Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

August I-Connect007 Magazine: The Electronics Ecosystem From Design to Development

08/18/2026 | I-Connect007 Editorial Team
This issue of I-Connect007 Magazine examines how collaboration across the electronics ecosystem—from design through fabrication, packaging, AI infrastructure, and flexible circuits—drives innovation and manufacturable products. Our contributors explore co-design from multiple perspectives, using analogies from the forest to the Olympics. We also revisit VeCS for high layer count HDI PCB fabrication, plating challenges for advanced packaging, new applications for flex circuits in robots, and how the U.S. national defense policy could affect PCB sourcing.

Technica USA Lunch & Learn Highlights Advances in PCB Cleaning and Thermal Processing

08/14/2026 | Technica USA
Technica USA’s Lunch & Learn event, held August 12–13 at the company’s Demo & Applications Center in San Jose, California, reinforced the company’s ongoing commitment to delivering value to customers and supply partners.

I-Connect007 Welcomes New Columnists from Flexible Circuit Technologies

08/12/2026 | I-Connect007
In an exciting new column for I-Connect007 Magazine, a team of application engineers from Flexible Circuit Technologies will draw on decades of experience designing and manufacturing flex and rigid-flex circuits to offer practical guidance to help PCB designers make better engineering decisions. Mark Finstad, Chris Clark, Terrill Schmidt, Dan Skweres, and Zack Schaner will rotate authoring the new column, called Flex Connections, which begins in the August issue, with Dan drawing on his many years of experience to explain why just because you can do something in PCB design, doesn’t mean you should.

Teledyne Launches GroundLink Edge Platform for Boeing 737

08/07/2026 | BUSINESS WIRE
Teledyne Controls, a business unit of Teledyne Technologies Incorporated and a leading provider of aircraft data management and connectivity solutions, announced the launch of the GroundLink® Edge Computing Platform (ECP) and AppLink cloud service, following Federal Aviation Administration (FAA) Supplemental Type Certificate (STC) approval for the Boeing 737 aircraft series.

Kent Nguyen Joins Technica USA as Customer Applications Engineer

08/03/2026 | Technica USA
Technica USA is pleased to announce the appointment of Kent Nguyen as Customer Applications Engineer. In this role, Kent will play a key part in strengthening customer engagement through live equipment demonstrations, applications support, equipment installations, and operator training.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in