The August issue of I-Connect007 Magazine examines how greater collaboration throughout the electronics development process is changing how products are designed and built. But what does that mean exactly?
Our contributors explore co-design from multiple perspectives, using analogies from the forest to the Olympics. Stephen Chavez discusses the realities of co-design, and Kristin Moyer is interviewed about the risks of using cloud-based systems, particularly with sensitive data.
We also revisit VeCS for high layer count HDI PCB fabrication, plating challenges for advanced packaging, new applications for flex circuits in robots, and how the U.S. national defense policy could affect PCB sourcing.
These articles and more demonstrate how engineering decisions made early in development continue to influence manufacturing, reliability, cost, and product performance.