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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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PHOTO GALLERY: Putting in the Work on Standards, Professional Development
April 16, 2026 | I-Connect007Estimated reading time: Less than a minute
Behind every standard, innovation, and step forward in electronics are the people who show up to do the work. This week's photo gallery highlights the attendees who filled meeting rooms and classrooms throughout APEX, collaborating on standards development committees, sharing expertise, and investing in their own growth through professional development. These are the faces of progress, gathered not just to learn, but to contribute and shape what comes next.
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Sweeney Ng - CEE PCBSuggested Items
Standard of Excellence: Engineering Is the New Sales—How Technical Collaboration Wins Business
04/15/2026 | Anaya Vardya -- Column: Standard of ExcellenceWhen it comes to complex, high-performance electronics, the line between sales and engineering has all but disappeared. Customers want more than a quote. They’re not simply buying boards; they’re buying understanding, so engineering is now the front line of customer trust, problem-solving, and long-term success. There was a time when sales meant persuasion, and engineering meant production. Today, the two are inseparable.
PHOTO GALLERY: A Show Floor Showcase, Part 2
04/03/2026 | I-Connect007Take a walk back through APEX EXPO with our photo gallery, capturing the faces, moments, and energy from across more than 400 booths on the show floor. This week, we’re highlighting our many customers, and some of the work in the I-Connect007 booth, where we conducted dozens of video and audio interviews. It’s a chance to see who was there, what was happening in real time, and maybe even spot yourself in the crowd.
Nolan’s Notes: Wire Harness—The Underdog of the Industry
04/01/2026 | Nolan Johnson -- Column: Nolan's NotesMy dad’s favorite cartoon character was “Underdog,” one of the very first American Saturday morning cartoon shows. When someone asked him for help, Underdog would proudly declare, “Never Fear! Underdog is here!” Over time, I learned that “underdog” had a wider, more socially poignant meaning than just the name of a cartoon superhero. These stories about underdogs kept coming to mind while working on this issue about the challenges facing the wire harness industry. The product is not exactly glamorous and is often treated as an afterthought, but it is most certainly critical to the system.
PHOTO GALLERY: A Show Floor Showcase
03/27/2026 | Real Time with... APEX EXPOTake a walk back through APEX EXPO with our photo gallery, capturing the faces, moments, and energy from across more than 400 booths on the show floor. This week, we’re highlighting our many customers, and some of the work in the I-Connect007 booth, where we conducted dozens of video and audio interviews. It’s a chance to see who was there, what was happening in real time, and maybe even spot yourself in the crowd.
What APEX EXPO Award Recipients See for the Future of Electronics Manufacturing
03/27/2026 | Michelle Te, I-Connect007The single most transformative shift in the electronics manufacturing industry over the next decade will be the convergence of AI-driven design with advanced packaging architectures, according to some of the APEX EXPO 2026 award recipients, but success will rely on how well the industry bridges the talent gap. Recent award recipients express optimism over technological breakthroughs, from chiplet platforms and copper-to-copper hybrid bonding, to fighting the increasing incidence of conductive anodic filamentation (CAF) in flight hardware. Others see a workforce that can’t accelerate as quickly as the technology.