Dan’s Biz Bookshelf: ‘Dream First, Details Later
Happy’s Tech Talk #40: Factors in PTH Reliability—Hole Voids
Facing the Future: Time for Real Talk, Early and Often, Between Design and Fabrication
FEATURED NEWS AND INFORMATION:
We search high and low to find the best news for you, our valuable readers…
OSI Systems Receives $34 Million Contract for Cargo and Vehicle Inspection Systems
OSI Systems, Inc. announced that its Security division has been awarded a contract worth approximately $34 million by an international...
Apple Supplier Lens Tech Soars in Hong Kong Trading Debut
Hong Kong’s stock exchange had its busiest day of the year for new listings on July 9, as five mainland Chinese companies made their trading...
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
SHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of...
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
As the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify...
Nvidia’s $4 Trillion Milestone Signals AI Must-have for Investors
Nvidia has become the world’s first company to reach a $4 trillion market cap, cementing its place as the most valuable business on...
Breaking News: New Podcast Series Launches: Optimize the Interconnect
I-Connect007 is excited to announce the debut of Optimize the Interconnect—a new podcast series featuring guest Chris Ryder, senior director of...
Click Here for More News
We search high and low to find the best news for you, our valuable readers…
If you have news you would like to publish here please send your news item to: news@iconnect007.com
Click here for press release tips
OSI Systems Receives $34 Million Contract for Cargo and Vehicle Inspection Systems
July 11, 2025 | BUSINESS WIRE
Apple Supplier Lens Tech Soars in Hong Kong Trading Debut
July 10, 2025 | I-Connect007 Editorial Team
IBM Power11 Raises the Bar for Enterprise IT
July 10, 2025 | IBM
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
July 10, 2025 | SHENMAO
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
July 10, 2025 | Microchip
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
July 10, 2025 | Infineon
Nvidia’s $4 Trillion Milestone Signals AI Must-have for Investors
July 10, 2025 | Cision
Cadence Introduces Industry-First LPDDR6/5X 14.4Gbps Memory IP to Power Next-Generation AI Infrastructure
July 10, 2025 | Cadence Design Systems
European Semiconductor Industry Rallies for Support in European Union Long-Term Budget
July 10, 2025 | SEMI
New Podcast Series Launches: Optimize the Interconnect
July 10, 2025 | I-Connect007
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in