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Metanoia Licenses Cadence Tensilica ConnX 230 DSP for New SDR Platform
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ULVAC Developing Next-Generation Dilution Refrigerator for Quantum Computing by 2026
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STMicroelectronics Recognized as Top 100 Global Innovator 2025 for the Seventh Time
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New Power Management Chips from TI Maximize Protection, Density and Efficiency for Modern Data Centers
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CommScope, Altice Labs Combine PON Technologies to Power Next-Gen FTTH Networks
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GrayMatter Robotics Named to Fast Company’s Annual List of the World’s Most Innovative Companies of 2025
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NVIDIA Omniverse Physical AI Operating System Expands to More Industries and Partners
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NEC Improves the Energy Efficiency and Floor Space Density of 5G Mobile Core Systems
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DigiKey Partners with SparkFun to Equip Next Generation of Engineers with XRP Robotics Kits
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TSI Introduces the Nano LPM System for Semiconductor Ultrapure Water Nanoparticle Detection
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Ainos, ASE Partner to Power AI Scent Digitization in Semiconductor Manufacturing
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Hon Hai Research Institute Launches Traditional Chinese LLM With Reasoning Capabilities
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Intelsat, Cochise County Sheriff’s Office Deploy Satellite Communications at Mexican Border
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TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications
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Siemens Extends PAVE360 Technology to AMD GPUs Running on Microsoft Azure Cloud
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Air Taxis Poised for Mass Adoption as Honeywell Survey Highlights Consumer Interest
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Alpha and Omega Semiconductor to Feature Groundbreaking Controllers for AI and Robust Packaging Advancements at APEC 2025
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Tata Electronics, Himax Technologies and Powerchip Semiconductor Manufacturing Corporation Form Alliance
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TASMIT Launches Large Glass Substrate Inspection System for Advanced Semiconductor Packaging
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GlobalFoundries, MIT Collaborate to Advance Research and Innovation on Essential Chips for AI
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VTT, IQM Launch First 50-qubit Quantum Computer Developed in Europe
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Weak Consumer Electronics Demand Drives 4Q24 NAND Flash Revenue Down 6.2% QoQ
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Conexiom Launches AI-Powered Ideal Order Platform to Revolutionize Sales Order Automation
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Pusan National University Develops One-Step 3D Microelectrode Technology for Neural Interfaces
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Dell Technologies Accelerates Telecom Transformation with Comprehensive Program, Expanded Partnerships
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PsiQuantum Announces Omega, a Manufacturable Chipset for Photonic Quantum Computing
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NAES, Gecko Announce $100M Deal Deploying AI and Robotics to Transform the American Power Grid
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Christoph Beckenbauer Appointed as General Manager of Swissbit’s Memory Division
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New Book Explores History of X-ray Technology and Application in Electronics Today
03/05/2025 | I-Connect007
Samsung Display Partners with Intel to Target Next-Gen AI PC Market
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Cisco & Rockwell Automation Partner to Close Digital Skills Gap in Manufacturing
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Hon Hai Research Institute Achieves Quantum Computing Breakthrough at QIP 2025
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Incheon National University Study Pioneers Breakthrough in Wireless Charging Technology
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STMicroelectronics to Enable Higher-Performance Cloud Optical Interconnect in Datacenters and AI Clusters
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