Global PCB Connections

Column from: Jerome Larez

Jerome Larez is a field application engineer for CEE PCB. He has 20 years of experiences in PCB fabrication, including manufacturing (all process areas but specializing in wet process), planning, sales, applications engineering (DFM analysis, developing process flows for FPCs and PCBS, defect characterizations), and management.

He is the former president of SMTA-Puget Sound Chapter, and former treasurer for IPC Designers Council-Cascades Chapter.


Connect:
January 16, 2025

Global PCB Connections: The Future of HDI PCBs

High-density interconnect (HDI) printed circuit boards (PCBs) transform modern electronics by providing increased functionality, reduced sizes, and enhanced performance in complex designs. They do so by using advanced techniques, such as finer line and space definitions, microvias, and additional board layers. Specialized via structures—namely blind, buried, and stacked vias—offer complex routing while conserving space. This allows for the development of highly compact electronic devices. This article delves into HDI PCB technology, the function and benefits of blind, buried, and stacked vias, and their impact on PCB performance and design.
December 18, 2024

Global PCB Connections: Following DFM Rules Leads to Better Boards

As a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
November 14, 2024

Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards

Flex printed circuit boards are an essential advancement in the electronics industry, enabling the development of flexible, lightweight, and durable electronic designs. As technology has evolved, long-flex PCBs have emerged as a key component in applications requiring extended or intricate routing paths. Because of their use in automotive, commercial, and medical devices, designers are becoming more comfortable designing PCBs with this technology. This column will explore their attributes and role in modern products. I will also offer some essential tips for designing with manufacturability in mind.
October 24, 2024

Global PCB Connections: Mission Critical—Communication Between PCB Designers and Fabricators

In my first column, I want to discuss the critical importance of communications between the PCB design and the PCB fabrication engineer. I’ll explore why clear communication is so important, highlight the differences between standard and CTQ items, and outline the key issues that must be agreed upon to achieve success in PCB manufacturing.
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