FEATURED NEWS AND INFORMATION:
We search high and low to find the best news for you, our valuable readers…
U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging
The U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in...
New JH Technologies Partnership Expands Focus on Scanning Electron Microscopes
The sales, marketing, and service agreement allows JH Technologies to offer cutting-edge electron microscopes while increasing CIQTEK's presence...
Gartner Says Worldwide PC Shipments Increased 1.4% in Q4 2024 and 1.3% for the Year
Worldwide PC shipments totaled 64.4 million units in the fourth quarter of 2024, a 1.4% increase from the fourth quarter of 2023, according to...
MKS Instruments Receives 2024 Supplier Excellence Award for Innovation from Onto Innovation
MKS Instruments, Inc., a global provider of enabling technologies that transform our world, was the recipient of the 2024 Supplier Excellence Award...
RIKEN Adopts Siemens' Emulation And High-Level Synthesis Platforms for Next-Generation AI Device Research
Siemens Digital Industries Software announced today that RIKEN, a national research and development agency in Japan, is enhancing its research on...
SIA Releases Policy Recommendations for Trump-Vance Administration and 119th Congress
The Semiconductor Industry Association (SIA) released a policy agenda setting forth the U.S. semiconductor industry’s policy priorities and...
Click Here for More News
We search high and low to find the best news for you, our valuable readers…
If you have news you would like to publish here please send your news item to: news@iconnect007.com
Click here for press release tips
U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging
January 17, 2025 | U.S. Department of Commerce
New JH Technologies Partnership Expands Focus on Scanning Electron Microscopes
January 17, 2025 | PRNewswire
MKS Instruments Receives 2024 Supplier Excellence Award for Innovation from Onto Innovation
January 16, 2025 | MKS Instruments, Inc.
RIKEN Adopts Siemens' Emulation And High-Level Synthesis Platforms for Next-Generation AI Device Research
January 16, 2025 | Siemens
Gartner Says Worldwide PC Shipments Increased 1.4% in Q4 2024 and 1.3% for the Year
January 16, 2025 | Gartner, Inc.
onsemi Completes Acquisition of Qorvo’s Silicon Carbide JFET Technology Portfolio
January 16, 2025 | onsemi
AI Infrastructure to Dominate MLCC Demand in 2025 amid Persistent Oversupply Challenges
January 16, 2025 | TrendForce
Infineon Strengthens Supply Chain with New Backend Fab in Thailand
January 16, 2025 | Infineon
SIA Releases Policy Recommendations for Trump-Vance Administration and 119th Congress
January 16, 2025 | SIA
U.S. Department of Commerce Announces Preliminary Terms with MACOM to Help Strengthen Supply Chain Resilience for U.S. Defense and Telecommunications Industries
January 16, 2025 | U.S. Department of Commerce
The Path Ahead Featuring:
- EMS Providers Should ‘Plan Prudently’ in 2025 with Dennis Reed
- The Promising Future for CEE PCB in Thailand with Tom Yang
- Tariffs and Trade Wars: What to Expect in 2025 with James Kim
- Ensuring Compliance With the U.S. CHIPS Act: Identifying the Source of Electronic Components by Dr. Eyal Weiss
- Emerging Trends in 2025 by Nolan Johnson
- My 2025 Industry Wish List by Mike Konrad
Inner Layer Precision & Yields Featuring:
- Boosting Your Inner Layer Precision and Production Outcomes by Marcy LaRont
- Revolutionizing Inner Layer Registration with Tony Faraci
- Can Changing Spray Nozzles Improve My Etch Quality? by Don Ball
- Revolutionizing PCB Testing with RoBAT with Bruce Nockton
- Statistically Testing Inner Layer Yield Improvements by Dr. Pat Valentine
The Designer of the Future Featuring:
- PCB Designers of the Future—and Their Software Tools, with David Wiens
- Dan Beeker on the Design Engineer of the Future
- The PCB Designer of the Future: Blending Innovation, Technology, and Sustainability, by Stephen Chavez
- An Inspiring Journey From Animation to PCB Design, with Melissa Martinez
- EDA Tools and the Designer of the Future, with Bob Potock
- Addressing Future Challenges for Designers, by Vern Solberg
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in