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Advanced Packaging and the New Scaling Walls

09/17/2026 | Chetan Arvind Patil, Marvell Technology
Advanced packaging is becoming the foundation for semiconductor scaling in the AI era. As monolithic processors encounter practical limits around reticle size, yield, memory bandwidth, power, and cost, the industry is moving toward architectures built from multiple compute dies, HBM stacks, I/O chiplets, and heterogeneous packaging solutions. The result is that semiconductor scaling is no longer determined only by how much functionality can be integrated into a single die, but by how much silicon can be integrated efficiently within a package.

GSME Joined TSMC OIP Value Chain Alliance in North America

09/16/2026 | PRNewswire
GS Microelectronics U.S., Inc. (GSME), a leading semiconductor solutions provider, announced it has officially joined TSMC's Open Innovation Platform® (OIP) Value Chain Alliance (VCA) as a member partner in North America.

Spirox Launches High-Speed TGV Crack Inspection System to Support High-Volume Glass Substrate Inspection

09/16/2026 | PRNewswire
Spirox, hosted the Advanced Packaging Technology Forum, bringing together experts from Corning and DNP to share insights on Glass Core, TGV, reliability, and inspection technologies for next-generation AI and HPC applications.

Celebrating One Year of the Advanced Electronic Packaging Technology Council (ADEPT): From Momentum to Measurable Impact

09/15/2026 | Devan Iyer, Global Electronics Association
Nearly 15 months ago, we launched the Advanced Electronic Packaging Technology Council with a simple premise: the packaging challenges facing our industry are moving too fast—and spanning too many disciplines—for any single company, region, or segment to solve alone. What we’ve seen since then is proof that focused, industry-led collaboration can turn urgency into alignment, and alignment into action.

Koh Young Brings Advanced Packaging Inspection and Metrology Solutions to SEMICON West 2026

09/15/2026 | Koh Young
Koh Young Technology, the industry leader in True3D™ measurement-based inspection solutions, will showcase its growing portfolio of inspection and metrology technologies for semiconductor and advanced packaging applications at SEMICON West 2026, October 13–15 at the Moscone Center in San Francisco, California.
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