Beyond Design: High-speed Rules of Thumb
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
The Shaughnessy Report: A Handy Look at Rules of Thumb
ASMPT, IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
July 24, 2024 | ASMPTEstimated reading time: 1 minute
ASMPT and IBM today announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies. Through the agreement, the two companies will work together to advance thermocompression and hybrid bonding technology for chiplet packages, using ASMPT’s next generation of Firebird TCB and Lithobolt hybrid bonding tools.
Chiplets deconstruct SOCs into their composite parts, creating smaller chips that can then be packaged together to operate as a single system, to provide potential benefits that can include improved energy efficiency, faster system development cycle time, and reduced costs. However, packaging advances are needed to move chiplets from research to mass production more quickly and efficiently, driven by the rapid pace of innovation in AI computing.
This latest agreement builds on an existing collaboration between ASMPT and IBM, resulting last year in the debut of a new hybrid bonding approach* that optimizes bonding quality between two chiplets. Now, they will continue to work together on the development of bonding technologies for chiplet packages.
“IBM has been at the forefront of developing advanced packaging technology for the age of AI,” said Huiming Bu, Vice President of IBM Semiconductors Global R&D and Albany Operations, IBM Research. “We are proud to continue our work with ASMPT to advance chiplet packaging technology to pave the way for smaller, more powerful, and more energy efficient chips.”
“We are excited to build on our strong relationship with IBM to drive the frontiers of Advanced Packaging in tandem with accelerating innovations in artificial intelligence,” said Lim Choon Khoon, Senior Vice President, ASMPT. “We are pleased to work with IBM to advance next generation packaging and Heterogeneous Integration solutions for the AI era.”
Share on:
Suggested Items
IBM Expands its AI Accelerator Offerings; Announces Collaboration with AMD
11/18/2024 | IBMIBM and AMD have announced a collaboration to deploy AMD Instinct MI300X accelerators as a service on IBM Cloud. This offering, which is expected to be available in the first half of 2025, aims to enhance performance and power efficiency for Gen AI models such as and high-performance computing (HPC) applications for enterprise clients.
IBM Introduces Granite 3.0: High Performing AI Models Built for Business
10/21/2024 | IBMAt IBM's annual TechXchange event the company announced the release of its most advanced family of AI models to date, Granite 3.0. IBM's third-generation Granite flagship language models can outperform or match similarly sized models from leading model providers on many academic and industry benchmarks, showcasing strong performance, transparency and safety.
Intel, IBM Deliver Enterprise AI in the Cloud
09/03/2024 | IntelIBM and Intel announced a global collaboration to deploy Intel® Gaudi® 3 AI accelerators as a service on IBM Cloud. This offering, which is expected to be available in early 2025, aims to help more cost-effectively scale enterprise AI and drive innovation underpinned with security and resiliency.
New IBM Processor Innovations to Accelerate AI on Next-Generation IBM Z Mainframe Systems
08/26/2024 | IBMIBM revealed architecture details for the upcoming IBM Telum® II Processor and IBM Spyre™ Accelerator at Hot Chips 2024. The new technologies are designed to significantly scale processing capacity across next generation IBM Z mainframe systems helping accelerate the use of traditional AI models and Large Language AI models in tandem through a new ensemble method of AI.
IBM to Acquire Octo
05/20/2024 | PRNewswireIBM announced an agreement to acquire Octo, a U.S.-based IT modernization and digital transformation services provider exclusively serving the U.S. federal government, including defense, health, and civilian agencies. IBM's acquisition of Octo establishes one of the largest digital transformation partners to the federal government.