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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Make the Smart Move
April 7, 2026 | Stephen V. Chavez, Siemens EDAEstimated reading time: 1 minute
It’s incredibly easy to become fixated on shiny new EDA software, the latest high-speed routing algorithms, or the most advanced fabrication techniques. New tools and technologies are creating sophisticated simulation platforms that automate routing, check design rules, and simulate performance. However, they cannot replicate the nuanced judgment, imaginative solutions to space constraints, or collaborative spirit that define printed circuit engineering excellence. That is your most significant return on investment.
The Human Element: The Unsung Hero of PCB Innovation
Printed circuit engineering translates customer requirements into complex system architectures and electrical schematics that become physical realities by navigating signal integrity challenges, optimizing for manufacturability, and ensuring reliability across diverse environments. It ties directly to the three competing perspectives of the designer’s triangle: solvability, performance, and manufacturing.
Prioritizing the printed circuit engineer can be a game-changer in the following ways:
- Unlocks potential in design and analysis. A highly skilled and well-supported PCB engineer can extract far more value from a standard EDA suite than an under-trained or disengaged engineer can from the most sophisticated one. Training them in advanced layout techniques, signal integrity analysis, power integrity simulation, and DFM principles helps them better understand the underlying physics of high-speed signals, push the boundaries of layer stackups, and even foresee manufacturing challenges the tool's automated features might miss.
- Fosters innovation and adaptability in a rapidly evolving field. Engineers who are familiar with new substrate materials, advanced packaging, and evolving industry standards are far more adaptable. They can quickly grasp new technologies, integrate them into existing design workflows, and even envision entirely new applications, from flexible circuits to embedded components, that the tool's creators might not have imagined.
To continue reading this article, which originally appeared in the March 2026 edition of I-Connect007 Magazine, click here.
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Cyberattack via Ransomware at Major EMS Provider Foxconn
05/15/2026 | I-Connect007 Editorial TeamA recent cyberattack targeting Foxconn has once again exposed the growing vulnerability of global manufacturing and electronics supply chains to ransomware operations. According to CyberScoop, the attack disrupted operations at several of Foxconn’s North American facilities, temporarily forcing some production activities into manual workarounds while systems were restored.
SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
Scanfil Signs Agreement with Leading Industrial Automation Company
05/13/2026 | ScanfilScanfil has signed an agreement with a leading industrial automation company, part of a global technology group, strengthening its position in demanding industrial automation and electronics manufacturing applications.
Knocking Down the Bone Pile: Precision Milling of Underfilled SMT Components
05/13/2026 | Nash Bell -- Column: Knocking Down the Bone PileUnderfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces.