Latest Articles

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

IPC APEX EXPO has wrapped up another successful year, and the 25th anniversary proved to be another great event with record attendance, a robust technical conference, and interesting professional development tracks. In addition, dozens of standards development committees were in session, and we look forward to what comes of those. Can we get some virtual applause for our 100% volunteer standards committee members?

Just Because You Can, Doesn’t Mean You Should

Decisions are usually made by gathering information and differing opinions, then making the best choice based upon that information. The same process is used when designing flexible circuits and rigid-flex circuits. For example, when designing a flex circuit or rigid-flex circuit, we consider some basic factors.

Calling All Designers: The Latest Design Technology and AI  

Advanced design technology and AI were in the spotlight at the annual Design Town Hall, held March 19 during IPC APEX EXPO 2025. Speakers included IPC’s Peter Tranitz, Matt Kelly, Devan Iyer, as well as a panel on the use of AI in PCB design moderated by Susan Kayesar of Siemens.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Inside the industry, it feels like we’re getting ready for a big party holiday, and I’m feeling the whole Mardi Gras vibe. This weekend, IPC APEX EXPO kicks off with standards development committees and the Technical Conference before the Expo starts on March 18. We’ll be sneaking out of our network of evil lairs scattered around North America and convening at the I-Connect007 booth in the middle of the Anaheim Convention Center. Be sure to stop by and say hello.

Speaking the Same Language as Your Fabricator

We do indeed have a failure to communicate; designers and fabricators often seem to be talking past each other, which can lead to jobs being put on hold. We asked Jen Kolar, VP of engineering for Monsoon Solutions, and columnist Kelly Dack to share their thoughts on ways that we can break down the communication barrier between design and fabrication. As they point out, a design kickoff checklist and a solid review process can be invaluable tools in a designer’s toolbox.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been a busy week. My must-reads include articles and news items on global trends and challenges, groundbreaking technology, the hunt for the elusive young PCB designers, and some personnel changes. We also have a great column on the value of following up and keeping promises. We’re all guilty of “dropping the ball” from time to time, aren’t we?

Finding and Training the Next Design Engineers

There are a lot of job openings for PCB design engineers, and not enough young people in the pipeline to fill these jobs. How are we going to attract this next generation of design engineers to this industry, and what’s the best course of action for continuous training of these EEs? I asked Bill Hargin, founder and “director of everything” at Z-zero, to share his thoughts continuous training and what the future may hold for design engineers of the future.

Recruiting the Next Generation of PCB Designers at Garmin

Laura Beth (LB) Yates, PCB design engineering manager at Garmin, discusses the company's innovative approach to recruiting the next generation of PCB designers. As she points out, the best part of her job is “going to work every day with my friends and making cool stuff.”

UHDI Fundamentals: UHDI Advances Neurotechnology

Ultra high density interconnect (UHDI) technology is revolutionizing the field of neurotechnology and brain-computer interfaces (BCIs) by enabling unprecedented levels of miniaturization, complexity, and performance in neural devices. Here’s an in-depth look at how UHDI contributes to these domains.

One Designer’s Journey With IPC Apprenticeships

If you’d told Steve Chirpich a year ago that he would be designing printed circuit boards, he might have been surprised. After deciding to make a career change to follow his passion for technology and PCB layout design, Steve took a leap into the high-tech world of electronics manufacturing.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

As the U.S. grapples with the short-term fallout of DOGE and what it could mean for existing programs, unemployment, and the U.S. domestic economy, in the private sector of electronics manufacturing, we could be facing higher costs from tariffs and potential supply chain disruptions as we hopefully capitalize on new opportunities. Here are the top five must-read items from this past week's electronic manufacturing news and information.

Don’t Rush: Get ‘Acclimated’ With Each Level of SI

During DesignCon, I met with Al Neves, the founder of Wild River Technology, and a serious fly fisherman as well. As Al explains, some engineers are getting ahead of themselves by rushing to take on complex SI challenges before they’ve mastered their foundational knowledge. Like climbers on Mount Everest, these engineers need to spend more time getting “acclimated” at base camp before heading for the summit.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

When I first started covering trade shows for I-Connect007 about six years ago, my calendar would see me attending shows 13 of the 23 weeks over the winter. Much has changed since the pandemic, and I bring this up because my picks for the week reflect on that. Which makes sense, because we’re already launched into a new and important trade show season. From Brittany Martin’s invaluable tips for making the most of your marketing efforts, to SMTA’s new scholarship, there’s a lot of information to be had. I hope you read it the first time around, but if not, it’s worth checking out. Share it with your colleagues. Let’s get this news out there.

New EDA Tool Company Embraces AI and Code

At DesignCon 2025, we met with Duncan Haldane, CEO and co-founder of the EDA software company JITX, based in Berkeley and San Jose, California. This PCB design tool runs on AI and software code, which Duncan says can accelerate your design cycle by up to 25x. We asked Duncan to explain how this software came to be, how it works, and what this could mean to the future of PCB design.

Revolutionizing Supply Chain: The Cofactr Solution

Cofactr was co-founded by Phillip Gulley and Matthew Haber, originally as a small PCB assembly house. Recognizing a greater need, they transformed Cofactr into a supply chain execution platform that automates and optimizes manufacturing processes. The company integrates early design data with supply chain information to identify potential issues, provide risk abatement, and streamline procurement. I met with Phillip at DesignCon and asked him to walk me through the company’s background. He explained how Cofactr helps companies ensure compliance and achieve efficient material management, allowing engineering teams to focus on design rather than logistics. 

How to Discover and Equip the Next Generation of Talent

The demand for skilled PCB designers is at an all-time high, with one-third of engineering jobs in the United States going unfilled. Addressing this talent gap involves solving two interconnected challenges: discovering where to find the next generation of PCB designers and equipping them with the necessary skills to thrive in a rapidly evolving field.

EIPC 2025 Winter Conference: Business Outlook and New EMS Opportunities

“Navigating and Optimizing Complex Processes: How to Overcome Today’s and Tomorrow’s Challenges in PCB Processing” was the theme of the 2025 EIPC Winter Conference, held Feb. 4–5, in historic Luxembourg City, the capital of Luxembourg, a small country in the heart of western Europe with borders to Belgium, France, and Germany. EIPC president Alun Morgan welcomed delegates from more than 70 companies in Europe and beyond, and thanked the sponsors of the event. Morgan can always be relied upon for a topical opening presentation. This time, he addressed “Internet of Things: Vulnerabilities and How to Address Them.”

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Show season is upon us. Recently, Marcy LaRont and I attended DesignCon’s 30th anniversary show, and the expo floor was packed for almost the entire time. Show managers went all out, hosting a welcome party that included a rocking DJ. Much of the event revolved around AI and how to implement it. Is your company utilizing AI now? I’m featuring an abundance of articles from the past week, covering everything from DesignCon presentations to the benefits of volunteering for an IPC committee. If you’ve ever thought about joining a relevant committee, IPC is always looking for “new blood.”

PCB Designers of the Future—and Their Software Tools

The PCB designers of tomorrow have their work cut out for them. They’ll be dealing with the continuing drive for “faster, smaller, cheaper,” while electronics become more complex. But EDA companies have improved their software tools’ capabilities over the past few years, incorporating functionalities such as AI and increasing productivity. I asked David Wiens, product marketing manager at Siemens, to share his thoughts on the continuing evolution of PCB design and PCB designers, and how EDA software companies can help designers meet the technological requirements of tomorrow.

Here’s Looking at You, Kid

Our industry is facing a two-fold challenge: finding the next generation of PCB designers and training these young technologists. Most high school career counselors don't know anything about this career, and electrical engineering grads leave college with little or no PCB design knowledge. Where do we start? We asked two PCB design instructors, IPC’s Kris Moyer and Palomar College’s John Watson, to weigh in on the best methods for finding and training the designers of tomorrow.

Unveiling the Future: Insights on Next-Gen Megtron Materials 

In this interview from DesignCon, Jim Kenny, OEM business development manager at Panasonic, touches on next-generation Megtron materials and delves into the industry's growing demand for high-speed, low-loss laminate systems, particularly in light of the anticipated 224 gigabits per second technology. With a focus on material development and production timelines, Jim highlights the challenges and opportunities in meeting customer needs while also maintaining quality and supply chain stability. As Panasonic prepares for the evolving landscape, they remain committed to innovating in this competitive market.

Managing Energy Flow with Proper Stackup Design 

At Design Con 2025, I had the opportunity to speak with Dan Beeker, technical director at NXP Semiconductor, about his technical session, which focused on optimizing PCB layers to best direct signal and power supply energy between these layers. In this interview, Dan discusses the complexities of board stackup and the significance of understanding dielectric layers for effective signal transmission. Dan is something of a “fields evangelist,” spreading the word about the need for designers to focus on fields, not just circuit theory. Toward the end, Dan summed up much of the design segment: Designing something that didn't make it break is not the same thing as designing it correctly. 

Pieces of a Puzzle: PCB Designer John Watson Sees the Big Picture of Life and Work

John Watson started his career in military intelligence and as an electronics repair technician but moved over to printed circuit board design at a time when the whole electronics industry was experiencing a paradigm shift.

Happy Holden: How I Became an Engineer

What drives someone to become an engineer, particularly a PCB engineer? For industry icon Happy Holden, it was growing up in a family that couldn’t afford a TV but that lived close to a library and a movie theater. It allowed a curious boy the time and space to entertain his interests in science fiction and take things apart to see how the world really worked. As we guide and mentor today’s and future generations, his counsel is definitely worth considering.

Dan Beeker on the Design Engineer of the Future

As technical director at NXP Semiconductors, Dan Beeker specializes in EMC and signal integrity design techniques. He’s known for his field-based design classes; you may remember the cover of Meghan Trainor’s “All About That Bass” that Dan and his daughter Breezy released in 2015 titled “All About The Space.” Check it out on YouTube; it’s funny, and it definitely gets the point across. As we begin 2025, I contacted Dan to get his thoughts about the design engineers of the future. What will their jobs look like?

I-Connect007 Editor's Choice: Five Must-Reads for the Week

For my top picks this week, I wanted to highlight some other important content we’ve featured. First is the incomparable Stephen Chavez, who provides insight into what the future PCB designer will look like. Bob Duke of American Standard outlines the seven key challenges he sees in offshore manufacturing. We move seamlessly from there to tariffs, one of today’s most talked about topics. Jeffrey Beauchamp of NCAB looks back at a recent timeline regarding tariffs, and it’s quite interesting. I’m also pointing you toward a feature on a thriving EMS company in Malaysia, one of the two most popular locations for China Plus One manufacturing expansions. Finally, we acknowledge the expansion news of a long-time PCB and EMS global supplier.

Advancements in Thermal Management: Material Talk With DuPont

As our DesignCon coverage continues, this insightful discussion featuring Mike Kwasny, business development manager at DuPont, delves into technologies and innovations in electronics manufacturing featuring their unique material solutions, including their Kapton film and Pyralux laminate lines. 

UHDI Fundamentals: UHDI Bleeding-edge Entertainment Applications, Part 2

Ultra high density interconnect (UHDI) technology is revolutionizing bleeding-edge entertainment applications by enabling compact, high-performance devices that push the boundaries of immersion, interactivity, and realism. Part 2 focuses on how UHDI is advancing the entertainment industry, particularly gaming.

DesignCon 2025: Stacking the Professional Deck

After two full days of technical presentations, networking, and visiting with exhibitors on the show floor, the final day at DesignCon featured an exciting lineup of sessions and discussions, culminating in a wealth of knowledge for electronics professionals and included a thought-provoking keynote on global connectivity through low-earth orbit satellites presented by Amazon's Nima Mahanfar. Additionally, the Women in Engineering reception provided valuable insights on work-life balance and personal growth in the industry.

Building on DesignCon’s 30th Anniversary Momentum

With three decades of technological advancements, DesignCon has established itself as a premier conference for electronics design. Susan Deffree, the group event coordinator, reflects on the event's rich history and the exciting developments for its 30th anniversary.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

The year is off to a roaring start across the globe, but especially in the U.S. We’ll all be carefully watching the changes in policy, legislation, and enforcement coming out of Washington D.C., in the coming weeks and months. One thing is clear, though. No matter what your opinions or political affiliations are, things will change. That said, it is impossible to look at last week’s news and draw any conclusions about how everything will equilibrate in the end. Frankly, it’s just too soon for that sort of analysis. In the meantime, here are last week’s five top stories. If you’ve read nothing else about the industry this week, read these.

DesignCon 2025, Day 2: It’s All About AI

It’s hard to get away from the topic of artificial intelligence, but why would you? It’s everywhere and in everything, and my time attending presentations about AI at DesignCon 2025 was well worth it. The conference’s agenda featured engaging presentations and discussions focused on the technological advancements in AI, big data centers, and memory innovations, emphasizing the critical relationship between processors and circuit boards.

DesignCon 2025: Looking Great at 30

DesignCon may be turning 30 this year, but the Silicon Valley staple doesn’t look a day over 25. Attendees turned out for this celebratory bash, many of them reminiscing about their first DesignCon event 20 or 30 years ago. The Tuesday night welcome reception was basically a 30th birthday bash, sponsored by Mouser. Show managers went all out, with strobe lights and a DJ blasting a mix of old and new dance tunes. That was fitting, because I spoke with engineers from ages 21 to 81 at DesignCon this year. Nice to see more younger folks each year.

The PCB Designer of the Future: Blending Innovation, Technology, and Sustainability

The global demand for electronics is skyrocketing, fueled by rapid technological advancements and groundbreaking innovations across many industries, including automotive, telecommunications, healthcare, and consumer electronics. PCB design is the foundation of electronic hardware and lies at the heart of this evolution.

Istvan Novak Looks Back on History of DesignCon

Many of us have been attending DesignCon for a long time, but Samtec’s Istvan Novak has been attending DesignCon even before it was called DesignCon. A veteran signal and power integrity engineer, Istvan has been on the Technical Program Committee for over two decades, and he’s authored and co-authored a variety of award-winning conference papers. In honor of the show’s 30th anniversary, I asked Istvan to share a little about the early years of DesignCon, and how he got involved with the event.

SMTA UHDI Symposium 2025, Part 1: Challenges and Solutions

SMTA hosted its second annual Ultra High Density Interconnect Symposium, a conference on cutting-edge PCB technology, on Jan. 23, 2025, at the Peoria Sports Complex in Arizona. A highly pro-business state with a special affection for the tech sector, Arizona is home to the biggest Intel semiconductor fab in the United States and the new TSMC chip fab. With an intimate group of approximately 50 attendees, the SMTA event offered a great forum for learning, interactive discussion, and networking.

EDA Tools and the Designer of the Future

We’re seeing new, young technologists moving into the PCB design and design engineering segment, and it’s just in time; many veteran designers are headed to retirement. At the same time, there have been various recent advances in EDA tools. What will the PCB designer’s job—and the designer’s software tools—look like in the next five years? Bob Potock, vice president of marketing for Zuken USA, weighs in on the PCB designers of tomorrow, and the EDA tools that will take them into an evermore complex future.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

This week’s round-up includes a variety of valuable articles, columns, and news items, focusing on the future of the industry, global markets, and more. Don’t forget to peruse our latest book, The Printed Circuit Designer’s Guide to... More Secrets of High-Speed PCBs, by Martyn Gaudion of Polar Instruments.  I hope to see you at DesignCon! 

Course Review: IPC’s New Semiconductor Course Provides a Thorough Layman’s View

Taking the course, A Technical Overview of the Semiconductor CHIP Industry by Cheah Soo Lan wasn’t just a professional box to check for me; it was an opportunity to understand the technical backbone of a field that directly influences the work I do at IPC. While I’m not immersed in the technical aspects of semiconductors day to day, learning about this landscape allows me to better align our funding pursuits with the strategic needs of the industry.

An Inspiring Journey From Animation to PCB Design

I recently spoke with Melissa Martinez, a PCB design student in John Watson’s class at Palomar College. In this interview, Melissa shares her inspiring journey from the world of animation to the realm of printed circuit board design. Introduced to the field by her father, an engineer at Northrop Grumman, she discovered her passion for PCB design through John’s curriculum at Palomar. Her story highlights the importance of mentorship and education in attracting new talent to the industry, encouraging young individuals to explore opportunities they may not yet know exist.

See You in Vienna: Speaker Spotlight on PEDC

Vienna, Austria, is known for its amazing architecture, art museums, and classical music scene. But from now on, Vienna might also be known for its PCB design conference. IPC and FED have partnered to create a new PCB design conference in there. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30, 2025 at the NH Danube City hotel in Vienna.

Hot Off the Press: Explore the New Issue of IPC Community

The latest digital copy of IPC Community is now ready to view. Each quarter, IPC Community provides exclusive interviews and practical tips on what’s happening with IPC and its members. Find stories on IPC student leadership, successful women in business, the trouble with tariffs, the inside workings on an IPC mentorship duo, standards updates, and so much more.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

In the past couple of weeks, we’ve had some big industry news. In the automotive world, Honda and Nissan merged to form the largest car manufacturer in Japan. Before President Biden left office, he made sure to distribute more CHIPS Act money to bring some measure of electronics manufacturing back to the U.S. And former President Jimmy Carter died at the age of 100 and was honored on Thursday, reminding us all what true integrity looks like. 

Focus on electronica: Future Challenges From a Designer’s Viewpoint

Thomas Romont is CEO of WorldWide Electronic Circuits in Nantes, France, and chair of the IPC Designers Council France. He gave a presentation at electronica titled Challenges for the Future From a PCB/PCBA Designer Perspective. We asked Thomas to share his thoughts about the class, why this topic is so important, and what he hoped attendees would take away from his class.

I-Connect007 Editor’s Choice: Top Five New Year's Resolutions for 2025

The diet starts tomorrow! At least that’s what Americans say on New Year’s Day.  But it turns out that losing weight is not the No. 1 New Year’s resolution in the United States. For this week’s list, I checked with Statista Consumer Insights, a company that tracks statistics of all kinds. Here, then, are the Top Five New Year’s resolutions made by American adults heading into 2025. 

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... High Performance Materials, Chapter 4

In Chapter 4, Michael Gay discusses the two main types of copper foil used for PCB boards today: electrodeposited (ED) foil and rolled annealed (RA) foil. He also explains the pros and cons of each, and provides an update of the latest innovations in copper foil technology.

BOOK EXCERPT: The Printed Circuit Designer's Guide to... DFM Essentials, Chapter 3

In chapter 3, Anaya Vardya discusses controlled impedance PCB design, covering trace structures, impedance factors, modeling software, multiple impedance considerations, guidelines to minimize costs, and testing requirements.

Happy New Year From I-Connect007 

As I-Connect007 observes the New Year’s Day holiday, we also wish you and yours a prosperous new year. We will be back covering the news of the industry tomorrow, January 2, 2025, according to the Gregorian calendar.

I-Connect007 Editor’s Choice: Five Must-Read ‘Ugly Sweaters’ of the Week

In commemoration of the holiday week, we look at what has become a popular tradition in both the U.S. and England: the ugly Christmas sweater. This fabulous tradition has grown in recent years to encompass not only ugly sweaters but sweatshirts, cardigans (a type of sweater), pajamas, and even headgear. For the sake of simplicity (and far too many options from which to choose), we will stick with sweaters. As we round the bend on Christmas 2024, wade halfway into Hannukah, and look toward the New Year, let’s relish “the ugly.”

Effects of Advanced Packaging and Stackup Design

Kris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”

Merry Christmas from I-Connect007!

Though a modern Christmas typically brings to mind vivid images of a jolly Santa Clause, excited children opening gifts on Christmas morning, and huge feasts on festive looking holiday tables, the great holidays in every culture and religious tradition comes with an interesting historical context. 

UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 2

​​​​​​​Ultra high-density interconnect (UHDI) technology is transforming manufacturing by enabling compact, high-performance, and energy-efficient electronics in cutting-edge industrial systems. Its precision and scalability meet the demands of advanced manufacturing technologies. Here's another overview of bleeding-edge UHDI applications in manufacturing.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Hey, wait a minute, this is the lead-up to the penultimate holiday week, so why is the news cycle so busy? Normally, this period of time—what with all the holiday distraction—is when companies either go quiet or publish press releases covering those throwaway news items. Instead, this week brought in so much important news that I had to be quite discerning in my choices. Newsletter subscribers definitely got a lot of news this week. 

Are Our Stackup Rules No Longer Valid?

Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.

Spotlight on PEDC: Filbert Arzola 

IPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.

Kickstart 2025 With Advanced PCB Design Skills

As the new year approaches, it's the perfect time to set your professional goals and enhance your expertise in the dynamic field of electronics. IPC's January and February 2025 lineup offers a variety of courses designed to meet the needs of professionals at every level of their career, from beginners to seasoned experts. Whether you're looking to delve into the intricacies of radio frequency PCB design, tackle the challenges of military and aerospace applications, or start from the basics with our introductory courses, there's something for everyone. Enroll today and take the next step toward mastering your craft in the electronics industry.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.

IPC, FED Partner for New Design Conference in Vienna

IPC and its German partner FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) is scheduled for Jan. 29-30 at the NH Danube City hotel in Vienna. IPC’s Peter Tranitz, one of the show organizers, discussed how this new show came about, pointing out that, unlike many of the regional conferences in Europe, PEDC will host curated, peer-reviewed presentations, not promotional content or product pitches. Will PEDC become an annual event?

Real Time with... electronica 2024: STARTEAM GLOBAL Meeting Challenges Head-on

STARTEAM GLOBAL CEO Daniel Jacob and CTO Martin Schneider speak with Pete Starkey at electronica 2024 about their global presence in China, Thailand, and Europe, and how additive manufacturing and inkjet printing are keeping this PCB manufacturer at the forefront of technology. They’re excited about sustainability, the future, and competing on the world stage.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week’s must-reads include a discussion on innovation and embedded components within the layers of a PCB with Accurate Circuit Engineering. We revisit the real cost to manufacture in a case study on how a seemingly small design error can have a dramatic effect on your end customer’s costs. Dan Beaulieu provides this month’s book review highlighting the criticality of fostering creativity in the workplace. Bert Horner of The Test Connection discusses his decision to launch a new, complimentary business venture, The Training Connection; and Ramon Roche of NCAB talks about electric vehicle charging.
Subscribe | Magazines | RealTime with | JobConnect007 | Education | Webinars
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in