The Hidden Enabler of Autonomous Warfare: Advanced PCB Technologies Behind Defense AI
It’s Only Common Sense: Stay Curious, My Friends
Latest News
QTREX Expands into Quantum Processor Interface with Single-Build Cryogenic Chip Carrier
06/19/2026 | Globe Newswire
Synopsys Announces Availability of the First Wave of Multiphysics Fusion Solutions
06/18/2026 | Synopsys
MacDermid Alpha Launches ATROX® CD 560-1: Zero PFAS Alternate Silver Filler Die Attach Paste
06/18/2026 | MacDermid Alpha Electronics Solutions
Keysight Expands Photonic Design Automation Portfolio with System-Level Simulation
06/17/2026 | BUSINESS WIRE
Cadence Accelerates Digital Twin–Driven Data Center AI Modernization with HPE
06/17/2026 | Cadence Design Systems
TSMC Accelerates CoPoS Development; Taiwan Suppliers Leverage FOPLP for Glass Core Substrates
06/17/2026 | TrendForce
NOR Flash, SLC NAND Prices Surge Over 100% in 1H26, Shortages to Persist in 2H26
06/16/2026 | TrendForce
Spirit Electronics Opens U.S. Semiconductor Manufacturing Access for Aerospace and Defense
06/15/2026 | Globe Newswire
Optical Interconnects Drive AI Factory Growth; CPO/NPO Market to Top $39B by 2030
06/15/2026 | TrendForce
CEA-Leti, GlobalFoundries Advance European FD-SOI Innovation via FAMES Pilot Line
06/11/2026 | CEA-Leti
SK Telecom, NVIDIA Build AI Infrastructure to Power Korea’s AI Innovation
06/11/2026 | NVIDIA Newsroom
Qnity Launches Optivision Max CMP Pad Family for Next-Gen Semiconductor Manufacturing
06/10/2026 | BUSINESS WIRE
GlobalFoundries, Qualinx Demonstrate First European Sovereign Chip Manufacturing Flow
06/10/2026 | BUSINESS WIRE
Cadence, Intel Foundry Collaborate to Optimize Intel 14A Process for HPC and Mobile
06/09/2026 | Cadence Design Systems
Square Peg Communications and VIAVI Solutions Join Forces to Advance 5G NTN Testing
06/09/2026 | PRNewswire
Infineon, Siemens Deploy Silicon Carbide Technology to Modernize Electrical Protection
06/09/2026 | Infineon
Schneider Electric Launches Uniflair XCA Chiller Line for High-Density AI Data Centers
06/09/2026 | Schneider Electric
Pembroke Instruments Launches Thermal Imaging Microscope for Semiconductor Failure Analysis
06/09/2026 | Pembroke Instruments, LLC
NAVER Expands AI Infrastructure With NVIDIA to Serve Surging Global AI Demand
06/08/2026 | NVIDIA Newsroom
SpaceX IPO Momentum to Boost Global Satellite Industry to $447 Billion by 2027
06/08/2026 | TrendForce
After 30 Years, Samsung Moves U.S. HQ from New Jersey to Texas
06/04/2026 | I-Connect007 Editorial Team
Quobly Raises €115M Series A to Commercialize Silicon-Based Quantum Computers
06/04/2026 | PRNewswire
Fujitsu, Daiichi Life Launch Joint Research on Quantum-Powered Asset Management
06/04/2026 | Fujitsu
NVIDIA Joins Windows on Arm, Driving Arm-Based AI Notebook Share to 34.2% by 2029
06/04/2026 | TrendForce
Mouser's Rise of the Robots Program Explores Humanoid Design Considerations
06/03/2026 | BUSINESS WIRE
STMicroelectronics Raises Revenue Ambition for Data Centers on Strong AI Demand
06/03/2026 | STMicroelectronics
AI Data Center Expansion to Push EML and CW-DFB LD Monthly Capacity to 50.7M Units in 2026
06/03/2026 | TrendForce
Keysight, NTT DOCOMO, and NTT Collaborate on 6G Wireless Channel Modeling
06/02/2026 | BUSINESS WIRE
QTREX Secures Purchase Order from U.S. Fortune 500 Company for AME System
06/02/2026 | Globe Newswire
Tight DRAM Supply Boosts Pricing Power, HBM Contract Prices Set to Surge in 2027
06/02/2026 | TrendForce
Cadence Unveils Industry’s First Fully Autonomous Virtual Engineer for Chip Design, powered by NVIDIA
06/01/2026 | Cadence Design Systems
Agentic AI Fuels Memory Demand Growth, Market Projected to Hit $1.28T by 2027
05/29/2026 | TrendForce
Ynvisible Secures SEK 3.0M Grant to Advance Sustainable Manufacturing and Medical E-Paper
05/29/2026 | Ynvisible Interactive Inc.
TDK Ventures Invests in C2i Semiconductors to Revolutionize AI Data Center Power Delivery
05/28/2026 | BUSINESS WIRE
DIMAAG Acquires Akridata to Scale Physical AI and Next-Generation Infrastructure
05/28/2026 | BUSINESS WIRE
Imec, EVG Demo Wafer-to-Wafer Hybrid Bonding at 200nm Pitch with Record Overlay Accuracy
05/28/2026 | PRNewswire
Powermat, Anker Innovations Announce Patent License Agreement and Strategic Collaboration
05/27/2026 | PRNewswire
NUBURU Signs Tekne SPA and Initiates Golden Power Filing Process for Majority Acquisition
05/27/2026 | BUSINESS WIRE
Schaeffler, Spire Global Partner to Build Sovereign European Space Infrastructure
05/27/2026 | BUSINESS WIRE
GlobalPlatform Unveils Pavona, the First Open Silicon Platform with Post-Quantum Cryptography
05/26/2026 | BUSINESS WIRE
Omdia: European Smartphone Market Grows 2% in 1Q26 as Prices Hit Record High
05/26/2026 | BUSINESS WIRE
Quectel Expands EMEA Reach With Future Electronics Distribution Agreement
05/26/2026 | BUSINESS WIRE
Micron’s Fab 6 Starts LPDDR4 and DDR4 Production, but DDR4 Shortage Is Expected to Persist
05/26/2026 | TrendForce
Fujitsu Develops Self-Evolving AI Agent Technology for Business Operations
05/25/2026 | JCN Newswire
Combined Revenue of Top Five Global NAND Flash Suppliers Rose by 83.7% QoQ for 1Q26
05/25/2026 | TrendForce
QTREX in Advanced Talks with Top-Five Global Quantum Computing Firm on Strategic Collaboration
05/22/2026 | Globe Newswire
Doosan Robotics Strengthens European Presence with Expanded Frankfurt Branch
05/21/2026 | Doosan Robotics
Tata Electronics, ASML Announce Strategic Partnership to Advance the Semiconductor Manufacturing Ecosystem in India
05/21/2026 | Tata Electronics
Analog Devices Acquires Empower Semiconductor to Bolster AI-Era Power Portfolio
05/21/2026 | PRNewswire
IBM, U.S. Department of Commerce Announce America's First Quantum Foundry with $1B CHIPS Award
05/21/2026 | PRNewswire
Global TV Shipments Reach Post-Pandemic High in Q1 2026 Amid Memory Price-Driven Order Pull-Ins
05/21/2026 | TrendForce
Infineon Launches Moore4Power to Advance Next-Gen Sustainable Power Electronics
05/20/2026 | Infineon
GlobalFoundries Invests in Playground Global to Drive Long-Term Innovation
05/20/2026 | GlobalFoundries
Doosan Robotics Strengthens European Presence with Expanded Frankfurt Branch
05/20/2026 | PRNewswire
North American CSP Procurement of NVIDIA Racks to Drive 1.2x AI Inference Surge in 2026
05/20/2026 | TrendForce
Packet Digital Awarded $9.8M U.S. Navy Contract to Scale Battery Cell Production
05/18/2026 | Packet Digital
H2 Core Systems Builds Scalable Hydrogen Energy Solutions with Siemens Xcelerator
05/18/2026 | Siemens
Richardson Electronics, Gotion Partner on U.S.-made Battery Storage Systems
05/18/2026 | Richardson Electronics, Ltd.
Mobile DRAM Contract Prices Continue Rising in 2Q26, Pressuring Smartphone Production
05/15/2026 | TrendForce
Heilind Electronics Expands Circuit Protection Portfolio with OptiFuse Partnership
05/15/2026 | Globe Newswire
SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRE
ONERugged Accelerates Smart Manufacturing with Rugged Computing Solutions
05/14/2026 | BUSINESS WIRE
Intel Foundry Push Gains Momentum With Apple as Potential Customer
05/13/2026 | I-Connect007 Editorial Team
Robot Orders Hold Steady in Q1 2026 as Demand Broadens Across Non-Automotive Industries
05/13/2026 | BUSINESS WIRE
50% of Enterprises Risk Losing Top AI Talent by 2027 Without People-Centric AI Strategy
05/13/2026 | Gartner, Inc.
Lightium Selects Aras Innovator to Support Development of Photonic AI Chips
05/12/2026 | BUSINESS WIRE
yieldWerx, WATS Partner to Bridge PCB Test with Chip-Level Manufacturing Data
05/11/2026 | PRNewswire
Macnica ATD Europe Acquires Indesmatech to Deepen Engineering Presence Across Northern Europe
05/11/2026 | BUSINESS WIRE
Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency
05/11/2026 | Cadence Design Systems
GlobalFoundries Outlines Long-Term Growth Roadmap and Announces First-Ever Dividend
05/08/2026 | GlobalFoundries
Siemens Hardware-assisted Verification Validates Arm AGI CPU for Scalable Agentic AI
05/06/2026 | Siemens
Advent Diamond, Northrop Grumman Set Record for Diamond-Based Solid-State Limiters
05/06/2026 | PRNewswire
North American AI Data Center Expansion Drives 2026 CapEx of Top Nine CSPs to US$830 Billion
05/06/2026 | TrendForce
Kopin Wins $21.5M Follow-on Contract for U.S.-Made Thermal Imaging Assemblies for Defense Prime
05/05/2026 | PRNewswire
Xanadu, EV Group Partner to Build Industrial-Scale Photonic Quantum Hardware
05/05/2026 | PRNewswire
Infineon Brings Industrialization Expertise to European Quantum Chip Pilot Lines
05/04/2026 | Infineon
GlobalFoundries Advances Co-Packaged Optics for AI Data Centers with SCALE Module
05/04/2026 | GlobalFoundries
Navitas Semiconductor Appoints Davin Lee as Independent Director to its Board
05/04/2026 | Globe Newswire
STMicroelectronics Enables Always-On Vision with Ultralow-Power Image Sensors
05/01/2026 | STMicroelectronics
Neusoft Smart Go, Tencent Cloud Partner on AI-Powered Intelligent Cockpit Ecosystem
05/01/2026 | PRNewswire
NEC to Supply Nine Types of Defense Equipment for Three Australian Frigates
04/30/2026 | JCN Newswire
From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation
05/06/2026 | I-Connect007
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in