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Educational Highlights From the APEX EXPO 2026 Show Floor

APEX EXPO 2026 featured many legacy treasures, but it was the inaugural year for the Technology Pavilion, which featured 10 speakers over two days. It was just one feature on the show floor that specifically highlighted technical learning and innovation. Topics presented at the Technology Pavilion included copper nanoparticle inkjet printing on rigid PCBs, how AI and collaboration can level up an electronics supply chain, accelerating the design-to-manufacturing flow, and automated spatial micro-sectioning.

The Electronics Foundation: Empowering Students, Strengthening Industry

The Electronics Foundation may be one of the industry’s best-kept secrets, but its impact is anything but small. In this interview, Charlene Gunter and Gentry Manning discuss how the Foundation is building a pipeline of future electronics professionals through student chapters, scholarships, hands-on STEM programs, and global outreach. From high schools to universities, and from soldering kits to career exploration, they share how meaningful industry engagement is opening doors for students while helping manufacturers address workforce needs.

Webinar Review: The Challenges of UL Certification for Flex and Flex-Rigid PCBs

UL certification is one of an engineer’s least favorite topics, yet it is critically important. The process is complicated but relatively straightforward for standard rigid PCBs, but as Jan Pedersen makes clear in NCAB Group’s recent webinar, “UL Approval for Flex and Flex-Rigid PCBs,” it is a very different story.

When Layout Learns: This Is Not Your Mother’s Auto-router

For decades, automated PCB layout has carried a reputation designers would rather forget. Ben Jordan understands the skepticism. With roots in both engineering and EDA product leadership, he’s seen the promise and the pitfalls up close. Now at Quilter, Ben is helping reshape what machine-driven placement and routing can deliver. Powered by reinforcement learning and modern compute, Quilter is tackling the backlog, iteration overload, and talent shortage facing design teams today.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been a busy week for many of us traversing the conference halls and exhibition floor at APEX EXPO in Anaheim, California. This is the 26th event since it was renamed APEX EXPO in 2000. For those who love trivia, and in reverence to the founders, a more accurate accounting is that 2026 marks its 33rd year, beginning in 1994 as the IPC Printed Circuits Expo. It’s always a great time to convene with old friends, colleagues, and customers, as well as to meet exciting new companies and individuals with interesting things to share. And afterwards, it’s always nice to get home.

Is AI in Design the Magic Tonic for All That Ails Us?

In electronic systems design, engineering teams are pressured by management to adopt AI wherever possible to reduce design cycle time and cost. Engineers look at AI with a wary eye: Will it consistently return accurate results? Will it take longer to set up, train, run, and verify than doing it manually? Will it replace me? Yes, there is a transition with AI, but it’s no different than any other form of automation. It must be extensively

APEX EXPO Opens Today With Ribbon Cutting and Sold-Out Show Floor

APEX EXPO officially opens today with a ribbon-cutting ceremony welcoming attendees onto the sold-out show floor in Anaheim, California. Standards committee meetings and professional development courses have been underway since the weekend, but Tuesday marks the official opening of the exhibition as more than 400 exhibitors prepare to showcase their latest equipment, materials, and technologies across 140,000 square feet of exhibit space.

From PEDC to APEX: Banyan.eco’s Disruptive AI for EMS and OEM Companies

The electronics industry’s struggle with supply chain resilience and increasing regulatory complexity has created a costly compliance challenge for OEMs and EMS providers alike. At the same time, advances in artificial intelligence are opening new possibilities for automating some of the industry’s most data-intensive tasks. At the Pan-European Design Conference (PEDC), Banyan.eco cofounder Francis D’Souza introduced a new approach that combines AI-driven data acquisition with a deterministic verification layer to eliminate compliance risk from AI hallucination and dramatically improve productivity.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Cue up “The Final Countdown, the monster ’80s hit song by Swedish band Europe, because it’s almost APEX EXPO week. Side note: When it comes to rock anthems, I’m more of an “Eye of the Tiger” man, myself. Some folks are already arriving in Anaheim, as standards development committee work starts as early as tomorrow. The show continues through Thursday, March 19.

I-Connect007 to Launch Weekly Show & Tell Newsletter Series Featuring APEX EXPO Highlights

Building on our tradition of delivering comprehensive coverage of APEX EXPO 2026, I-Connect007 will present a five-episode Show & Tell Newsletter series, arriving in subscribers’ inboxes each Friday, March 27 to April 24. The special series will highlight key moments from the Global Electronics Association’s annual trade show, offering readers an inside look at the people, companies, and ideas shaping the electronics manufacturing industry.

T-type Thermocouples in Foil Heater Technology

This article examines the use of T-type thermocouples implemented with flexible printed circuit and etched foil heater technology, focusing on their design, fabrication, and integration into advanced thermal management systems. I’ll give particular attention to how their low-profile construction, accuracy at low temperatures, and mechanical robustness make them well-suited for critical devices operating in demanding environments

Automating the Repeatable Parts of Hardware Design

Despite working on some of the most sophisticated technology in the world, many hardware engineers still rely on spreadsheets, tribal knowledge, and sometimes, quite literally, pen, paper, and a highlighter. Delivering new hardware products on schedule often comes down to finding a needle in a haystack disguised as a 900-page specification or datasheet. AllSpice.io set out to automate the repeatable parts of hardware design: the well-defined, rules-based tasks that make sure nothing gets missed and everything lines up.

UHDI, AI, and RF Materials: Signals From the Next Phase of Advanced Packaging

The upcoming issue of Advanced Electronics Packaging Digest explores several developments shaping the future of advanced electronics, from the convergence of IC substrates and ultra-high-density interconnect (UHDI) PCBs to the growing influence of artificial intelligence on semiconductor packaging and the materials science behind high-frequency system performance.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, I’m highlighting a book, a podcast, a magazine, winners of the APEX EXPO Technical Conference, and a narrative-style column. Not only do these published pieces vary in style, but they also examine the electronics industry from a variety of perspectives. From test to materials, trade show storytelling, and thought leadership, I-Connect007 has the industry covered.

New Book Explores How UV Technology Is Transforming Electronics Protection, Efficiency, and Sustainability

I-Connect007 announces the release of The Printed Circuit Designer’s Guide to…™ UV Curable Conformal Coatings. Authored by respected industry technologists Brian Chislea and Cody Schoener, PhD, of Dow, Inc., this new book offers a comprehensive exploration of UV-curable conformal coatings and their expanding role in improving the protection, performance, and sustainability of electronic assemblies.

Making AI Practical for PCB Design

Artificial intelligence has entered nearly every corner of engineering software. In PCB design, however, meaningful adoption has been slower and for good reason. Unlike image generation or text analysis, PCB layout is not a data-rich, rules-light problem. It is a precision-driven engineering discipline in which creativity, accuracy, and strict compliance with constraints must coexist. Zuken’s work on AI-assisted PCB design reflects this reality. Rather than positioning AI as a replacement for engineering expertise, our CR-8000 Autonomous Intelligent Place and Route (AIPR) applies machine learning selectively in ways that align with how designers actually think and work.

Professional Development Courses for Every Electronics Manufacturing Sector

Professional Development Courses at APEX EXPO are designed to give electronics professionals focused, instructor-led learning that connects directly to today’s manufacturing realities. The courses are offered Sunday, Monday, and Thursday, and allow attendees to build new skills while still taking part in the broader APEX EXPO experience.

Finding the Funny: Jan McInnis Headlines Women in Electronics Keynote

In an industry driven by precision, deadlines, and innovation, laughter may not be the first tool professionals think to reach for, yet it’s one that can transform workplace culture, elevate collaboration, and boost personal well-being. Jan McInnis, comedian and humor strategist, presents “Finding the Funny” for the Women in Electronics Keynote, from 6 to 7:30 p.m. March 18, at APEX EXPO.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s time for my five must-reads featured this past week. The global economy is still reeling from last Friday’s U.S. Supreme Court ruling that most tariffs imposed under IEEPA by President Trump are unconstitutional. In other news, with APEX EXPO just two weeks away, we're featuring the first three Real Time with... pre-show sponsor interviews: Remtec, Burkle North America, and KYZEN. These are insightful and forward-thinking interviews about what you can expect to see at the show this year. Please check them out!

DesignCon 2026: From Copper to Quantum to Agentic AI

Greetings from “balmy” Santa Clara, where DesignCon 2026 is officially underway. The conference began in 1995 as Design SuperCon, and now in its 31st year, remains Silicon Valley’s annual summit for signal and power integrity pros. As I walked into the hotel next to the Santa Clara Convention Center, I could sense echoes of the thousands of football fans who packed the area just weeks ago for the Super Bowl. For me, though, DesignCon is the big game, where our industry’s MVPs take the field to show how fast the technology playbook is evolving.

Technology Pavilion Debuts at APEX EXPO 2026

Many of the technologies shaping the future of electronics manufacturing, particularly in areas such as 3D integration, digital manufacturing, advanced design workflows and automated metrology, are moving faster than traditional publication and standards cycles. The APEX EXPO 2026 Technology Pavilion will bring technology innovators such as these to the forefront, through a dedicated space where emerging tools, approaches, and early-stage breakthroughs can be shared with attendees.

NCAB Group White Papers: Practical PCB Design Guidance for Manufacturable Results

The I-Connect007 Industry Resource Center brings together expert white papers that help engineers and manufacturers navigate today’s design and manufacturing challenges across the PCB lifecycle. NCAB Group contributes a valuable collection of white papers focused on practical PCB design and manufacturability. Drawing on their experience with a global network of production partners, NCAB helps engineers align design intent with fabrication realities: reducing risk while improving consistency and long-term reliability.

Real Time with... APEX EXPO 2026: Remtec Expands Microelectronics Assembly

Julio Castillo and Chris Dougherty from Remtec discuss their expanded capabilities in microelectronic assembly, including chip and wire and multi-chip module component attachment. They highlight their expertise in ceramic substrates for high-reliability, high-power, and harsh environment applications, offering integrated solutions.

Big Ideas Take the Stage: APEX EXPO 2026 Keynotes

Some of the most consequential conversations in electronics manufacturing will take center stage at APEX EXPO 2026, with a keynote lineup that spans quantum computing, advanced packaging, artificial intelligence, and the global electronics economy. From IBM and Intel technologists to an AI futurist and a global industry leader, this year’s keynote speakers will offer attendees both technical depth and strategic perspective on the forces reshaping the electronics ecosystem.

I-Connect007 Launches Six-Part Podcast Series Highlighting the Critical Role of PCB Materials

I-Connect007, the leading media source for the electronics manufacturing industry, today announced the release of the first episode in a new six-part podcast series, “PCB Materials: The Backbone and Future of Electronics.”

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Frankly, there were so many worthy news items this week, it quite a bit of whittling to get it down to my five must-reads. For example, this week we showcased Schweitzer Engineering Labs’ new manufacturing facility in Moscow, Idaho. Marcy LaRont launched an On the Line With… podcast on materials, and the February issue of I-Connect007 Magazine features the annual APEX EXPO preview.

UHDI Fundamentals—Foundations and Drivers of the PCB Flex: Advanced Packaging Nexus, Part 1

The electronics industry is undergoing a fundamental transformation driven by demands for smaller form factors, higher performance, and greater functional integration. Two technologies sit at the center of this transformation: flexible PCBs and advanced semiconductor packaging. In this article, I’ll explore the technical foundations and key forces driving this convergence. Flexible PCBs are electrical interconnects fabricated on bendable substrates such as polyimide or polyester. Unlike rigid PCBs, flex circuits can conform to three-dimensional shapes, enabling designers to route signals through space rather than across flat planes.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, I’ve taken some extra time to better learn some video and photo editing software programs we use at I-Connect007. You’ll want to check out my LinkedIn video to see how I brought my avatar to life for this week’s must-reads! The items I’m highlighting this week are also about learning something new, from Pete Starkey’s thorough three-day review of the EIPC Winter Conference in Aix-en-Provence, France, to what’s on the horizon for advanced electronics packaging. I also share details about the new Design Village at APEX EXPO 2026, preview a new column from Remtec’s Chandra Gupta, and discuss why marketing isn’t a one-and-done deal.

Proper Plane Design Techniques

Continuing our discussion from the November issue of Design007 Magazine on proper plane design, Kris Moyer, an instructor for the Global Electronics Association, shares techniques he teaches his PCB design students to use. When it comes to plane design, there are several challenges with modern high-speed designs. Planes, or more specifically, mirror/return paths, are critical to proper controlled impedance transmission line design. Additionally, to mitigate high-speed switching “noise,” the use of planar capacitance is now necessary and critical.

PCB Design in 2026 and Beyond

We asked several experts in PCB design and fabrication about the pressures shaping PCB fabrication today, including speed, density, geopolitics, and relentless technological complexity. The results were valuable insights about where we are, where we’re headed, and importantly, what it will take to get there. Here is Filbert (Fil) Arzola's view of what will be most important and influential for PCB designers going into 2026 and beyond.

I-Connect007 Announces Newest Columnist Chandra Gupta of Remtec

I-Connect007 is excited to announce its latest columnist, Chandra Gupta, whose new column, Below the Surface, will explore what truly determines performance in advanced electronic packaging, long before a product ever reaches assembly or test. Gupta is a seasoned practitioner who cuts through industry buzzwords to explain how substrate physics, materials, and manufacturing realities actually govern performance in high-reliability electronics.

February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging

I-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.

Design Village: Bringing the Design Community Front and Center

When APEX EXPO returns to Anaheim in March, PCB designers and design engineers will find a new hub on the show floor: the Design Village, a dedicated exhibition area launched by the Global Electronics Association to elevate the design experience and foster deeper engagement across the electronics ecosystem.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Here’s the thing about time travel. You can’t just manipulate the time dimension; you have to move in three-dimensional space as well. That’s because Earth orbits a star, which orbits a galaxy, which is on its own path through three-dimensional space. Our planet follows a complex corkscrew-like path through the universe, covering great distances in just seconds. Build a time machine like HG Wells envisioned, and even a short jump in time means that Earth has moved, and you’re now floating in the void of space. Unsettling, to be sure.

PEDC: Built for the Design Community by the Design Community

The Pan-European Electronics Design Conference (PEDC) was developed to provide Europe’s electronics design community with a non-commercial, Pan-European, technologically advanced forum. PEDC 2026 delivered exactly that. This second edition of the conference brought together 130 participants from 23 countries across Europe and beyond for two days of technical exchange, discussion, and connection. Hosted by the Global Electronics Association and Fachverband Elektroniksdesign und-fertigung e.V. (F.E.D)., and supported by Altium, Siemens, and Zuken, the event featured three technical tracks, 36 presentations, three keynotes, and a group of exhibitors.

What Makes Modern PCB Design So Difficult

PCB design has undergone a fundamental yet exhilarating transformation over the past two decades.  It truly feels like we're always pushing the boundaries of what's possible, which significantly increases the potential for a whole new set of challenges, and why we must always be forward-looking when it comes to the evolution of PCB design. Once viewed primarily as a physical realization of a schematic, the PCB is now a critical performance-determining element of nearly every advanced electronic system.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s the last week of January, and it’s been pretty cold outside. That’s the best time to hunker down and catch up on your reading. Here are my top five must-reads for this week. All eyes continue to be on advanced electronics processes and packaging technology, which are highlighted in Pete Starkey’s review of the ICT winter conference in the UK, as well as Nolan Johnson’s article on inflection points, and Kris Moyer’s look forward into what will be important for PCB designers in 2026 and beyond. Candor Industries’ Sunny Patel discusses “Normalizing the Impossible” in his look forward, and Mike Jouppi contributes with his critical look at what IPC-2152 does not cover.

Beyond IPC-2152: Creating Technology-specific Current-carrying Capacity Design Charts Using Thermal Modeling

Designers commonly size traces using online calculators based on IPC-2221 or IPC-2152 charts, selecting width and thickness for a given current and allowable temperature rise (ΔT). Consideration is given to parallel conductors, although this is not a practical evaluation method for most designs. An important aspect of trace heating, especially groups of traces, is the power dissipated by the conductors. Unfortunately, the power dissipation or a method for accounting for power losses in the traces/conductors or planes is not straightforward.

Designing for Reliability: Why Understanding Materials, Cleanliness, and Lifecycle Matters More Than Ever

Before a product enters manufacturing—long before the first panel hits the assembly line—its reliability is determined by a series of fundamental design decisions. At productronica, Tiberiu (Tibi) Baranyi of Flex presented a comprehensive presentation on design for reliability, providing real-world case examples that illustrated the unfortunate outcomes of decisions that caused failures, and which should have been made differently.

MacDermid Alpha White Papers: Practical Materials Guidance for Modern Electronics

The I-Connect007 Industry Resource Center brings together technical white papers from leading suppliers to help electronics professionals navigate today’s manufacturing and reliability challenges. Built as an educational hub, the Resource Center connects engineers and manufacturers with application-focused guidance on materials, processes, and performance considerations shaping modern electronics.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Lately, I’ve been thinking a lot about storytelling. Partly because I’m reading "Creativity, Inc.," by Ed Catmull, and partly because it’s impossible to separate Pixar’s success from the power of the stories it tells, both on screen and behind the scenes. Everything matters to Pixar—from the technology to the leadership—but what makes Pixar truly special is the stories it tells about human emotions. They make our human complexity understandable.

The Evolution of PCB Design from 2D Layouts to 3D Structures

Kris Moyer is an experienced PCB designer, instructor, and industry expert with a strong focus on advancing design best practices and workforce development. As an instructor at Sacramento State University, he helps prepare the next generation of electronics designers. He also serves as an instructor for the Global Electronics Association, delivering professional training aligned with IPC standards and emphasizing practical, manufacturable design practices.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

I was in Chicago this week, where the weather went from sunny and 45° F on the day I arrived to snow and ice by the next morning. As a California/Arizona native, let’s just say I love the look of snow much more than I love driving in it.  Still, I am grateful to have been part of some genuinely fun teambuilding with my colleagues at the Global Electronics Association. My must-reads for this week are a diverse grouping of articles and columns, ranging from printed electronics and additive manufacturing to a comprehensive overview of the European EMS and PCB markets to marketing wisdom and, finally, a book to help you reach your full potential, personally and professionally.

Upcoming Issue: Design, Integration, and the Global Push for Advanced Packaging

The upcoming Jan. 19 issue of Advanced Electronics Packaging Digest examines how advanced packaging is redefining system integration, regional semiconductor strategy, and the materials and technologies shaping next-generation electronics. From interposer design challenges to global collaboration and substrate innovation, this issue offers timely insight into where the industry is headed in 2026 and beyond.

Where Electronics Manufacturing Turns for Trusted Technical Insight

In an industry defined by rapid innovation, increasing system complexity, and mounting pressure to deliver reliable products faster, access to credible technical insight is more important than ever. I-Connect007’s Industry Resource Center was created to serve as a centralized, freely accessible library of in-depth whitepapers that address the challenges facing today’s electronics professionals.

Solving the Puzzle of a Work-Life Balance

Experts say that maintaining a proper work-life balance can lead to happier employees overall and increased productivity on the job. For me, the work-life balance can be a constant troublesome issue as I tend to lean more toward enjoying overworking and putting aside life issues and options. I admit I am a workaholic even into my golden senior years of engineering employment. I can’t help it; I enjoy solving problems and puzzles and producing solid engineering solutions.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Happy New Year, everyone! This year promises to be a year of evolution and change. If you didn’t catch Michelle Te’s video review of the most-read stories of 2025, be sure to visit our LinkedIn page for the update. Expect to see changes here at I-Connect007 in 2026 as well. We’re cooking up new ways to better bring you the kind of coverage we do best: reporting that gets under the surface. We’re always asking, “What does that mean to the industry?”

Design007’s Top 10 Reader’s Picks for 2025

The design dynamic duo, Design007 Magazine and the Design007 Week newsletter, covered a wide range of topics in 2025. Here are the top 10 design-related articles, columns and news reports for the year. This list, comprised of two columns, three articles, and five news items, relies entirely on readership numbers, making for as fair a comparison as possible. 

I-Connect007 Welcomes New Columnist Brian Buyea: Powering the Future

I-Connect007 is excited to announce the addition of its newest columnist, Brian Buyea, president of Remtec, Inc. His column will appear regularly in I-Connect007 magazines and newsletters. Every generation of electronic innovation faces the same invisible enemy: heat. As power levels rise and footprints shrink, the battle for reliability, performance, and longevity comes down to one question: How well can you move the heat?

Voices of the Industry Podcast Examines Ceramic Substrates and Collaborative Manufacturing With Remtec

Ceramic substrates continue to gain attention as electronics designers seek performance, reliability, and thermal advantages beyond traditional PCB materials. In the latest episode of Voices of the Industry, host Nolan Johnson welcomes Brian Buyea, president of Remtec, for an in-depth discussion on why ceramic substrates are an increasingly compelling option.

How a Business Owner Builds Boundaries

Complete discipline to an exercise routine has been key to helping PCB designer and business owner Zach Peterson relieve stress. Though running a company leaves little room to completely disconnect, he protects evenings and weekends for his family. His advice: Treat your health, relationships, and personal time as essential investments, not afterthoughts.

UHDI Fundamentals: An Overview of UHDI Layer Types

UHDI layer types include core, sequential lamination build-up; microvia; embedded and passive antennas and inductors; and embedded functional, protective, and hybrid rigid-flex layers. Together, they enable ultra-fine features, dense interconnects, high-frequency performance, and miniaturized system designs. UHDI typically requires multiple SBU cycles, where thin dielectric and copper layers are drilled for microvias, plated, imaged, and laminated sequentially to build up to the final design from the inside out.

I-Connect007 Editor's Choice: Five Most-Read Articles for 2025

Happy New Year! As we begin 2026, I would like to pause and reflect on our most-read articles from 2025. They give us insight into what you’re focused on, and what you’re trying to understand, prepare for, and improve. Each piece earned its place through relevance, depth, and sustained reader engagement.

Advance Your Electronics Career in 2026: Upcoming Instructor-Led Courses from Electronics U

Staying competitive in the electronics industry requires continuously strengthening your technical expertise. Electronics U is excited to present a new lineup of expert-led, online courses designed to elevate your skills in PCB design, electronics assembly, wire harness design, program management, and more. Whether you're looking to build foundational knowledge or expand into specialized applications, these immersive, instructor-guided sessions will help you master the tools and techniques that today’s leading companies rely on.

Kelly Atay: Work-Life Balance for a Marketing Professional

Kelly Atay has one piece of advice: Don’t wait until you’re burnt out. Balance requires intentional choices and consistent practice. As the sales and marketing manager at ASC Sunstone Circuits, Kelly often feels herself being pulled in many directions. This interview examines her ongoing efforts to achieve a healthier work-life balance. While it’s generally positive, Kelly is still learning to set stronger boundaries, and uses audiobooks during her commute as a daily reset time.

Happy New Year from the I-Connect007 Staff

The I-Connect007 staff wishes you all a Happy New Year! Our offices are closed New Year’s Day and will re-open on Monday, Jan. 5, 2026. The end of one year and the start of another is often a perfect time to reflect on what has been and where we are headed. We all want better health, more strategic goals, more business, more motivation, and stronger intentions. We can turn over the calendar and a new chapter in our own book of life.

Brittany Martin: A New Champion for the Industry

From Shakespeare scholar to digital marketer, Brittany Martin brings clarity and heart to everything she does. In this interview, Brittany shares her journey from academia to electronics marketing, her proudest professional and personal milestones, and the lessons she’s learned about simplicity, growth, and balance along the way. Get to know the person behind The Marketing Minute and discover what drives her passion for this industry.

John Perry: From Mailing IPC Standards to Guiding Them

John Perry's journey with the Global Electronics Association (formerly IPC) started when he was 8 years old, inspired by his mother's role in organizing IPC company meetings. Driven by his passion for aviation and standards, he went on to a career in computer science and IT. Today, he is the director of Printed Boards Standards & Technology for the Association, collaborating with industry leaders, including those at Lockheed Martin.

A PCB Engineer’s Heartfelt Blueprint for a Life Without Regrets

As PCB engineers, we are puzzle solvers, innovators, and scrupulously detail-oriented wizards of the PCB world. We pour so much of ourselves into our designs, meticulously crafting every detail, and sometimes it feels like our personal lives become just another “component” we’re trying to fit onto an already crowded board. But trust me, designing a robust and reliable life means paying just as much attention to your personal “circuitry” as you do to your professional ones.

Merry Christmas from I-Connect007!

The I-Connect007 offices are closed today, in observance of the Christmas holiday. As part of the Global Electronics Association, the offices remain closed through New Year’s Day. I-Connect007 will still publish daily and weekly newsletters (with the exception of Christmas and New Year’s Day). Some staff members will still be checking email. Just for fun, we thought we’d share a bit of Christmas tradition about the gingerbread house. You’ve likely built one at some point and perhaps wondered how this tradition originated.
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