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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

SIA Commends CHIPS Awards to Accelerate Advanced Compute Semiconductor R&D

07/30/2026 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding seven R&D awards announced by the CHIPS Research and Development Office (CRDO) to accelerate semiconductor R&D for the advanced compute supply chain.

Trio-Tech Wins $3.8M in AI GPU Platform Orders

07/30/2026 | BUSINESS WIRE
Trio-Tech International, a comprehensive provider of semiconductor back-end solutions and a global value-added supplier of electronic equipment, announced it has received approximately $3.8 million in additional orders for high-performance Burn-In Boards (BIBs) supporting a next-generation artificial intelligence (AI) GPU platform.

Marvell Invests $250M in India to Expand AI Development

07/29/2026 | BUSINESS WIRE
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced plans to invest $250 million in India over the next three years to expand its capabilities across technology, talent and infrastructure.

TI Reports Q2 2026 Financial Results

07/27/2026 | Texas Instruments
Texas Instruments Incorporated (TI) reported second quarter revenue of $5.46 billion, net income of $1.98 billion and earnings per share of $2.14.

Intel, Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era

07/27/2026 | Intel
Intel Corporation and Lens Technology announced a strategic collaboration focused on enabling new technologies for advanced semiconductor packaging.
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