-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueTraining New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine

Global PCB Connections
Column from: Jerome Larez
Jerome Larez is a field application engineer for CEE PCB. He has 20 years of experiences in PCB fabrication, including manufacturing (all process areas but specializing in wet process), planning, sales, applications engineering (DFM analysis, developing process flows for FPCs and PCBS, defect characterizations), and management.
He is the former president of SMTA-Puget Sound Chapter, and former treasurer for IPC Designers Council-Cascades Chapter.