-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueProper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Exhibitor Registration and Speaker Applications Now Open for NEDME 2025
March 10, 2025 | NEDMEEstimated reading time: 1 minute

The Northwest Electronics Design & Manufacturing Expo (NEDME) is gearing up for its 2025 event, and exhibitor registration is now open! Taking place on Wednesday, October 22, 2025, at the Wingspan Event & Conference Center at Westside Commons in Hillsboro, Oregon. This year’s keynote speaker is Quantum Computing hardware expert Jim Clarke.
Going 22 years strong, NEDME remains the Pacific Northwest’s premier trade show for electronics design and manufacturing professionals.
Companies looking to showcase their latest products, services, and innovations are invited to secure booth space now. Exhibiting at NEDME provides a unique opportunity to connect with key decision-makers, engineers, and industry professionals in the electronics and manufacturing sector.
In addition to exhibitor registration, NEDME is accepting applications for breakout speaking sessions. Industry experts and thought leaders are encouraged to apply to present engaging, educational sessions on cutting-edge topics in electronics design, manufacturing and more.
Be a part of the Pacific Northwest’s top electronics industry event!
- Exhibitor Registration & Booth Reservations: Register online at nedme.com
- Speaker Applications: Submit proposals at nedme.com
- Event Date: Wednesday, October 22, 2025
- Location: Wingspan Event & Conference Center, Hillsboro, OR
If you have questions or need more details – email board@nedme.com.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Nordson Electronics Solutions to Exhibit High-yield Fluid Dispensing Technologies for Panel-level and Wafer-level Packaging at SEMICON Taiwan 2025
08/18/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326.
Thermal Interface Materials – Transition to High-Performance Materials
08/18/2025 | IDTechExIDTechEx forecasts that the market size of thermal interface materials (TIMs) will exceed US$7 billion, covering multiple industries including EV batteries, EV power electronics (TIM1 and TIM2), data centers, advanced semiconductor packaging (TIM1 and TIM1.5), ADAS sensors, consumer electronics, and 5G.
Wistron Announces 1st Half Year of 2025 Financial Results and BOD Results
08/18/2025 | WistronWistron Corp. held a meeting of the Board of Directors. Following the meeting, the company announced the financial results for the first half of 2025.
Foxconn Offers Rare View On Electric SUV And AI Infrastructure At Taiwan Expo USA
08/18/2025 | FoxconnHon Hai Technology Group (Foxconn) on Thursday displayed, for the first time in the United States, its North American-variant electric SUV and demonstrated, for only the second time, its cutting-edge artificial intelligence infrastructure, at Taiwan Expo USA, a conference highlighting the strength of a key partnership in this era of industrial evolution.
Koh Young Appoints George Hsu to Lead Newly Opened Taiwan Office to Drive Semiconductor and Advanced Packaging Growth
08/18/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, is pleased to announce the appointment of George Hsu as Managing Director of Koh Young Taiwan, its newly established branch office in Zhubei City, Hsinchu County.