Connect the Dots: How to Avoid Five Common Causes of Board Failure
Fresh PCB Concepts: Designing for Success at the Rigid-flex Transition Area 
Elementary Mr. Watson: Routing Hunger Games—May the Traces Be Ever in Your Favor
New Podcast Episode Drop: Understanding How Chemistry and Drilling Collaborate for OTI
August 11, 2025 | I-Connect007Estimated reading time: Less than a minute
MKS’ Atotech’s Frank Bruening (GM) and Roger Massey (Senior Manager, Strategic Planning) join On the Line With… host Nolan Johnson to unpack the growing complexities of achieving optimal interconnect and the critical role chemistry plays. Their discussion highlights the interplay between laser drilling, substrate layer chemistry, and plating processes, offering valuable insights for engineers.
This series explores how MKS is redefining microvia formation to meet the demands of today’s most advanced HDI PCB and substrate designs.
A downloadable companion guide provides a deeper technical dive into the unified via formation methodology, featuring case studies that demonstrate the measurable benefits of OTI.
Stay tuned—new episodes launch every other Thursday!
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