, by Alistair Little

Flex007

Designing for profitability is tricky enough with traditional rigid PCBs, but because of their unique 3D attributes, flex and rigid-flex DFP can be so much more difficult than traditional PCBs. This month in Flex007, we explore a variety of cost-aware methods for designing flex and rigid-flex circuits. Columnist Tara Dunn asks, “Are you unintentionally adding cost?” She explores why cost-aware design for flex and rigid-flex circuits can be so much more difficult than for their rigid brethren. Joe Fjelstad focuses on how all of the “design fors,” such as DFM, DFA, and DFE, contribute to profitability. And we have an interview with Carey Burkett of Flexible Circuit Technologies, who discusses the company’s growth from a flex maker into a company that provides assembly and box-build services.

Features

• Flexible Circuit Technologies: ‘We Do it All,’ an interview with Carey Burkett
• Profitability: A Vital Design Requirement, by Joe Fjelstad
• Are You Unintentionally Adding Cost? by Tara Dunn

At every trade show and conference lately, designers and design engineers mention issues that they’re facing related to EMI and power distribution networks. It’s one problem that doesn’t seem to be going away anytime soon. This month, we asked our expert contributors to share their thoughts on fighting and even precluding EMI through proper PDN design techniques and more.

We start with an interview with Lee Ritchey, who explains some of the causes and solutions to EMI issues, and why misinformation is not helping the problem. Next, Eric Bogatin outlines why EMI is such a tricky problem, and why it’s likely to continue to be a problem for some time. Istvan Novak discusses how to design PCB test fixtures for improved power integrity. Barry Olney focuses on PDN impedance and its effect on EMI. Tim Haag discusses some of the resources available to designers who are facing EMI challenges. And freelance designer Alexander Löwer explains the variety of hurdles related to beating EMI, including non-technical aspects, such as the alphabet soup list of national and international regulations.

 We also bring you columns by our regular contributors Bob Tise and Matt Stevenson, Steph Chavez, Alistair Little, and John Coonrod.

Features

• Avoiding EMI Problems With Lee Ritchey, a conversation with Lee Ritchey
• Eric Bogatin Looks at EMI Root Causes and Solutions, a conversation with Eric Bogatin
• PCB Fixtures for Power Integrity, by Istvan Novak
• The Impact of PDN Impedance on EMI, by Barry Olney
• Clearing Up the Buzz, by Tim Haag
• EMI Challenges: A Contract Designer’s Take, an interview with Alexander Löwer

Columns

• You Can't Afford Not to Consider ISO 9001, by Bob Tise and Matt Stevenson
• The New Printed Circuit Engineering Association, by Steph Chavez, CID+
• Encapsulation Resins: What Could Go Wrong? by Alistair Little
• PCB Materials for High-power RF Applications, by John Coonrod

Flex007
More and more OEMs are also moving into complex multi-board rigid-flex circuits, often for reasons related to space-saving and reliability. This technology can save money and real estate, but it brings with it a variety of caveats. This month, we bring you a feature article, “Multi-board Etching: Managing Rigid-flex Designs and Conductivity” by Hemant Shah of Cadence Design Systems, that delves into this issue. We also have a great column by our regular contributor Joe Fjelstad, “Power and Thermal Management: Dealing With the Heat.”

Features

• Multi-board Etching: Managing Rigid-flex Designs and Conductivity, by Hemant Shah
• Flex is Heating Up, by Andy Shaughnessy
• Power and Thermal Management: Dealing With the Heat, by Joe Fjelstad

It’s 2020, and it’s time to hit the ground running. If you’re not already networking with other designers or volunteering in our industry organizations, there’s no better time to start. In this issue, we focus on getting involved with the PCB design community and working with your peers through training, standards development, or event planning. Make it your New Year’s resolution to get involved, too!

We start with an interview with Randy Faucette and Tony Cosentino, who discuss PCB Carolina 2019—a show that grew out of the RTP Chapter of the Designers Council.

Then, we have a conversation with Dave Seymour of Ixia, who just passed his certification exam to be a CID+ trainer. Next, John Watson, CID, of Legrand explains why it’s so important for designers to learn to adapt to adversity and stay active in their education. IPC’s Teresa Rowe and Patrick Crawford discuss IPC Design, the new organization replacing the Designers Council, and how they hope to make this group better and more responsive to the needs of designers.

Next, we highlight an interview with Rainer Beerhalter of Squadrat, who discusses his job designing PCBs for large LED screens. We also have columns from our regular contributors, including Barry Olney, Bob Tise and Matt Stevenson, Vern Solberg, Stephen Chavez, Tim Haag, and Alistair Little.

Feature Interviews

• PCB Carolina Show Continues to Grow, with Tony Cosentino and Randy Faucette
• Meet Dave Seymour, Brand-new CID+ Instructor, with Dave Seymour
• Teaching Designers to Adapt and Overcome, with John Watson, CID
• IPC Designers Council Has a New Name: IPC Design, with Teresa Rowe and Patrick Crawford

Columns

• New Year's Resolution: Get Involved, by Andy Shaughnessy
• Interconnect Impedance, by Barry Olney
• Design Tips for Layout, by Bob Tise and Matt Stevenson
• PCB Design and HD Semiconductor Packaging, by Vern Solberg
• A New Beginning, by Stephen V. Chavez
• Rounding Up a Posse, by Tim Haag
• Five Top Resin Tips, by Alistair Little

Bonus Interview

• Designing PCBs for Large-Scale LED Screens, with Rainer Beerhalter

Flex007

It’s a great time to be working with flex and rigid-flex, but it can be difficult just keeping up-to-date with all of the changes taking place in this growing segment. In this issue, we have you covered. This month in Flex007, we bring you an article from Flexible Circuit Technologies that is based on their flex design guidelines, with tips and tricks for designing single-layer, double-layer, and multilayer flex and rigid-flex circuits, including advice on cutting costs. And we have a column from Joe Fjelstad of Verdant Electronics that focuses on the effects that unpredictable events have had on shaping our technology, and some of the newest innovations coming that are just starting to ramp up.

Features

• Flexible Circuit Design Guidelines, by Flexible Circuit Technologies
• Flex Segment Starts Strong in 2020, by Andy Shaughnessy, I-Connect007
• Looking Back and Looking Forward, by Joe Fjelstad

Think about this for a minute: If someone asked you what you need to know to be a great PCB designer, what would you say? Where would you even begin? This month, we asked our expert contributors to discuss what they believe other designers and design engineers need to know as we move forward into 2020.

We start out with an article by John Watson, CID, of Legrand North America, who explains what design advice he would give a younger version of himself if he could travel back in time in a DeLorean. Then, Taylor Rouse of Aerotek, a high-tech staffing company, discusses the ins and outs of today’s engineering job market and offers some job-hunting hints that may sound counterintuitive at first.

Next, Linda Mazzitelli of Altium updates us on the convergence of ECAD and MCAD software tools, as well as virtual and augmented reality. Scott Miller of Freedom CAD shines the light on designing today’s complex PCBs and why communication with your fabricator is critical for advanced board designs. And Roger Beers of Quantel focuses on a topic that doesn’t get much coverage: Are ISO standards strangling innovation instead of helping?

We also have columns from our regular contributors, including Barry Olney of iCD, Stephen Chavez of the IPC Designers Council, John Coonrod of Rogers Corporation, Bob Tise and Matt Stevenson of Sunstone Circuits, Mark Thompson of Prototron Circuits, and Phil Kinner of Electrolube.

Features

• What You Need to Know About a PCB Designer Career by John Watson, CID
• What You Need to Know: The High-tech Job Market Interview with Taylor Rousse
• What You Need to Know About ECAD/MCAD Convergence Interview with Linda Mazzitelli
• What You Need to Know: Designing Complex PCBs Interview with Scott Miller
• Are ISO Procedures Strangling Innovation? Interview with Roger Beers

Columns

• The Big Bang: Lumped Element to Distributed System by Barry Olney
• Closing Out 2019 on a Positive Note by Stephen V. Chavez
• Test Vehicles for Material Evaluation by John Coonrod
• Fabrication Notes and the Design Process by Bob Tise and Matt Stevenson
• ‘The Want of a Nail’ and the Butterfly Effect by Mark Thompson
• Top Tips for Conformal Coating Selection by Phil Kinner
• What You Need to Know by Andy Shaughnessy

Flex007

There’s so much innovation going on in the flex world that it can be difficult to make sense of it all. In this issue, we provide a snapshot of the flexible circuitry segment as we head into 2020. We cut through the noise and tell you what you need to know about flexible and rigid-flex circuits.

As Kelly Dack explains in our feature story, he needed to find a fabricator who could attach a piece of metal to a flexible circuit, with the metal acting as a heat sink. He wound up working with Guy Martindale of SEP, a fabricator based in Korea. Guy had the technical knowledge to get the project done, and he was also the first one to visit with Kelly in person. Kelly and Guy share some tips on designing and fabricating advanced flex circuits and discuss why communication is king, especially with complex designs.

Joe Fjelstad of Verdant Electronics shares some of the knowledge gleaned early in his career from technologists of the “Greatest Generation,” and he looks into the many disparate skill sets required to create even a simple flex or rigid board. Next, Tara Dunn of Omni PCB discusses the need for technologists to continue their training and education, as well as some of the things to consider before beginning your first flexible circuit design. And Dominique K. Numakura of DKN Research shines a light on a technology that’s been around for a few years but is only now beginning to catch on: transparent flexible circuits.

Feature Article

• What You Need to Know: Advanced Flex Design Interview with Kelly Dack and Guy Martindale

Columns

• What You Need to Know About Flex by Andy Shaughnessy
• The Value of Experience by Joe Fjelstad
• Continually Learning: Why Stop? by Tara Dunn
• Transparent Flexible Circuits by Dominique K. Numakura

This month, we handed the microphone to a variety of designers and design engineers and asked them to share their thoughts about their jobs, technology, and the trends that they’re seeing in the industry—the good, the bad, and the challenging. Read on for some eye-opening interviews.

We start with interviews with Michael Steffen and Kalen Brown, who discuss their work as designers and why they decided to take the CID exam. Next, Todd Westerhoff of Mentor explains why the designers of today need to understand many concepts once left to the signal integrity engineers. Then, Bryan LaPointe of Cadence Design Systems discusses the satisfaction he feels working as a product engineer, as well as the diversity of the entire EDA segment. Matt Stevenson of Sunstone Circuits breaks down some of the reasons why this may be the most exciting time to be in this field.

EMA’s Chris Banton focuses on new technology like 5G, AI, and printed electronics, and discusses their effects on PCB design. Columnist Tim Haag highlights the need for more communication between designers and manufacturers, and why assumptions can be your worst enemy. Tamara Jovanovich of Happiest Baby updates us on her first full year as a PCB designer, and she offers some advice for new designers and design engineers. Insulectro’s Megan Teta explains why she enjoys being involved in so many different aspects of the job, and why she’s glad to be an example for young girls considering STEM careers. And Curtis Scott of Current Products discusses his job designing PCBs for automated window coverings near the beaches of the Gulf of Mexico. We also have columns by regular contributors Barry Olney, Stephen Chavez, Vern Solberg, Bob Tise, and Phil Kinner.

Feature Interviews

• Meet Two New CID Grads: Kalen Brown and Michael Steffen
• Todd Westerhoff on the Value of Solid Design Skills
• Bryan LaPointe: A Great Time to Be Working With Technology
• Matt Stevenson: An Exciting Time to Be in the Industry
• Chris Banton Is Bullish on New Tech
• Tamara Jovanovic Checks in After First Year as a Designer
• The World of PCBs: Anything But Boring, with Megan Teta
• Curtis Scott Opens the Blinds on PCB Design

Columns

• Communication Is Still the Key, feature column by Tim Haag
• Voices From the Road, by Andy Shaughnessy
• The Frequency Domain, by Barry Olney
• Fall 2019 Recap, by Stephan V. Chavez
• Design Challenges for Developing High-density 2.5D Interposers, Part 2, by Vern Solberg
• A Penny for Your Thoughts on Copper, by Bob Tise
• Design Challenges and the Impact on Coating Success, by Phil Kinner

Flex007

We’ve been out covering industry conferences and trade shows lately. One thing we’ve noticed: The flex folks often become the center of the conversation without even trying. When a designer starts talking about using flex, the rigid board designers gather around, eager to hear more. Many rigid board designers and design engineers have their eyes on the flex space. For this month’s Flex007, we look into some of the things designers should know before they begin designing flex or rigid-flex circuits.

This month, we begin with a column by Tara Dunn of Omni PCB. Tara discusses why she believes that technologists will have to embrace change more quickly than ever before, and not just with flexible circuits, in order to keep up with innovations in the industry. Next, Dominique Numakura of DKN Research shares his thoughts on the use of electroless plating to produce high-density flexible circuits, and why the time is right for companies to consider electroless plating. Then, Joe Fjelstad explains why additive manufacturing may be on the verge of taking off, and how additive processes can help companies save one very precious commodity: Time. And Outi Rusanen, et al., of TactoTek make the case for smart molded structures, and the need for updated standards that can keep up with this evolving technology.

Columns

• Flex Technology Advancing Almost Daily, by Andy Shaughnessy, I-Connect007
• The Challenge of Change, by Tara Dunn, Omni PCB
• Electroless Plating for Flexible Circuits, by Dominique K. Numakura, DKN Research
• Additive Manufacturing of PCBs, by Joe Fjelstad, Verdant Electronics

Technical Article

• Smart Molded Structures Bring Surfaces to Life, by Outi Rusanen, et al.

For this issue, we offer a snapshot of the PCB design segment as it exists today: the good, the bad, and everything in between. After interviewing designers at trade shows and conferences this year, we think it’s safe to say that this is a pretty good time to be a PCB designer or design engineer. It’s also a very hectic time for this segment.

We start this month’s issue off with an interview with two senior designers, Mike Creeden of Insulectro and instructor Rick Hartley. They discuss the cutting-edge technologies of today, some promising materials and processes, and why the designer’s job is more critical than ever. Then, we have Part 2 of an interview with Chris Beeson of Digi-Key, who explains how the company works with designers and how EDA tools are a lot like a bag of golf clubs. Lee Ritchey of Speeding Edge puts the “faster, smaller” concept in perspective with a surprising look at how fast PCBs have become in just the last decade or two.

We also have columns by Stephen Chavez, Istvan Novak, Vern Solberg, Bob Tise, John Coonrod, and Alistair Little, as well as an article by Brent Klingforth of Mentor, a Siemens business.

Features

• Traversing the Design Landscape with Hartley and Creeden, a conversation with Rick Hartley and Mike Creeden
• Digi-Key on Adapting to the Changing Industry Landscape, Part 2, a conversation with Chris Beeson
• Lee Ritchey on the Direction of PCB Design, a conversation with Lee Ritchey
• The Landscape of the Design Community, by Andy Shaughnessy

Columns

• The First Open IPC DC Executive Board Meeting, by Stephan V. Chavez
• How Much Signal Do We Lose Due to Reflections? by Istvan Novak
• Design Challenges for Developing High-density 2.5D Interposers, Part 1, by Vern Solberg
• Build Quality Into Your Boards and Processes, by Bob Tise
• Material Choices for 5G PCB Applications, by John Coonrod
• Five Key Factors for Flexible Resins and Potting Sensitive Components, by Alistair Little
  

Articles

• What Does Intelligent PCB Routing Look Like? by Brent Klingforth

Flex007

We’ve had a few busy months recently, covering several IPC meetings and forums, as well as PCB West and SMTA International. One thing we’ve found while talking with designers and engineers alike is that there’s a lot of excitement in the world of flexible circuits, and plenty of questions too. For this month’s Flex007, we look into the current landscape of flex and rigid-flex circuits.

We begin this month’s edition of Flex007 with an interview with Kelly Dack, a design instructor with EPTAC who has been designing flex for years. He discusses some of the most cutting-edge flex technologies he’s seen lately, including flex-to-metal lamination, and why it’s so important for flex designers to communicate with fabricators and develop a thorough understanding of the final product.

Next, columnist Mike Carano of RBP Chemical Technology explains what technologists accustomed to rigid boards need to know about working with flex and rigid-flex, including difficulty getting metallization to adhere to polyimide. Then, Dominique K. Numakura of DKN Research provides a look into printed electronic circuit (PEC) processes, with a comparison of the subtractive and PEC techniques, as well as the associated costs.

Features

• Flex Design: Know Your Applications, a conversation with Kelly Dack
• The State of Flex Design, by Andy Shaughnessy, I-Connect007

Columns

• Polymer Thick-film Circuits: Practical or Not? by Dominique K. Numakura, DKN Research
• Working with Flexible Circuits, by Michael Carano, RBP Chemical Technology

It’s no secret that the standards situation in PCB design, manufacturing, and assembly is anything but standard. This alphabet soup of documents and guidelines can be a confusing maze even for veteran professionals. This month, we untangle the often-confusing world of standards.

We start with a conversation with Karen McConnell of Northrop Grumman, who offers an update on the committees she chairs. Then, Gary Carter of XPLM and Michael Ford of Aegis Software who discuss their work merging IPC-2581 with IPC’s CFX into DPMX, a design-through-assembly standard. They’ve been working on this for some time, but they’re almost ready to make an announcement. Next, Leo Lambert of EPTAC addresses the move by IPC to change the way standards and training documents are developed, including some methods for eliminating errors and duplicated comments during revision. We also have a conversation with Emma Hudson of Gen3 Systems who explains her work on a committee that seeks to streamline and “harmonize” IPC standards with other global organizations’ standards.

Karel Tavernier of Ucamco provides an article explaining why so many PCB designers still use Gerber, and how Ucamco has continued to update the tried-and-true format. Max Clark of Mentor, a Siemens Business, traces the development of ODB++ and breaks down the advantages of using this format that’s already installed at many manufacturing facilities. Linda Mazzitelli of PTC offers details about the IPC-2581 and how DPMX will help optimize Industry 4.0. And columnist Tim Haag explains why you should listen to your boss if they say, “Check the standard.”

We also have a great article by our columnist John Coonrod, “Insertion Loss Performance Differences Due to Plated Finish and Different Circuit Structures.” Further, we bring you columns by our regular contributors, including Barry Olney (with his 100th column!), Stephen Chavez, Bob Tise, and Phil Kinner.

DESIGN007:

Features

• Design For Excellence: Karen McConnell on Standards, a conversation with Karen McConnell
• The Convergence: IPC Merging CFX with IPC-2581, a conversation with Gary Carter and Michael Ford
• Why Does the PCB Industry Still Use Gerber? by Karel Tavernier
• Emma Hudson on the Harmonization of Standards, an interview with Emma Hudson
• So Many Standards Committees, So Little Time, a conversation with Leo Lambert
• ODB++: Transforming Ideas Into Products, by Max Clark
• IPC-2581 Continues to Fluorish, by Linda Mazzirtelli
• Realizing a Higher Standard for PCB Design, by Tim Haag

Columns

• Time to Streamline Standards, by Andy Shaughnessy, I-Connect007
• My 100^th Column, by Barry Olney, iCD
• Recent IPC DC Chapter Activities, by Stephen Chavez, MIT, CID+
• A Proactive Approach to Controlled Impedance, by Bob Tise, Sunstone Circuits
• Six Key Points for Designing a Defect-free Conformal Coatings Process, by Phil Kinner, Electrolube

Articles

• Insertion Loss Performance Differences Due to Plated Finish and Circuit Structure, by John Coonrod, Rogers Corporation

FLEX007 SECTION:

We’re heading into fall, but the electronics industry is still smoking hot. Flexible circuits are continuing to find their way into almost every type of device. With the advent of 5G and IoT, flex standards are more critical than ever, especially for rigid board designers who have been forced into designing flexible circuits. This month we explore the world of standards for flexible circuits

We begin with an interview with Nick Koop of TTM Technologies, the vice-chair of IPC’s

Flexible Circuits Committee and co-chair of the 6013 Subcommittee. He discusses some of the updated versions of flex standards that are soon to be released—such as IPC-2223 and IPC-6013—and why these committee members must perform a balancing act by incorporating new processes as quickly as possible, but only after they’ve proven their viability.

Next, columnist Joe Fjelstad of Verdant Electronics breaks down the various types of standards related to flex and rigid circuits and addresses why it’s no exaggeration to say that standards are what hold the electronics industry together. Then, Dominique K. Numakura of DKN Research follows up with a look at a simple process hailing from Taiwan that creates “monocoque” 3D printed circuits by printing silver-based traces on thermoplastic sheets. The result isn’t exactly a rigid or flexible circuit, but a totally novel idea.

• Flex Standards in Flux, by Andy Shaughnessy, I-Connect007
  
• Flex Standards Update with Nick Koop, a conversation with Nick Koop
• Standards: An Industrial-Strength Glue, by Joe Fjelstad, Verdant Electronics
• Monocoque Printed Circuits: An Update, by Dominique K. Numakura, DKN Research

This month, as the kids head back to school, we look into the growing opportunities for PCB design instruction. In this month’s first feature interview, Bill Brooks of Nordson ASYMTEK explains how he created and taught a PCB design course at Palomar College in Carlsbad, California, and details some of the hurdles he faced. Next, columnist Mark Thompson of Prototron Circuits outlines the top 19 electronics courses available at the University of Washington that he would recommend to anyone starting out in the industry today. We also have an interview with Gary Ferrari of FTG Circuits, who explains why designers must continue their education, even if their company doesn’t support their efforts.

Leo Lambert of EPTAC Corporation discusses the company’s move to open training centers around the country to cut down on attendees’ travel expenses and why training methods are evolving to meet the needs of the next generation of PCB technologists. From the design bureau viewpoint, columnist Dan Beaulieu and CA Design owner Bob Chandler discuss the “gospel of Bob,” which is based on the idea that all PCB designers need to be properly trained, and the need for companies to train their designers. Bob Williams, managing director of Pulsonix, explains how this EDA company offers real design training that is not specific to Pulsonix tools as well as their efforts to advocate for PCB design careers by meeting with high school and college students. Finally, Brooke Campbell of BTG Labs describes how she works to draw more young women into STEM careers and why girls shouldn’t avoid hard science classes, and she shares some highlights from her presentation to the Girl Scouts.

We have a variety of columns from regular contributors Barry Olney of iCD, Stephen Chavez with the IPC Designers Council, John Coonrod of Rogers Corporation, Bob Tise of Sunstone Circuits, and Jade Bridges of Electrolube. We also have some great articles by CF Yee of Keysight Technologies, Rebecca Lord and John McMillan of Mentor, a Siemens company, and an interview with Zen Liao of SimplifyDA.

Features

• Bill Brooks Discusses his PCB Design Classes, a conversation with Bill Brooks
• Teaching the Next Generation: An Overview of Today’s University Courses, by Mark Thompson, CID+
• PCB Design Training: More Critical Than Ever, a conversation with Gary Ferrari
• Leo Lambert on Training the Next Generation of Technologists, a conversation with Leo Lambert
• CA Design’s Bob Chandler on Training PCB Designers, a conversation with Bob Chandler
• Pulsonix is Bullish on Next-gen Designers, a conversation with Bob Williams
• Teaching Young Girls About STEM Careers, a conversation with Brooke Campbell

Columns

• PCB Design Education Never Ends, by Andy Shaughnessy, I-Connect007
• The Curse of the Golden Board, by Barry Olney, iCD
• A Bright Future: The Sonora Chapter, by Stephen Chavez, MIT, CID+
• High-frequency Material Technical Resources, by John Coonrod, Rogers Corporation
• Managing Global Supply Chain Uncertainty, by Bob Tise, Sunstone Circuits
• How to Avoid Pump-out and Achieve Efficient Heat Transfer, by Jade Bridges, Electrolube

Articles      

• Decoupling Capacitors’ Impact on Power and Signal Integrity, by CF Yee, Keysight Technologies
  
• Design Rule Checks Cut Down on Board Respins, by Rebecca Lord and John McMillan, Mentor, a Siemens business
• SimplifyDA’s Floorplanning Tool Optimizes Autorouting, a conversation with Zen Liao, SimplifyDA

FLEX007 Section

We kick off this month’s special section with a wide-ranging flex design roundtable. Designer Mike Creeden, the new technical director of design and education at Insulectro, interviews his Insulectro co-worker Chris Hunrath and DuPont Circuit Applications Engineer Steven Bowles. The three discuss their work with customers who may be new to flex materials, some of the trends they see in the flex material market, and some flex design education options, which could include a visit to the customer-centric DuPont Technology and Innovation Center in Sunnyvale, California.

Next, we have an interview with John Michael Pierobon, who developed the free online course Designing Flexible Circuits, available on the website of the flex fabricator All Flex. John Michael, who has been knows to teach programming classes in Spanish and Portuguese, discusses his class, which is broken up into seven chapters and covers everything from flex design guidelines to material requirements.

We also have columns by our regular contributors. Andy Shaughnessy discusses the expanding world of flexible circuit design instruction. Joe Fjelstad explains how flexible circuit technology is slowly but surely making its way into the colleges and universities of the world. And Tara Dunn discusses the benefits of an SMTA pilot program for emerging engineers.

Features

• Industry Experts Talk Flex Design, a conversation with Mike Creeden, Chris Hunrath, and Steven Bowles
• John Michael Pierobon Discusses His Flex Design Class, a conversation with John Michael Pierobon

Columns

• Flex Design Education Opportunities Growing—Slowly, by Andy Shaughnessy, I-Connect007
• Flexible Circuits Go to College, by Joe Fjelstad, Verdant Electronics
• SMTA Pilot Program for Emerging Engineers, by Tara Dunn, Omni PCB

This month, we look into the secret life of vias as the culprit for failures, starting with an article by Greg Ziraldo, director of operations at Advanced Assembly. He explains how to design vias for maximum reliability, echoing the idea that “When it comes to vias, bigger is better.” Then we have a feature interview with consultant Dennis Fritz, who discusses the difference between two terms that are often used interchangeably, “quality” and “reliability,” as well as a proposal to begin allowing the manufacture of DoD PCBs with lead-free solder. And we have a feature interview with Brook Sandy-Smith, IPC’s technical education program manager, who gives a review of the IPC High-Reliability Forum and Microvia Summit and some of the reliability issues that technologists are facing today.

We have columns from our regular contributors Barry Olney of iCD, Stephen Chavez with the IPC Designers Council, Bob Tise of Sunstone Circuits, consultant Tim Haag, and Phil Kinner of Electrolube. We also have a technical article by C.F. Yee of Keysight Technologies, titled “The Impact of Inductance on the Impedance of Decoupling Capacitors.”

Features

• PCB Reliability: Via Design, by Greg Ziraldo, Advanced Assembly
• The Difference Between Quality and Reliability, a conversation with consultant Denny Fritz
• IPC Reliability Forum Wrap-up, a conversation with IPC’s Brook Sandy-Smith

Columns

• Reliability is a Team Sport, by Andy Shaughnessy, I-Connect007
• Stackup Planning, Part 5, by Barry Olney, iCD
• New and Thriving Chapters in Mexico, by Stephen Chavez, MIT, CID+
• Five Best Practices to Ensure Manufacturability, by Bob Tise, Sunstone Circuits
• Customer Support is People Support, by consultant Tim Haag
• Conformal Coatings: How to Design Out Production Problems, by Phil Kinner, Electrolube

Technical Article

• The Impact of Inductance on the Impedance of Decoupling Capacitors, by CF Yee

NEW FLEX007 SECTION!

We open our new Flex007 section with a feature interview with Nikolay Ponomarenko, Altium’s director of product management, who discusses the company’s move into printed electronic circuits design capabilities and how PEC design differs from rigid and flexible circuit design. In our next feature interview, David Wiens—product marketing manager with Mentor, a Siemens Business—details their tools’ latest flex and rigid-flex design capabilities, and some of the challenges that designers face with rigid-flex circuits.

We also have a technical paper by Weifeng Liu, et al., where the authors describe a process for creating flexible hybrid electronics, which combines traditional manufacturing techniques with today’s precision ink technologies. Next, an interview with Philip Johnston, managing director of Trackwise Designs, covers their patented length-unlimited printed circuits, including flexible circuits that measure 26 meters in length.

Further, we have columns by our regular contributors, including an update from I-Connect007’s Patty Goldman. This month, Joe Fjelstad offers details on some recent efforts to make flexible circuits more stretchable. Next, Steve Williams brings us an interview with Prototron’s Van Chiem, who has been instrumental in developing flex and rigid-flex processes at the company’s Tucson, Arizona facility.

Features

• Altium Designer 19.0 Features Printed Electronics Design Functions, a conversation with Nikolay Ponomarenko, Altium
• Mentor Tools: Optimized for Flex and Rigid-flex Design, a conversation with David Wiens, Mentor, a Siemens business
• Development of Flexible Hybrid Electronics, by Weifeng Liu, et at, Flex
• 26 Meters of Flex! a conversation with Philip Johnston and Jake Kelly, Trackwise Designs

Columns

• What the Flex? by Andy Shaughnessy, I-Connect007
• Changing Seasons, by Patty Goldman, Flex007
• Making Flexible Circuits Stretchable, by Joe Fjelstad, Verdant Electronics
• A Conversation with Prototron’s Van Chiem, by Steve Williams, The Right Approach Consulting

Designers were once seen as little more than electronic techs. Now, many designers are starting to realize the power they wield over the whole electronics process. As you’ll learn in this issue, there are plenty of little things that a designer can do to help make the board easier to fabricate and assemble, and even influence the profitability of the final product.

In our first feature, Prototron’s Mark Thompson, CID+, explains why great fabrication jobs always start with solid design practices, and he lays out some of the things a designers should—and should not—do to help make the design more manufacturable. Then, in an interview with our editorial team, Julie Ellis of TTM discusses some of the tips and tricks designers should adopt, especially if their boards are going to be built in Asia. As Julie says, you need to know your fabricator’s capabilities or you could be up a creek without a paddle.

We also have an interview with Al Gaines, founder of HiGain Design Services. He takes “everything starts with design” one step further: Everything starts with documentation, which Al describes as the most critical product that each designer can create. Next, Kelly Dack, an IPC CID designer instructor with EPTAC, introduces us to his idea for the ultimate in DFx: Design for the Unknown, or DFU. Kelly also offers some advice for dealing with one of the newest cogs in the machine: the industrial designer.

Columnist Tim Haag explores the relationship between good PCB design processes and the recipe for a birthday cake; changing one ingredient can change the entire outcome! And we have a short interview that Nolan Johnson conducted with Mike Creeden of San Diego PCB Design. Mike discusses the need to select the appropriate type of laminate as early in the design process as possible.

We also have columns from our regular contributors Martyn Gaudion of Polar Instruments, Bob Tise of Sunstone Circuits, Alistair Little of Electrolube, Barry Olney of iCD, John Coonrod of Rogers Corporation, and Stephen Chavez, CIT, CID+. And CF Yee of Keysight Technologies has written a great piece on crosstalk mitigation for return path discontinuities.

Features

• Everything Starts With Design by Andy Shaughnessy
  
• Fabrication Starts With Solid Design Practices, by Mark Thompson, CID+, Prototron Circuits
• Design is a Pivotal Piece of the Puzzle, an interview with Julie Ellis, TTM Technologies
• It All Comes Down to Documentation, an interview with Al Gaines, HiGain Design Services
• Design for the Unknown, by Kelly Dack, CID+, EPTAC
• Clear Communication Takes the Cake, by Tim Haag, consultant
• Technically Appropriate Material Choices are Key to Design Success, an interview with Mike Creeden, San Diego PCB Design

Columns

• Chapter Check-ins: Orange County, San Diego, and Phoenix, by Steph Chavez, CIT, CID+
• The Future of PCB Manufacturing Doesn't Belong to Robots, but to the Users, by Bob Tise, Sunstone Circuits 
• Modelled, Measured, Mindful: Closing the SI Loop, by Martyn Gaudion, Polar Instruments
• Resins Fit for a Purpose: Failure Mitigation and Environmental Concerns, by Alistair Little, Electrolube
• Practical Evaluations of Glass Weave Effect, by John Coonrod, Rogers Corporation
• The Key to Product Reliability, by Barry Olney, iCD

Technical Article

• Stitching Capacitors: Crosstalk Mitigation for Return Path Discontinuities, by CF Yee

We’ve heard a lot about design rules lately, from designers and manufacturers alike. There just doesn’t seem to be much agreement about design rules: how to set them, manage them, and validate them. We’ve seen how the IC segment has standardized its design rules process; is this sort of alignment possible in PCB design? For this issue, we spoke with a number of design and manufacturing experts about design rules and constraints.

Features

• Design Rules Recipe: Solvability, Manufacturability, and Performance, a conversation with Mike Creeden, Freedom CAD Services
• Design Rules, Simulations, and Analyses, an excerpt from The Printed Circuit Designer’s Guide to… Executing Complex PCBs
• High-speed PCB Design Constraints by Barry Olney
• Altium’s Craig Arcuri on Design Rules: Past, Present, and Future, a conversation with Craig Arcuri
• Mentor’s EDA Perspective on Managing Design Rules, a conversation with Dave Wiens and Mike Santarini
• Rules Keep You from Crossing the Line by Tim Haag
• Board Negotiations: Design Rules and Tolerances by Mark Thompson
• Design Rules: For Your Own Good by Andy Shaughnessy

Columns

• Spotlight on the Orange County Chapter by Steph Chavez, CIT, CID+
• Accurate Gerber Files Are Mission Critical for Smooth PCB Manufacturing by Bob Tise, Sunstone Circuits
• Thermal Management: Why it Should Be High on Your Circuit Protection Agenda by Jade Bridges

Articles

• MCAD Is From Mars, ECAD Is From Venus, by Linda Mazzitelli, PTC

We’ve all heard quite a bit of chatter about smart manufacturing over the past few years. Everyone involved in designing, fabricating and assembling PCBs wants to get on board. But what does this mean for CAD data? What do designers need to do differently to take full advantage of smart technologies such as Industry 4.0 and IPC’s Connected Factory Exchange (CFX)?

We asked some of our expert contributors to share their thoughts and opinions about smart manufacturing and what this means for the PCB designers and design engineers on the front end.

Our first feature is by Patrick McGoff, market development manager, and David Wiens, Xpedition product marketing manager, both with Mentor, a Siemens business. They explain how intelligent design data is a necessity for smart processes, and why the information in a simple bill of materials will not be adequate for manufacturing in the future. Next, columnist Michael Ford, senior director of emerging industry strategy for Aegis Software, discusses some of the challenges ahead for smart design and manufacturing, including the need to embrace “adaptive” planning, which may be best achieved by utilizing a combination of formats such as IPC-2581 for design data and CFX for manufacturing. Then we have a short feature by Editor Happy Holden, who offers a backgrounder on computer-integrated manufacturing and investigates the way CAD data fits into the equation.

Switching gears, Denis Morin, Karel Tavernier, Jean-Pierre Charras, and Marius Matioc of Ucamco take the reader through the new XNC format, a collaboration by Ucamco, KiCad and PentaLogix, which updates the Gerber drill data transfer process. And we have an interview with Robert Huxel, XPLM’s director of business development, who outlines the company’s PLM software and XPLM’s role in integrating ECAD and MCAD data, and he explains why this convergence is so important for the future of PCB design.

Next, there’s a great article by Keysight Technologies’ Chang Fei Yee, who focuses on the impact of copper pour on insertion loss and impedance. We also bring you columns by our regular contributors, including Stephen V. Chavez of the IPC Designers Council, Bob Tise of Sunstone Circuits, Alistair Little of Electrolube, Barry Olney of iCD, and John Coonrod of Rogers Corporation.

Features

• Smart Design Data Is Essential for Industry 4.0 Manufacturing by Patrick McGoff and David Wiens, Mentor, a Siemens Business
• Standards-driven, Digital Design Flow for Industry 4.0 by Michael Ford, Aegis Software
• Automation and the Smart Factory: Introduction to Industry 4.0 by Happy Holden
• XNC Format: Gerber Takes Data into the Future, by Denis Morin, Karel Tavernier, Jean-Pierre Charras, and Marius Matioc
• XPLM: Using PLM to Integrate ECAD and MCAD Data, a conversation with Robert Huxel, XPLM

Columns

• Get Smart! by Andy Shaughnessy
  
• San Diego Chapter Updates and More, by Stephen V. Chavez, CIT, CID+
• Preparing for Tomorrow's Technology Today by Bob Tise, Sunstone Circuits
• Five Tips to Further Improve Resin Encapsulant Performance by Alistair Little, Electrolube
• Fast and Accurate Transmission Line Modeling by Barry Olney, iCD
• How Copper Properties Impact PCB RF and High-speed Digital Performance John Coonrod, Rogers Corporation

Articles

• EM Modeling: The Impact of Copper Ground Pour on Loss and Impedance, by Chang Fei Yee, Keysight Technologies

For this issue, we spoke with a variety of young people who are working in this industry. First, we bring you an interview with Professor Gary Spivey of George Fox University in Oregon. Gary discusses his electrical engineering department, one of the few in existence that provides students with real-world experience designing PCBs.  Nolan Johnson also spoke with two current GFU students, Alex Burt and Jack Whipple, who discuss their PCB designing experience and their plans for the future.

Next, we have a conversation with Nicole Pacino, CID+, a design team leader at Cobham and daughter of Mike Creeden of San Diego PCB. Nicole explains how she got into PCB design by working one of Mike’s designs like a puzzle and never looked back. And Insulectro’s Megan Teta, CID+, explains how she wound up in this industry after studying to be a pharmacist.

We also interviewed Geoffrey Hazelett of Polar Instruments. Geoffrey explains why so many smart graduates are attracted to other fields that are considered “sexier.” And we spoke with Altium’s Andy Johnson about his work in EDA marketing, and he offered advice for young people considering working in this industry.

Circling back to professors, we have a conversation with Pablo Sanchez Martinez, a Spanish student studying engineering at an Austrian college who wants to become a full professor and teach PCB design. And we have an interview with Martijn van der Marel and Roy Arriens, students from Delft University of Technology in the Netherlands. They are members of Project March, which designs and builds exoskeletons that can help paraplegics walk.

We also have columns by our regular columnists Barry Olney, Stephen Chavez, Tim Haag, Phil Kinner, and Bob Tise and Dave Baker.

Features

• George Fox University: Teaching PCB Design to EE Students, a conversation with Professor Gary Spivey
• Putting University Training to Work, a conversation with Jack Whipple
• Preparing to Enter the Workforce with PCB Design Experience, a conversation with Alex Burt
• PCB Design is All in the Family with Nicole Pacino, a conversation with Nicole Pacino
• Megan Teta: PCB Industry Must Work to Attract Young People, a conversation with Megan Teta
• An Experienced Millennial on Hiring the Next Generation, a conversation with Geoffrey Hazelett
• Andy Johnson: EDA a Great Field for Young People, a conversation with Andy Johnson
• From Spain to Austria: A Student’s Drive to Be a Professor, a conversation with Pablo Sanchez Martinez
• Project MARCH Students’ Exoskeleton Helps Paraplegics Walk Again, a conversation with Martijn van der Marel and Roy Arriens

Columns

• The Youth of the Industry by Andy Shaughnessy
  
• The Proximity Effect, by Barry Olney, iCD
• Designer Highlights From IPC APEX EXPO 2019, by Steph Chavez, CIT, CID+
• MakeHarvard 2019: Bigger and Better! by Bob Tise and Dave Baker, Sunstone Circuits
• Think I’ll Go for a Walk, by Tim Haag, consultant
• Important Considerations for Conformal Coating Selection and Performance, by Phil Kinner, Electrolube

Technological advances have made it possible to print circuits on all sorts of traditional and non-traditional substrates, and even materials not even considered substrates. What does a PCB designer need to know in order to design circuits on these alternative materials? We asked our expert contributors to share their insights into printing circuits on some non-traditional materials.

In our lead feature article, columnist Barry Olney of iCD explains why all PCB substrates are not created equal, and why designers need to avoid “flat-earth thinking.” Next, Dan Gamota of Jabil discusses some of the off-the-wall substrates he’s worked with over the years, and why materials such as toughened glass could be great substrates.

Columnists Anaya Vardya and John Bushie of American Standard Circuits discuss microwave bonding methods, and their various effects on loss and dielectric constant. And columnist John Coonrod of Rogers Corporation explains how designers are moving past microwave frequencies to millimeter-wave frequency ranges of 30-300 GHz, and why flexible circuits may be the answer. And we have a great article by CF Yee of Keysight Technologies that focuses on the influence of metal plating on PCB channel loss and impedance.

We also bring you columns from our regular contributors Mark Thompson of Prototron Circuits, Stephen Chavez with the IPC Designers Council, Bob Tise and Dave Baker of Sunstone Circuits, and Jade Bridges of Electrolube.

Features

• Not All PCB Substrates Are Created Equal, by Barry Olney, iCD
• Dan Gamota Discusses Flex and Alternative Substrates, a conversation with Dan Gamota, Jabil
• Microwave PCB Bonding Methods: What Designers Need to Know, by Anaya Vardya and John Bushie, American Standard Circuits
• Higher Frequencies Forge Path for Flexible Circuit Materials, by John Coonrod, Rogers Corporation

 Columns

• Eliminate Confusion, by Mark Thompson, Prototron Circuits
• The Future on Display at DesignCon by Andy Shaughnessy
• Greater Phoenix Chapter Revived, by Steph Chavez, CIT, CID+
• Exploding PCBs: Don’t Lose Track of Voltage in Your Design, by Bob Tise and Dave Baker, Sunstone Circuits
• Thermal Management Materials: Golden Rules for Product Selection, by Jade Bridges, Electrolube

Articles

• 3DEM Modeling: Influence of Metal Plating on PCB Channel Loss and Impedance, by CF Yee, Keysight Technologies

The component shortage is getting crazy. Some PCB designers are finding their favorite capacitors on 50-week and 80-week lead times, or worse. How do you design a board today when the components you need won’t be available for a year or more?

But don’t expect any sympathy from component suppliers; they’ve watched their profit margins continue to shrink over the years, and in their eyes, the OEMs have been reaping the rewards.

Where does this leave you and your next design? This month, we asked our expert contributors to explain the current component shortage, as well as some of the workarounds that can help you get your next design out the door sooner rather than later. In our lead story, LeGrand’s John Watson, CID, discusses how the industry arrived in this predicament, the major drivers behind this problem, and the need to ensure component availability well before beginning to design a PCB.

Next, we have an interview with SnapEDA CEO Natasha Baker. She explains how transparency in online libraries can help designers facing supply chain issues, and she offers strategies for meeting parts availability challenges head-on. Then we bring you a conversation with Digi-Key COO Dave Doherty, who discusses his efforts to keep customers supplied with components during this perfect storm, and the need for designers to look at other options if their component of choice is unavailable in the near term. And automotive PCB designer Carl Schattke, CID+, shares some of his techniques for stackup design, along with some processes that can help designers dealing with component shortages, including the need to make supply chain decisions as early in the design cycle as possible.

We also have columns from our regular contributors Barry Olney, Steph Chavez, Vern Solberg, Tim Haag, Bob Tise and Dave Baker, and Alistair Little. And we bring you a technical article by Simberian President Yuriy Shlepnev on the effects of meshed reference planes on interconnect.

Table of Contents

Features

• The Electronic Component Shortage Crisis: A Veteran Engineer’s Perspective, by John Watson, CID
• Natasha Baker: Supply Chain Transparency Inside the CAD Tool, a conversation with Natasha Baker
• Digi-Key’s Dave Doherty: Tweaking the Supply Chain, a conversation with Dave Doherty
• Carl Schattke on Stackup Design and Managing the Component Shortage, a conversation with Carl Schattke
• Beating Supply Chain Blues by Andy Shaughnessy

Columns

• 10 Fundamental Rules of High-speed PCB Design, Part 5, by Barry Olney, In-Circuit Design
• Cascade Chapter and 2019 Activities, by Steph Chavez, CIT, CID+
• Embedding Components: Part 7, by Vern Solberg, consultant
• A Job Worth Doing, by Tim Haag, consultant
• Selecting the Right Board Thickness—A PCB Designer’s Balancing Act, by Bob Tise and Dave Baker, Sunstone Circuits
• Getting the Best Performance from Encapsulation Resins, by Alistair Little, Electrolube

Technical Article

• The Effects of Meshed Reference Planes on Interconnects, by Yuriy Shlepnev, Simberian

The IPC Designers Council is ready for the new year, new members and maybe even new chapters. They’ve launched a new column in Design007 Magazine, “The Digital Layout,” and they have a plan for the future. But they have plenty of work to do.

This month, we take a look at the Designers Council. During PCB Carolina, we interviewed show managers Randy Faucette, Tony Cosentino, and Lance Olive. They discuss how this show grew out of the RTP Designers Council chapter in Raleigh, and they track the show’s growth over the years.

Next, design instructor Susy Webb discusses how she first got involved with the Designers Council, and why she thinks designers should join their local chapter. She also makes some predictions about the role of the group in the future, especially if more engineers begin doing layout. And Orange County Chapter President Scott McCurdy details how he grew the OC chapter into one of the most popular in the U.S.

Columnist Stephen Chavez highlights the work of the San Diego and RTP chapters, and some of the Designers Council events set for the upcoming new year. Also, Altium’s Judy Warner explains how she succumbed to years of invitations and finally attended her first Designers Council meeting a few years ago, and why you should attend one near you as well.

Speaking of Altium, we also bring you an interview with VP Chris Donato who gives us a preview of the January AltiumLive event in Munich and traces the company’s impressive growth over the past five years. Next, veteran engineers Greg Lucas and Jim Howard unveil a potentially revolutionary process—fractal design—which can reduce edge noise on a PCB and costs absolutely nothing to implement. You’ll also want to read our interview with them. We also have columns from our regular contributors Barry Olney, Vern Solberg, John Coonrod, Alistair Little, and Bob Tise and Dave Baker.

Also in this issue: IPC APEX EXPO 2019 PRESHOW REVIEW. This special section starts on page 36.

Features

• Birds of a Feather: PCB Carolina and the RTP Designers Council, a conversation with Randy Faucette, Tony Cosentino, and Lance Olive
• Susy Webb: The History and Future of the Designers Council, a conversation with Susy Webb
• The Designers Council: A Chapter Primer From the Ground Up, by Scott McCurdy
• Chapter Highlights and Certification Successes, by Steph Chavez
• Why Should You Join the Designers Council?, by Judy Warner

Columns

• 10 Fundamental Rules of High-Speed PCB Design, Part 4, by Barry Olney, In-Circuit Design
• Embedding Components, Part 6, by consultant Vern Solberg
• Skin Depth and Its Interaction with Final Plated Finishes, by John Coonrod
• Key Guidelines for Clean Schematic Designs, by Bob Tise and Dave Baker
• Top Five Tips to Protect PCBs from Harsh Environments, by Alistair Little

Articles

• Altium Prepares for Munich Show as Growth Continues, a conversation with Chris Donato
• A Fractal Conversation with Jim Howard and Greg Lucas by Barry Matties and Andy Shaughnessy
• Fractals: New Tech and IP for Designing 5G PCBs, by Greg Lucas and Jim Howard

The medical electronics market is blowing up, and there doesn’t seem to be a ceiling. A recent report estimates that the global medical device market will reach $409.5 billion by 2023, expanding at a CAGR of 4.5% from 2018 to 2023.

All of this bodes well for PCB designers and design engineers. Medical is one segment that just keeps growing, and more people in our industry are moving into medical every year.

So, for this month’s medical issue of Design007 Magazine, we asked our expert contributors to give us their prescription for best practices in the medical PCB design segment. In our feature story, StarFish Medical’s Kenneth MacCallum discusses some of the trends he’s seeing in medical electronics, and some of the challenges designers face in this evolving market. Next, we have an interview with DfR Solutions’ Dock Brown, fresh from his SMTAI keynote on medical hardware. Dock explains how predictive engineering software can be used early in the design cycle to spot component failures and drive costs down.

Consultant Tim Haag has a great feature column about how electronic medical devices are playing a lifesaving role in his family right now, and why your job matters, even if it doesn’t always seem that way. Then we have an interview with Tamara Jovanovic, a recent graduate and PCB designer at Happiest Baby, a Los Angeles company that makes smart baby beds that safely swaddle and clip an infant into the bassinet so that the parents can get some rest—or take a shower. Finally, we have an interview with Dr. Titu Botos of NeuronicWorks, who discusses IoT and why he believes that the Internet of Body (IoB) could be the “next big thing.”

We also have columns by our regular contributors Steph Chavez, Barry Olney, Vern Solberg, Doug Brooks (with special guest Dr. Johannes Adam of ADAM Research), Istvan Novak, Alistair Little, and Bob Tise and Dave Baker. And we have an article on the effects of fiber weave on high-speed signal integrity by CF Yee of Keysight Technologies. 

Features

• In Medical PCB Design, Innovation Never Stops, a conversation with Kenneth MacCallum
• Dock Brown on Succeeding at Failure Analysis, a conversation with Dock Brown
• What You Do Matters, by Tim Haag
• New Grad Designs PCBs for Smart Baby Beds, a conversation with Tamara Jovanovic
• Internet of Body: The Next Big Thing for Medical, a conversation with Titu Botos

Columns

• Six Tips to Ensure Parts Fit on Your Board, by Bob Tise and Dave Baker, Sunstone Circuits
• 10 Fundamental Rules of High-Speed PCB Design, Part 3, by Barry Olney, In-Circuit Design
• Embedding Components, Part 5, by consultant Vern Solberg
• Measurement-to-Simulation Correlation on Thin Laminate Test Boards, by Istvan Novak
• Internal Trace Temperatures: More Complicated Than You Think, by Douglas G. Brooks, Ph.D., and Dr. Johannes Adam
• Top Tips for Successful Potting, by Alistair Little
• Chapter Roundup and CID+ Certification, by Stephen Chavez

Articles

• Effects of PCB Fiber Weave on High-Speed Signal Integrity, by Chang Fei Yee, Keysight Technologies

You’ve heard the stories. Most CAM departments say that anywhere from 80-100% of designs from new customers are inaccurate or incomplete, often necessitating a Friday afternoon call to the designer, or the job being put on hold. So, what can we do to optimize the design data package and make the handoff to the fabricator as smooth as possible? We asked a variety of industry experts to weigh in on this topic.

Steph Chavez, a CID instructor with EPTAC and IPC Designers Council Executive Board member, explains how designers can break the design data bottleneck, and why it’s so critical that designers and fabricators stay in touch throughout the design cycle. Mark Thompson brings us a feature column that explains what fabricators would like to see in each design data package.

Next, CAM engineers JanNell Taylor and Andy Schilloff of GreenSource Fabrication discuss their preparations for GreenSource’s upcoming entry into the commercial market, and how they will be able to trigger jobs from their off-site location in a different state. Then, Kelly Dack, CID+, discusses many of the ways that designers are inadvertently shooting themselves in the foot by assigning similar or confusing naming conventions to layers of artwork. And we wrap things up with a feature by columnist Jan Pedersen of Elmatica, who explains the need to move design data fully into the digital realm.

This month, we’re introducing a brand-new column, Connect the Dots, by Bob Tise and Dave Baker of Sunstone Circuits, as well as columns from our regular contributors Barry Olney, Vern Solberg, and John Coonrod. We also have an interview with the Designers Council’s Mike Creeden and Steph Chavez, who discuss their upcoming column The Digital Layout, which will launch next month. And we have an article by CF Yee of Keysight Technologies on the impact of routing on multi-gig signal transmissions.

Features

• Steph Chavez: Breaking the Design Data Bottleneck, a conversation with Steph Chavez
• Getting on the Same Page: A Data Story, by Mark Thompson, CID+
• At GreenSource, Lean and Green Starts on the Front End, a conversation with JanNell Taylor and Andy Schilloff
• Design Data: File Naming Conventions, by Kelly Dack, CID+
• Digital Specs for Automated Manufacturing: Find the Missing Link! by Jan Pedersen

Columns

• Despite Progress, Design Data Issues Continue, by Andy Shaughnessy
• New Landing Design to Reduce Thermal Pad Failures, by Bob Tise and Dave Baker, Sunstone Circuits
• 10 Fundamental Rules of High-Speed PCB Design, Part 2, by Barry Olney, In-Circuit Design
• Embedding Components, Part 4: Passive Component Selection and Land Pattern Development, by consultant Vern Solberg
• Different Aspects of Impedance for PCBs, by John Coonrod, Rogers Corporation

Articles

• New Designers Council Column: The Digital Layout, a conversation with Steph Chavez and Mike Creeden
• Impact of Serpentine Routing on Multi-gigabit Signal Transmission, by Chang Fei Yee, Keysight Technologies

Artificial intelligence has been grabbing the headlines a lot over the past few years. It’s one of the hotter segments to watch, especially with drones, robots, autonomous vehicles and virtual reality applications becoming more popular every day. What does AI mean for PCB designers and their EDA tools?
This month, we asked our expert contributors to discuss AI and what it might mean to PCB design and the rest of the electronics industry. Technical Editor Dan Feinberg has been reporting on AI for years, and he offers a look at where AI is now in terms of consumer products, and some of the hurdles that AI faces in the upcoming years. David White of Cadence Design Systems shares his thoughts on Cadence’s work with AI and what it could mean to EDA tools. And Mentor’s Paul Musto explains how the company plans to harness the power of AI, and why old-school PCB designers shouldn’t feel threatened by AI-driven EDA tools.
We have Part 2 of Tom Hausherr’s collection of standard PCB components, and an article by Chang Fee Yee of Keysight Technologies on reducing crosstalk in multi-board interconnect. And Simberian’s Yuriy Shlepnev brings us an article on localizing interconnect structures at speeds above 10 Gbps. We also have columns from our regular contributors Barry Olney of iCD, consultant Vern Solberg, and consultant Tim Haag.

Features
    •    Artificial Intelligence: More Questions than Answers, by Dan Feinberg
    •    Cadence is Bullish on AI, a conversation with David White
    •    Artificial Intelligence: The Future of EDA? a conversation with Paul Musto

Columns
    •    10 Fundamental Rules of High-Speed PCB Design, Part 1, by Barry Olney, In-Circuit Design
    •    Embedding Components, Part 3: Implementing Discrete Passive Devices, by consultant Vern Solberg
    •    Contract Positions: Go the Extra Mile, by consultant Tim Haag

Articles
    •    Standard PCB Component Families, Part 2, by Tom Hausherr, PCB Libraries
    •    Achieving Minimal Crosstalk in Multi-board Interconnect, by Chang Fei Yee, Keysight Technologies
    •    Life Beyond 10 Gbps: Localize or Fail! by Yuriy Shlepnev, Simberian Inc.

Over the past 60 years, packages have continued to evolve, and shrink. The transistor outline “metal cans” of the 1950s would look out of place today. Some packages are no bigger than the period at the end of this sentence, complete with their own “inhalation warning.” Now, more types of packages than ever before that can be mounted on today’s PCBs. But package design is more complex than ever, too. 

For this issue of Design007 Magazine, we asked a variety of package experts to share their opinions about the component package trends of today and tomorrow, as well as some of the drivers behind this evolution. In our first feature interview, Chuck Bauer of TechLead Corporation explains some of the trends he’s seeing in packages, such as fan-out wafer-level and 3D packaging, and the need for new packaging technologies to be scalable and cost-effective. Next, Tom Hausherr provides one of the most exhaustive collections of standard PCB components that I’ve seen, complete with package size codes and dimensions. 

Bill Acito of Cadence Design Systems discusses the many challenges faced by PCB designers and packaging designers, and he offers some new tips and tricks for dealing with ever-denser packages, not to mention time and budget constraints. And Christian Keller of Altium provides an overview of BGA fanout and escape routing, including techniques for using stacked and staggered microvias, blind vias, and via-in-pads. 

We have columns by our regular contributors, including Barry Olney of iCD, John Coonrod of Rogers Corporation, and Alistair Little of Electrolube. And we also have articles by Chang Fei Yee of Keysight Technologies and Yuriy Shlepnev of Simberian. 

Features 

• Chuck Bauer Discusses the Future of Packaging, a conversation with Chuck Bauer 
• Standard PCB Component Families, Part 1, by Tom Hausherr 
• PCB Design Challenges: A Package Designer’s Perspective, by Bill Acito 
• BGA Fanout Routing Overview, by Christian Keller
• The Whole Package, by Andy Shaughnessy

Columns 

• It’s a Material World, by Barry Olney, In-Circuit Design 
• Transitioning from FR-4 to High-Frequency Materials, Revisited, by John Coonrod, Rogers Corporation 
• Testing Time for Resins, by Alistair Little, Electrolube 

Articles 

• The Impact of PCB Dielectric Thickness on Signal Crosstalk, by CF Yee 
• Moving From 28 Gbps NRZ to 56 Gbps PAM-4: Is it a Free Lunch? by Yuriy Shlepnev, Simberian Inc.

For the past decade or so, we’ve watched as North America’s PCB designers began reaching retirement age. The problem is that not many young people are entering the field of PCB design, and outgoing senior designers’ positions are increasingly being covered by design engineers. This month, we ask, “Who are the next generation of PCB designers?”

Our first feature is an interview with Fairfield Geotechnologies’ Susy Webb, who has been teaching her class “The Basics of PCB Design” at PCB West for years. Over time, Susy’s attendees have switched from a roomful of designers to almost entirely engineers, so we asked he shared her thoughts and a few stories about educating the next generation of PCB designers.

Next is an article by Mike Creeden of San Diego PCB. Mike discusses the “changing of the guard,” some misconceptions that managers have regarding the art of PCB layout, and why asking electrical engineers to design today’s high-speed PCBs may be easier said than done. Our third feature is an interview with Mentor’s Paul Musto, who explained the company’s relationship with universities, and the need for designers to have an exhaustive knowledge of the fabrication process, which many electrical engineers may lack as they start designing boards.  

Columnist Tim Haag channels Peter, Paul and Mary by asking, “Where have all the designers gone?” He discusses the need for the “old guard” of PCB designers to pass on their knowledge to the youngsters, and some of the ways the job requirements for a designer have evolved over the years. And in a feature interview, Bryan LaPointe and Dan Fernsebner of Cadence Design Systems explain how designers of Generation Z will differ from their predecessors, and what can be done to bring more smart, young people into the design community.

We also have columns from regular contributors Barry Olney and Phil Kinner, as well as a great technical article from Yuriy Shlepnev, president of Simberian Inc.

Features

• Susy Webb: Training the New Generation of Designers, a conversation with Susy Webb
• Help Wanted: PCB Design Layout Specialist, by Mike Creeden, CID+, MIT
• Mentor Preparing for Next-Gen PCB Designers, a conversation with Paul Musto
• Where Have All the Designers Gone (and Who Will be Taking Their Place)? by Tim Haag
• In With the New at Cadence, a conversation with Bryan LaPointe and Dan Fernsebner

Columns

• Crosstalk Margins, by Barry Olney, In-Circuit Design
• Are Solvent-Free, Water-Based Coatings Reliable? by Phil Kinner, Electrolube

Articles

• Advanced Stackup Planning with Impedance, Delay and Loss Validation, by Yuriy Shlepnev, Simberian Inc.

Over the past few decades, we’ve seen a gradual expansion of the number of multi-board electronic devices. Products are more complex now, plain and simple. There’s no way that anyone could build a car, not to mention an autonomous car, with a single PCB in 2018.

For our June issue, we have a variety of features that are chock-full of multi-board design information. In our first interview, Dave Wiens of Mentor discusses multi-board design techniques, from a 30,000-foot view down to a nuts-and-bolts board level, including the various trade-offs that occur throughout the design cycle. Zuken’s Bob Potock provides a technical article on the 3D convergence of multi-board PCB and IC packaging design, and the importance of ECAD and MCAD collaboration. And in an interview, Ben Jordan of Altium breaks down many of the challenges related to multi-board design, and some of the techniques that can simplify complex designs. As Ben says, “It’s not a complicated concept.”

We have columns from our regular contributors. Barry Olney of In-Circuit Design explains DDR3 and DDR4 fly-by topology termination and routing, while John Coonrod of Rogers Corporation discusses exceptions designers might encounter when comparing material data sheets. And Jade Bridges of Electrolube shines a spotlight on the selection of thermal management materials. We also have an article from Chang Fei Yee of Keysight Technologies that outlines the best methods for achieving signal integrity during layer transition in high-speed boards.

Features:

• Dave Wiens Discusses Multi-board Design Techniques, a conversation with Dave Wiens
• 3D Convergence of Multi-board PCB and IC Packaging Design, by Bob Potock
• Multi-board Design with Altium’s Ben Jordan, a conversation with Ben Jordan

Columns:

• Multi-board Design: Multiple Challenges?, by Andy Shaughnessy
• DDR3/4 Fly-by Topology Termination and Routing, by Barry Olney, In-Circuit Design
• Considerations for Comparing Material Data Sheets, by John Coonrod, Rogers Corporation
• Thermal Management Materials: Easing the Decision-Making Process, by Jade Bridges, Electrolube

Articles:

• Achieving Optimum Signal Integrity During Layer Transition on High-Speed PCBs, by Chang Fei Yee, Keysight Technologies

We’ve all heard plenty about 5G lately. The transition from 3G to 4G meant a 10x increase in speed, but 5G will be at least 1,000 times faster than 4G. What does 5G mean to PCB designers and manufacturers?

For this month’s issue on 5G technology, we asked a variety of contributors to help us flesh out what this all means to PCB designers and manufacturers. In our expert’s discussion, John Hendricks of Rogers Corporation discusses Rogers’ plans to field high-speed materials for 5G applications, and Ben Jordan of Altium explains what 5G means for EDA software tool providers. Next, Technology Editor Dan Feinberg focuses on how 5G will affect our industry, and who won’t be affected by this change. CF Yee of Keysight Technologies has a feature article on PAM-4 and its application in 400Gb Ethernet to support the huge traffic volume expected with 5G. And John Coonrod of Rogers discusses the challenges that 5G presents to laminate manufacturers, who will have to contend with microwave frequencies below 6 GHz and millimeter-wave frequencies about 30 GHz.

We also have columns from regular contributors Barry Olney, Tim Haag, and Alistair Little, as well as an interview with columnist Mark Thompson and an article on constraint-driven design by Zuken’s Ralf Bruening.

Features

• Experts Discussion: What Does 5G Mean to Materials and EDA Tools, a conversation with John Hendricks and Ben Jordan
• Dan Feinberg Discusses Implications of 5G, a conversation with Dan Feinberg
• Paving the Way for 400Gb Ethernet and 5G, by CF Yee
• Making the Most of PCB Materials for 5G Microwave and mmWave Amps, by John Coonrod

Columns

• 5G: It's Kind of a Big Deal, by Andy Shaughnessy
• Common Symptoms of Common-Mode Radiation, by Barry Olney, In-Circuit Design
• Hiring the Right PCB Designer, by Tim Haag, consultant
• Protecting PCBs from Harsh, Challenging Environments, by Alistair Little, Electrolube

Articles

• Mark Thompson: What Designers Need to Know about Fab, a conversation with Mark Thompson
• Faster Board Speeds Demand Constraint-Driven Design, by Ralf Bruening

New developments in electronics are pushing automotive technologists to new levels of innovation every day, and the automotive segment is now driving much of today’s PCB design and manufacturing efforts. We’re headed into a brave new world, with autonomous and electric vehicles leading the way. But what does this mean for PCB designers and design engineers? For this issue of Design007 Magazine, we asked our expert contributors to discuss the world of automotive electronics, and what all of this innovation means for PCB designers.

In our experts interview, Editor Dan Feinberg reviews the evolution of AI, autonomous cars, and electric vehicles, including what he’s seen in years of covering CES for his column. Zuken’s Humair Mandavia discusses the company’s EDA tools and focus on the automotive electronics market. Thomas Wischnack of Porsche Engineering Services explains how Porsche approaches PCB and hardware development, and offers tips for new PCB designers. James McLeish of DfR Solutions highlights his company’s high-reliability test software that is used by autonomous vehicle developers.

Next, Tarun Amla of ITEQ discusses ITEQ’s focus on developing PCB materials for autonomous and electric vehicles, as well as 5G technology. Pete Christiansen of Magi Scitech shows us the company’s new graphene heat sink, which offers thermal management capabilities for automotive and household electronics. And EDADOC’s William Zhou and Wen Ling discuss their longtime design of automotive PCBs, which has made the company one of the biggest forces in the automotive electronics industry in China.

We also have columns from our regular contributors Mark Thompson, Barry Olney, Phil Kinner, and John Coonrod, as well as interviews with Dorine Gurney and Ken Taylor of Polar Instruments, and Anaya Vardya and John Bushie of American Standard Circuits.

Features

• Experts Discussion: Dan Feinberg on Automotive Electronics, a conversation with Dan Feinberg
• Zuken Pulling Ahead in Automotive PCB Design, a conversation with Humair Mandavia
• Porsche Engineering…by Design, a conversation with Thomas Wischnack
• Autonomous Vehicle Electronics: Reliability Challenges and Solutions, by James McLeish
• ITEQ Ready for Autonomous and Electric Vehicles of the Future, a conversation with Tarun Amla
• Graphene Heat Sinks: Thermal Management Options, From Autos to Tablets, by Pete Christensen
• EDADOC a Driving Force in China’s Automotive Electronics Design, a conversation with William Zhou and Wen Ling

Columns

• Refining Output Data Packages for Fabricators, by Mark Thompson, Prototron Circuits
• A Review of HyperLynx DRC, by Barry Olney, In-Circuit Design
• Avoiding Conformal Coating Failures, by Phil Kinner, Electrolube
• Not All PTFE Laminates are the Same, by John Coonrod, Rogers Corporation
• Baby, You Can Drive My Car, by Andy Shaughnessy

Articles

• Interview: Incoming and Outgoing Presidents of Polar Instruments, a conversation with Dorine Gurney and Ken Taylor
• American Standard Circuits Discusses New RF/Microwave eBook, a conversation with Anaya Vardya and John Bushie

For this issue of Design007, our expert contributors discussed their newest tools and technology. First, Editor Kelly Dack sits down with Sam Chitwood of Cadence Design Systems to discuss the newest Sigrity power integrity software, and how it may help designers preclude so-called “exothermal events.” Chuck Ferry of Mentor explains how HyperLynx now allows designers to automate SERDES channel validation early in the design process.

Columnist Tim Haag examines some of our newest technology and ponders whether this will help draw more young people into a PCB design career. Natasha Baker of SnapEDA explains how her small company creates so much of its technology from scratch, and how it has allowed the company to grow so much in only five years. And Arno Kolk of the Estonian Electronics Industries Association discusses the explosive growth of technology in his country in the past few decades.

We also have columns from our regular contributors Barry Olney and Alistair Little, as well as an interview with Nechan Naicker of EDA Technologies, a design engineering company based in South Africa.

Features

• Cadence’s Sigrity Automates Power Integrity Simulation Earlier in Design Cycle, a conversation with Sam Chitwood
• Mentor’s HyperLynx Automates SERDES Channel Design, a conversation with Chuck Ferry
• Will Cool Technology Attract the Next Generation of PCB Designers? by Tim Haag
• SnapEDA Harnesses Technology in Providing Verified Parts, a conversation with Natasha Baker
• Estonia a Hot Spot for New Technology, a conversation with Arno Kolk

Columns

• IPC APEX EXPO, Tools and Technology, by Andy Shaughnessy, I-Connect007
• AC/DC is not Just a Rock Band, by Barry Olney, In-Circuit Design
• FAQ: Encapsulation Resins, by Alistair Little, Electrolube

Articles

• South African Electronics Industry Going Strong, a conversation with Nechan Naicker

How do you feel about your suppliers’ customer service? How do your customers feel about your service? Every company in our industry claims to put the customer first, but what does that mean in a firm’s day-to-day operation? How well do you know your customers?

For this month’s issue, we asked a variety of industry experts to weigh in on the venerable customer. For our experts interview, Sunstone Circuits’ Nolan Johnson and our columnist Dan Beaulieu had a rousing discussion about what it takes to satisfy a customer, and how far a company can—and should—go to please that customer. Next, we have an interview with Jay Gorajia of Mentor, who discusses the company’s consulting services and the group’s focus on the “digital twin.” Then, we feature an interview with Ben Jordan of Altium, who explains how the latest tool upgrade was driven by customer demand, as well as the many methods Altium uses to acquire and measure customer satisfaction. And consultant Tim Haag, formerly in tech support for an EDA vendor, tells us what designers really want, along with a few horror stories.

We also have columns from our contributors Barry Olney, Martyn Gaudion, and Phil Kinner, and we’d like to welcome our newest columnist, John Talbot of Tramonto Circuits as well. Lastly, we have an article by Hemant Shah and Ed Acheson of Cadence Design Systems on the latest IPC-2581 updates, and an article on NPI by Dora Yang of PCB Cart.