-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Spotlight on Jayda: Ucamco's Revolutionary PCB Quoting Software
October 22, 2024 | Marcy LaRont, I-Connect007Estimated reading time: Less than a minute
In this audio interview, Frank Van den Bossche, Software Business Unit Director at Ucamco NV explains the development of Jayda, a groundbreaking PCB quoting software that significantly streamlines and enhances the efficiency of obtaining fast and accurate quotes. Born out of Ucamco's Integ8tor solution, Jayda leverages advanced algorithms to quickly analyze PCB design files and assess complexity with a very rapid turnaround. Through the power of AI, Ucamco's solution not only saves time but also reduces the potential for human error, ensuring that customers receive reliable quotes for their projects with unprecedented speed.
Suggested Items
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology
06/17/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case,
It’s Only Common Sense: Selling Without Selling
06/16/2025 | Dan Beaulieu -- Column: It's Only Common SenseSelling without selling sounds counterintuitive, but today’s buyers are more informed and skeptical, and traditional hard-selling tactics often do more harm than good. That’s why successful salespeople learn to sell by not selling—at least not in the traditional sense. Here’s how to master this approach.
Priority Software Appoints Ben Karniel as Chief Revenue Officer to Spearhead Global Growth
06/12/2025 | Priority SoftwarePriority Software, a leading provider of scalable and agile cloud-based business management solutions, proudly announces the appointment of Ben Karniel as its new Chief Revenue Officer (CRO), effective May 1, 2025. This strategic addition to the executive team underscores Priority's commitment to expand its global footprint.
SEMI MEMS & Sensors Industry Group Invites Proposals for Funding Positioning, Navigation and Timing Technology Advancements
06/12/2025 | SEMIThe MEMS & Sensors Industry Group (MSIG), a SEMI Technology Community, announced a Request for Proposals (RFP) for advanced technology development of positioning, navigation and timing (PNT) components and systems, including their manufacture. The full RFP document includes more information on the proposal submission process.
VeriSilicon’s AI-ISP Custom Chip Solution Enables Mass Production of Customer’s Smartphones
06/09/2025 | BUSINESS WIREVeriSilicon recently announced that its AI-ISP custom chip solution has been successfully adopted in a customer’s mass-produced smartphones, reaffirming the company’s comprehensive one-stop custom silicon service capabilities in AI vision processing.