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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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EU Clears €659 Million for German Semiconductor Expansion

07/21/2026 | I-Connect007 Editorial Team
The European Commission has approved €659 million in German state aid for four semiconductor manufacturing projects, continuing Europe's broader effort to strengthen regional semiconductor production and reduce dependence on overseas suppliers.

Hitachi Energy, Eve Air Mobility Accelerate Electrification Infrastructure for Urban Air Mobility

07/17/2026 | Hitachi Energy
Hitachi Energy, a global technology leader in electrification, and Eve Air Mobility, an Embraer-backed electric vertical takeoff and landing (eVTOL) aircraft manufacturer, have signed a Memorandum of Understanding to advance the electrical infrastructure needed to support urban air mobility at scale.

Gartner Identifies the Companies to Beat in the AI Semiconductor Vendor Race

07/16/2026 | Gartner, Inc.
To meet the increasing AI demands for computing power, the competition is intensifying among the Companies to Beat in the AI semiconductor vendor race, according to Gartner, Inc., a business and technology insights company.

The AI Data Center Boom: Technology, Capacity, and Society

07/17/2026 | Marcy LaRont, I-Connect007
AI begins with advanced chips, but delivering AI at scale depends on an ecosystem of technologies that extends far beyond the semiconductor. In this interview, Andrew Bradner, senior vice president of Schneider Electric's cooling business, explains how AI is transforming data center design, why liquid cooling has become essential, and what these shifts mean for advanced packaging, power delivery, thermal management, and the broader electronics supply chain supporting next-generation AI infrastructure.

Power and Thermal Constraints in AI Accelerator Packages

07/17/2026 | Chetan Arvind Patil, Marvell Technology
For more than five decades, semiconductor progress was driven primarily by transistor scaling. Moore's Law provided a predictable path for increasing transistor density, while process technology advancements consistently improved performance, power efficiency, and manufacturing cost. During this period, package development evolved alongside silicon, supporting higher pin counts, faster interfaces, and improved thermal performance, but it rarely dictated overall system capability.
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