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What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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My Top 7 Takeaways from APEX EXPO 2026
April 3, 2026 | Chris Mitchell, VP of Global Government Relations, Global Electronics AssociationEstimated reading time: 6 minutes
I’m back from APEX EXPO 2026 in Anaheim, California, and it was another great year. Even amid significant global volatility, the industry is growing, innovating, and building partnerships. As I reflect on the experience, I want to share my top 7 takeaways and explain why each matters.
1. The Advanced Electronics Packaging Conference Was a Standout
This year’s Advanced Electronics Packaging Conference (AEPC) delivered outstanding, peer-reviewed content and strong participation, reflecting how central advanced electronics packaging has become across the industry. The program featured 25 sessions across seven tracks with an added Monday Opening Session focused on next‑gen compute and two Thursday special sessions on aerospace and defense packaging and the future of EV/autonomous electronics. In total, AEPC drew technical papers presented by 78 authors from 20 countries, including 21 Ph.D. authors. More than 100 companies were represented across keynotes, speakers, panels, committees, the design village, and the tech pavilion.
The throughline this year was the component-to-system packaging connection—how design, materials, fabrication, and test come together to deliver higher-performance systems. That convergence is exactly where the toughest technical and strategic questions now live, and AEPC is a key place where the industry is coming together to work through the challenges. Congratulations to Matt Kelly, Devan Iyer, Chris Jorgensen, Peter Tranitz, and the entire Association Solutions team for an exceptional event.
2. The EMS Leadership Summit Delivered Real Value Through Live Benchmarking
More than 60 EMS companies, including a number from Europe, came together at APEX EXPO for the EMS Leadership Summit. The Summit has become a must for EMS executives looking to engage with peers on the issues shaping the future of the industry. What made this year's summit especially valuable was the addition of instant benchmarking, supported by the Association's Industry Intelligence team. Attendees provided real-time data on supply chain, operations, workforce, and other key issues, and that data was shared back to the room immediately, prompting grounded and productive discussion.
There is no question that this approach elevated the conversation, providing for more actionable discussion. Congratulations to Summit chair Allison Budvarson of Out of the Box Manufacturing, and to Association staff Mark Wolfe and Tracy Riggan, for a great event. Thanks also to the Industry Intelligence team for helping make this Summit stand out.
3. The AI Conversation Has Matured; Industry from Awe to Action
AI was a major focus again this year, but the nature of the conversation felt very different. Last year, many companies were approaching AI with more uncertainty than direction. This year, they were far more focused on understanding how to intelligently integrate AI into their operations, whether in sales, administration, workforce development, or manufacturing. It's not that companies have figured it all out, but the posture has shifted. Instead of standing still, they are finding real motivation to identify where AI makes sense so they can make the right investments.
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Global Electronics Association Expands Free Member Training Library with New Safety and Ergonomics Courses
04/23/2026 | Global Electronics AssociationThe Global Electronics Association today announced three new complimentary courses in safety and ergonomics, expanding its member training library to help manufacturers onboard workers faster and improve production performance.
A Mic, a Tiny Cam, and the Show Floor: The Story Behind 'Take the Mic!'
04/23/2026 | I-Connect007 Editorial TeamI-Connect007’s Take the Mic! program at APEX EXPO 2026 in Anaheim is proving to be a must-watch feature for this year’s event coverage, as we invited company representatives to participate in a sponsored conversation about their businesses and products in a whole new way: in front of a camera at their booths. While our managing editors and guest editors were conducting slightly longer Real Time With… APEX EXPO interviews in our booth, three staff members and guests acted as roaming reporters, conducting short, prearranged interviews with several companies exhibiting on the show floor.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
Standardization, Workforce, and the Road Ahead for Flex–Packaging Integration, Part 3
04/22/2026 | Anaya Vardya, American Standard CircuitsParts 1 and 2 of this series established the technical foundation and application landscape for the convergence of flexible PCBs and advanced semiconductor packaging. Part 3 addresses what comes next: the standards frameworks, talent pipelines, and strategic imperatives that will determine whether the industry can scale this convergence reliably and competitively.
New Guidance Targets Scope 3.1 Emissions Gap in Electronics Supply Chains
04/22/2026 | I-Connect007 Editorial TeamA new industry guidance document aimed at improving how electronics companies account for Scope 3 Category 1 (Scope 3.1) emissions marks a significant step toward more consistent and effective supply chain decarbonization. A recent webinar hosted by the Global Electronics Association and the Responsible Business Alliance (RBA) addressed a persistent challenge: Despite the material impact of Scope 3.1 emissions, fewer than half of electronics companies currently report them.