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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Omega EMS Expands Advanced Inspection Capabilities with New 3D AOI and X-Ray Systems

10/16/2026 | Omega EMS
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10/16/2026 | Foxconn
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Wistron Approves NT$7.1 Billion in Capital Expenditures, Plans Tainan Factory Acquisition

10/16/2026 | Wistron
Wistron announced that its Board of Directors approved additional capital expenditures totaling NT$7.1 billion for its facilities in Kaohsiung and Hsinchu, Taiwan, and proposed acquiring a factory building in Tainan from Coretronic Corporation for up to NT$1.0 billion.

Indium Halogen-Free Solder Paste Wins Mexico Technology Award

10/16/2026 | Indium Corporation
Indium Corporation®, an industry leader in innovative materials solutions for semiconductor packaging and electronics assembly, received a Mexico Technology Award in the solder paste category for its Indium12.9HF, a no-clean, halogen-free solder paste designed to meet the growing challenges of high-density, fine-pitch assemblies.

Micross Achieves Class K Qualification for Space-Grade Hybrid Microelectronics

10/16/2026 | PRNewswire
Micross Components, a leading provider of high-reliability microelectronics for aerospace, defense, and space, has achieved MIL-PRF-38534 Class K qualification from the Defense Logistics Agency (DLA) Land and Maritime for its Apopka, Florida, facility.
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