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Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch
As a field application engineer for a major Chinese PCB company, I see firsthand the challenges and, more excitingly, the trends shaping our industry. Talking to engineers, designers, and procurement teams worldwide, one thing is clear: PCBs have come a long way, but we’re barely scratching the surface of what’s possible. Here are 10 trends I believe will define our industry over the next decade.
1. The Rise and Evolution of High Density Interconnect (HDI)
HDI has been around for years, but it's on the brink of a revolution. HDI boards pack an impressive amount of circuitry into tight spaces, but the demand for more compact designs—especially for wearable devices and Internet of Things (IoT) products—is driving HDI advancements faster than ever. I see this in customer requests every day—pushing for greater functionality without increasing the footprint, and HDI design and manufacturing are evolving to keep pace.
2. Flexible and Rigid-flex PCBs
Rigid-flex technology is growing quickly, especially as the market increases for wearables and medical devices. Flexibility and durability are the cornerstone of modern designs. From smartwatches to medical sensors, these boards allow for unique designs. In automotive applications, where you want reliability in tight spaces, I’m finding rigid-flex and flex designs are essential. They’re versatile tools for engineers and are here to stay.
3. Embedding Components for a Streamlined Future
Several years ago, embedding components seemed experimental. Now, they’re gaining traction. Embedding passives and actives within PCB layers saves board space, reduces interference, and improves reliability— a must for high-performance applications. Whenever I discuss next-gen designs with clients, embedded components are almost always part of the conversation. It’s exciting, and we’re beginning to see what’s possible.
4. AI-driven Design and Manufacturing
Artificial intelligence (AI) in PCB manufacturing is fascinating. AI is already simplifying design processes, especially in design for manufacturing (DFM) checks. However, AI’s predictive capabilities will soon be able to prevent issues before they arise, optimize manufacturing flows, and handle quality control more accurately. Imagine reducing error rates, getting faster iterations, and greater efficiency powered by AI. That’s where we’re headed and it will be a game-changer.
5. Advanced Materials for Next-level Performance
Traditional materials like FR-4 are giving way to advanced options, such as ceramics and polyimides. These materials can handle higher frequencies and extreme environments, making them indispensable in fields like 5G and automotive. Every month I have conversations with customers who need their boards to withstand heat, cold, and vibration without losing performance. As the markets for these PCBs grow, I believe the shift to these materials will help with PCB durability and performance.
6. 3D Printed Electronics: Prototyping and Production
Additive manufacturing in terms of 3D printing in the PCB space is still emerging, but I believe it has immense potential. Currently, 3D printed electronics are mostly for low-volume prototype runs of less-complex designs. However, think about how much time and cost 3D printing can save in prototyping alone. As this technology improves, we may see full-scale production runs. Designers and engineers should keep an eye on 3D printed electronics as there will be rapid advancements in the coming years.
7. Miniaturization and Ultra Fine Line Technology
As devices become smaller, there is a growing demand for ultra fine lines and precise spacing. Miniaturization holds immense challenges, particularly in maintaining accuracy. This trend is driven largely by consumer electronics, which demand smaller, lighter, and faster devices. I’ve noticed more customers require ultra-fine technology to achieve compact designs without compromising on performance. These designs can be tough to manufacture but incredibly rewarding for end-product capabilities.
8. Green Manufacturing and Sustainability
Environmental responsibility is no longer optional; it’s necessary. Customers increasingly ask about sustainable practices, from water recycling to chemical waste reduction. Regulations are tightening and companies that can’t adapt risk being left behind. It’s a point of pride that our company is investing in greener practices, but there is still room for improvement in the industry overall. As the world prioritizes sustainability, PCB manufacturing will evolve to meet these new standards.
9. Prepping for 5G and 6G
5G has reshaped data transmission by requiring PCBs to handle high frequencies and low latency. With 6G on the horizon, the demand will increase. I have a front-row seat to these shifts as more companies come to us needing boards that meet higher signal integrity standards. We’ll need advanced materials and precise manufacturing processes to keep up when 6G arrives.
10. Cybersecurity in Connected Manufacturing
As PCB manufacturing integrates more digital processes, the potential for breaches grows. Intellectual property theft and tampering are real threats, especially for companies supplying critical sectors. Blockchain could be part of the answer, providing a secure, transparent method for tracking materials and processes. Over the next decade, every PCB manufacturer will need to treat cybersecurity as seriously as quality control.
The PCB world is heading into a transformative decade and it’s exhilarating to be part of it. AI, miniaturization, sustainability, and new materials will redefine what’s possible in electronics manufacturing. However, with these advancements come challenges and it’s our job to guide customers through these changes, ensuring they’re ready to lead their markets.
Being at the intersection of global technology trends and customer needs is one of the best parts of my job. Every day I’m reminded the future of PCBs is not just about making boards; it’s about pushing the boundaries of what we think a board can do. Meanwhile, let’s stay connected.
Jerome Larez is a field application engineer and director of technical sales with CEE PCB.
More Columns from Global PCB Connections
Global PCB Connections: How Technology Can Level the Playing FieldGlobal PCB Connections: The Future of HDI PCBs
Global PCB Connections: Following DFM Rules Leads to Better Boards
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
Global PCB Connections: Mission Critical—Communication Between PCB Designers and Fabricators