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Professional Development Courses for Every Electronics Manufacturing Sector
March 5, 2026 | I-Connect007 Editorial TeamEstimated reading time: 2 minutes
Professional Development Courses at APEX EXPO are designed to give electronics professionals focused, instructor-led learning that connects directly to today’s manufacturing realities. The courses are offered Sunday, Monday, and Thursday, and allow attendees to build new skills while still taking part in the broader APEX EXPO experience.
With content in design, fabrication, assembly, digital manufacturing, materials, reliability, and sustainability, the program offers something for every segment of the electronics supply chain. Designers can explore emerging technologies and risk-reduction strategies, fabricators can learn about materials and process control, and EMS providers can sharpen their approach to quality, testing, and data-driven manufacturing.
Here are just a few highlights:
Paul Cooke of AGC will be teaching a course for designers and fabricators focused on long-term performance, “PCB Design for High Reliability.” Cooke draws on extensive experience in materials and fabrication to examine how design choices influence reliability outcomes. The course addresses practical considerations such as stackups, material selection, and design-for-manufacturing decisions that help reduce failures before a board ever reaches production.
EMS providers and manufacturing engineers looking to better understand artificial intelligence will find value in Dr. Jennie Hwang’s “Artificial Intelligence and AI-Powered Electronics Manufacturing.” Rather than treating AI as a future concept, Hwang explores how it is already being applied to process optimization, quality assurance, and manufacturing decision-making. The session helps attendees evaluate where AI can realistically support production today, and where caution is still warranted.
Advanced packaging is another area drawing interest across design and manufacturing teams. In “Advanced Packaging for Chiplets and Heterogeneous Integration,” John Lau of Unimicron examines the technical challenges introduced by chiplet architectures and multi-die systems. His course addresses integration approaches, manufacturing constraints, and reliability considerations that are increasingly relevant as packaging becomes a key driver of system performance.
Together, these courses reflect the broader goal of the Professional Development program to deliver practical insight from industry experts who understand the pressures facing modern electronics manufacturing.
To register and view the full list of courses and instructors, click here.
For more information on the upcoming APEX EXPO 2026, be sure to check out the February issue of I-Connect007 Magazine.
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