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Multicircuits Expands Capabilities with State-of-the-Art Automated Copper Via Fill Process
March 10, 2025 | MulticircuitsEstimated reading time: 1 minute
Mike Thiel, president of Multicircuits, a leading provider of high-reliability printed circuit boards, has announced the addition of a state-of-the-art automated copper via fill process to their advanced manufacturing capabilities. This strategic investment enhances the company’s ability to deliver cutting-edge solutions for demanding industries, including aerospace, defense, medical, and high-speed telecommunications.
Copper via fill technology plays a crucial role in improving signal integrity, increasing thermal conductivity, and enhancing circuit density. This advanced process ensures superior performance for high-density interconnect (HDI) and multilayer PCBs, reinforcing Multicircuits' reputation as an industry leader in precision manufacturing.
“We continuously invest in cutting-edge technologies to provide our customers with the most advanced PCB solutions,” said Mr. Thiel when making the announcement. “The addition of copper via fill strengthens our commitment to innovation and positions us as a premier partner for high-performance electronics manufacturing.”
Dave Kemper, Process Engineering Manager at Multicircuits, highlighted the technical advantages of this new capability, “This new process allows us to manufacture more robust PCBs with improved electrical and thermal properties. Our team has worked diligently to ensure a seamless integration of this process, and we are excited to offer this enhanced service to our customers.”
With the introduction of automated copper via fill, Multicircuits continues to push the boundaries of PCB technology, delivering superior reliability and performance to customers across a wide range of industries.
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Speaking the Same Language as Your Fabricator
03/12/2025 | Andy Shaughnessy, Design007 MagazineWe do indeed have a failure to communicate; designers and fabricators often seem to be talking past each other, which can lead to jobs being put on hold. We asked Jen Kolar, VP of engineering for Monsoon Solutions, and columnist Kelly Dack to share their thoughts on ways that we can break down the communication barrier between design and fabrication. As they point out, a design kickoff checklist and a solid review process can be invaluable tools in a designer’s toolbox.
IPC Releases Latest List of Standards and Revisions
03/12/2025 | IPCEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.
Sartorius Lab Instruments GmbH & Co. KG, First German EMS Company to Receive IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing
03/10/2025 | IPCIPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to Sartorius Lab Instruments GmbH & Co. KG. Sartorius is a leading international provider to the biopharmaceutical research and medical industry.
Koh Young Showcases Inspection Innovations at IPC APEX EXPO 2025 in Anaheim, California during March 18-20, 2025
03/10/2025 | Koh YoungKoh Young, the global leader in True3D measurement-based inspection solutions and the exclusive Premier Sponsor of IPC APEX EXPO 2025, invites electronics manufacturers to Booth 2130 for an in-depth look at its cutting-edge inspection technologies. Taking place at the Anaheim Convention Center from March 18–20, 2025, this year’s event highlights Koh Young’s continued advancements in AI-powered process optimization and quality assurance.
RTX's Collins Aerospace Unveils New Engineering Development and Test Center in Bengaluru
03/10/2025 | RTXCollins Aerospace, an RTX business, opened its new Engineering Development and Test Center (EDTC) at the company’s North Gate campus in Bengaluru, India. The new facility streamlines product development, testing, and certification of components locally, bringing aerospace technologies to market faster.