Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
March 14, 2025 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
Inside the industry, it feels like we’re getting ready for a big party holiday, and I’m feeling the whole Mardi Gras vibe. This weekend, IPC APEX EXPO kicks off with standards development committees and the Technical Conference before the Expo starts on March 18. We’ll be sneaking out of our network of evil lairs scattered around North America and convening at the I-Connect007 booth, #3520, in the middle of the Anaheim Convention Center. Be sure to stop by and say hello.
There is no shortage of show-related news in the cycle right now. Visit iconnect007.com to read the latest on everything related to this year’s IPC APEX EXPO. But that’s not all that’s going on, so I’ve picked up five key pieces of news that might otherwise get buried in the hullaballoo of the IPC show.
Unsurprisingly, they track right along with much of the mainstream media: tariffs, the global economy, and U.S. industrial investment. There will be lots of conversation on these themes when we convene in southern California next week, and these are the reports you should know to be informed. See you in Anaheim.
Statement from IPC, the Global Electronics Association, on Recent U.S. Tariffs and Global Trade
Published March 7
In a statement attributed to Dr. John W. Mitchell, IPC president and CEO, the decision to postpone tariffs Mexican and Canadian goods is applauded. The Canadian, Mexican, and U.S. electronics industries are so closely intertwined and Mitchell stresses that IPC is eager to work with the Trump administration to build a stronger industrial base. Read more here.
IPC Global Standards Driving Factory of the Future
Published March 10
Chris Jorgensen advocates that Factory of the Future amounts to a revolutionary shift in manufacturing and that IPC task groups strive to be at the forefront of this transformation. Click here to read the summary, and to follow the link to the entire article as published in the March 2025 issue of SMT007 Magazine.
KYZEN Announces the Retirement of Longtime Executive Vice President Tom Forsythe
Published March 13
Well, we hate to see this, but Tom Forsythe has earned his retirement. Tom is responsible for much of KYZEN's success since he joined the firm in 1992. We've run into Tom at trade shows and conferences all over the world, and he always give a fantastic interview. We'll miss him, and we wish him all the best.
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
Published March 13
John Watson has penned a great colum that compares the design data handoff to the passing of batons during the Olympic relays. As the U.S. relay team learned in 2020, mistakes made during the passing of the baton can snowball and lead to failure. If you're experiencing problems during design data handoff, you won't want to miss this column.
ICT Spring Seminar: Nickel Not Welcome Here
Published March 12
Our favorite road reporter Pete Starkey was in Tewkesbury earlier this month covering the ICT Spring Seminar, which highlighted the industry's shift away from nickel in PCB manufacturing. Experts discussed the environmental and performance benefits of alternative materials, emphasizing the need for sustainable practices. Pete has a way of drilling down to what's most important, and the key topics he covered included advancements in copper and silver-based technologies and the impact on product reliability and cost-effectiveness. I know you'll enjoy this read.
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