Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
The Shaughnessy Report: Breaking Down the Language Barrier
Connect the Dots: Designing for Reality—Routing, Final Fab, and QC
IPC Asia’s Talent Development Program Opens Pathways to a More Qualified Workforce
March 14, 2025 | Evelyn Cui, IPC AsiaEstimated reading time: 1 minute
As global technological innovation and industrial transformation in the electronics sector accelerate, talent shortages become increasingly apparent, creating a bottleneck that hampers the growth of enterprises and affects the overall competitiveness of the industry.
In Asia, the contradiction between the rapid development of the electronics manufacturing industry and the shortage of talent is particularly evident. The existing talent pool cannot fully meet the market's demand for highly skilled professionals. According to feedback from industry companies, there is an urgent need for professionals with knowledge of IPC standards and practical skills in electronics. However, the reality is that most academic courses are disconnected from the actual needs of the industry, leading to disappointing results when companies recruit from universities and schools.
So, how can the talent development systems in universities and schools seamlessly align with enterprise needs to quickly unblock these bottlenecks?
In response to these needs, IPC Asia launched the IPC Asia Talent Development Program in 2020 with three core projects: the Internship Program, the Student Training Program, and the Academic Partner Program. This overall initiative has aimed to bridge the gap between education and industry by providing systematic training and practical opportunities that help students and young professionals master the core knowledge and skills of IPC standards. Through close collaboration with major enterprises and academic institutions, IPC Asia has successfully cultivated a number of highly skilled professionals who are meeting the industry's development needs and laying a solid and sustainable foundation.
Exploring Through Collaboration
The IPC Asia Talent Development Program has collaborated with more 20 educational institutions in mainland China, Hong Kong, Taiwan, Thailand, and Vietnam, with over 1,000 participants.
Student Training Program
The Student Training Program has attracted more than 400 students from nearly 20 universities. To ensure that the training content is both cutting-edge and practical, IPC Asia invited several university professors and industry experts to give lectures that present typical industry case studies. Through seminars and workshops, students engage deeply with these professors and experts to enhance their understanding of the industry.
Continue reading this article in the Winter 2025 issue of IPC Community.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
03/14/2025 | Nolan Johnson, I-Connect007Inside the industry, it feels like we’re getting ready for a big party holiday, and I’m feeling the whole Mardi Gras vibe. This weekend, IPC APEX EXPO kicks off with standards development committees and the Technical Conference before the Expo starts on March 18. We’ll be sneaking out of our network of evil lairs scattered around North America and convening at the I-Connect007 booth in the middle of the Anaheim Convention Center. Be sure to stop by and say hello.
IPC Hall of Fame Spotlight Series: Highlighting Denny Fritz
03/13/2025 | Dan Feinberg, I-Connect007This month, the Hall of Fame spotlight features Denny Fritz, a long-time friend and associate of mine. Denny first got involved with IPC in 1978 while working with MacDermid. His first efforts were with the various board fabrication committees, something he believes helped lead to his eventual Hall of Fame award.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
IPC Releases Latest List of Standards and Revisions
03/12/2025 | IPCEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.
The Test Connection Inc. Promotes Melanie Rutkauskas to Director of Operations for The Training Connection, LLC
03/11/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce the promotion of Melanie Rutkauskas to Director of Operations for The Training Connection, LLC (TTC-LLC). With her extensive background in operations management, accounting, and customer relations, Melanie brings a wealth of experience and leadership to her new role.