Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

RTX's Raytheon Completes Installation of First SPY-6(V)4 Array at Wallops Island Test Site

08/03/2026 | Raytheon Company
Raytheon, an RTX business, has delivered and installed the first SPY-6(V)4 radar array at Surface Combat Systems Center at Wallops Island in Virginia, marking a major milestone for the U.S. Navy's Flight IIA Destroyer modernization effort and the SPY-6 backfit program.

Mega Circuit Chooses atg Flying Probe Technology for High-speed Electrical Test and Automation

07/31/2026 | atg Mycronic GmbH
Atg Mycronic GmbH and IEC USA confirm an order for an atg A7a, 8 head, double-sided, high speed, auto-load/unload system for true “lights-out” operation from Mega Circuit.

Will Your Vias Survive the Heat? New Book From I-Connect007 Has the Answers

08/03/2026 | I-Connect007
I-Connect007 is excited to announce the release of The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness, the newest title in its technical resources library. Written by reliability expert Bob Neves, the book examines one of the industry's most misunderstood topics: how to properly evaluate PCB via structures for assembly process survivability, long-term reliability, and robustness.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/23/2026 | Marcy LaRont, I-Connect007
In this week’s top five must-reads, I chose articles that go from big business questions (to diversify or not), to important technical issues such as DFM errors made in creating HDI designs using ELIC and design for test, to a discussion around some of the power and thermal considerations in advanced packaging, and the fact that they are now, firmly, performance enablers, not after-the-fact elements to be managed in fabrication.

Meet the Author Podcast: Bert Horner on Design for Test

07/23/2026 | I-Connect007
I-Connect007 is pleased to announce the release of Episode 7 of the “Meet the Author” podcast, featuring Bert Horner, president of TTCI, discussing his new book, The Printed Circuit Assembler's Guide to... Design for Test. In this conversation with Nolan Johnson, Horner explores what he calls the "Butterfly Effect" of Design for Test (DFT): Decisions made early in the design process can significantly influence manufacturing success, product reliability, and long-term profitability.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in