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Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
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Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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Quiet Power
Column from: Istvan Novak
Istvan Novak is the principal signal and power integrity engineer at Samtec, with over 30 years of experience in high-speed digital, RF, and analog circuit and system design