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Advanced Electronics Packaging Digest

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Sundell Technology Laying the Groundwork for a ‘Certain’ Future

11/04/2026 | Tulip Gu, ECIO and Marcy LaRont, I-Connect007
In early September, Edy Yu and Tulip Gu of ECIO, and I-Connect007’s Marcy LaRont visited Sundell Technology’s Thailand facility at the Rojana Industrial Park in Ayutthaya Province. Two years into operation, the factory has devoted considerable investment and effort to things that are largely “invisible.” Registered in February 2023 and commencing production in 2024, the company has invested nearly RMB 1.2 billion in the facility, which covers approximately 267,000 square meters and was initially planned for a monthly production capacity of 120,000 square meters.

Siemens Unveils Advanced Microgrid at Wendell Headquarters

05/12/2026 | Siemens
Siemens unveiled its advanced on-site microgrid at its Wendell, North Carolina facility today with an official “power on” ceremony. Integrated into the company’s U.S. Electrification and Automation headquarters, the 1.25-megawatt microgrid combines a solar photovoltaic carport array paired with a 3.9-megawatt-hour battery energy storage system.

Intel, Dell Technologies and Nokia Redefine UPF Deployment at the Far Edge

04/21/2026 | Intel
Dell PowerEdge XR8000 with Intel® Xeon™ 6 SoC delivers high-performance UPF compute to rugged, space‑ and power‑constrained 5G edge environments.

Dell Technologies Advances Enterprise AI Innovation With NVIDIA

11/18/2025 | BUSINESS WIRE
Dell Technologies, the world’s top provider of AI infrastructure,1 and NVIDIA are delivering the future of enterprise AI with advancements to the Dell AI Factory with NVIDIA

High Density Packaging User Group Announces ASKPCB Membership

11/03/2025 | HDP User Group
High Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
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