-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Stadium’s Shanghai Design Centre Pushes Design-led Growth for Wireless Applications
March 11, 2016 | Stadium GroupEstimated reading time: 1 minute

On 16th February 2016, Stadium’s Board of Directors cut the ribbon to signify the official opening ceremony for its Regional Design Centre (RDC) in Shanghai’s Zhangjiang Hi-Tech Park, China.
In support of the Group’s wider strategy to further develop its design-led technology businesses, the Shanghai RDC has become an International Purchasing Office (IPO) and the Company’s regional research and development hub in wireless M2M connectivity for global OEM products in automotive, medical, security and other growing vertical markets. Driven by the Internet of Things (IoT), which continues to stimulate demand, the M2M space is forecast for high growth.
“The new Shanghai Regional Design Centre is an exciting move for Stadium that both strengthens our wireless capabilities and gives us access into new markets,” said Charlie Peppiatt, CEO, Stadium Group. “We have recruited a highly experienced team, including design engineers and field application engineers, specialising in wireless, RF and M2M technologies. Stadium’s presence in China, delivered by the new Shanghai RDC and manufacturing facility in Dongguan, positions the company to capitalise on a growing market opportunity and expand further into the Asia Pacific market.”
A 210 m² site on the Zhangjiang Hi-Tech Park was selected as the location for Stadium’s RDC office. Located on the Pudong side of the city, this high-tech park is host to a large number of industries including integrated circuits, software, IoT development, biopharmaceuticals, information security, semiconductor illumination and modern agriculture, among others. A significant number of multinationals also have their research and development centres located here. The talent pool in Zhangjiang Hi-Tech Park for electronics engineering and related skills is the best in Asia with a vast pool of experienced skilled doctorates and graduates.
Suggested Items
Bridging the Gap Between PCB Designers and Fabricators
04/03/2025 | Stephen V. Chavez, Siemens EDAWith today’s advanced EDA tools, designing complex PCBs in the virtual world does not necessarily mean they can be built in the real world. This makes the relationship between a PCB designer and a fabricator pivotal to the success of a project. In keeping with solid design for manufacturing (DFM) practices, clear and frequent communication is needed to dial and lock in design constraints that meet expectations while addressing manufacturing concerns.
IPC APEX EXPO Newcomer: Faith DeSaulnier of TTM Technologies
04/03/2025 | I-Connect007 Editorial TeamDuring the Newcomer’s Welcome Reception at IPC APEX EXPO, the I-Connect Editorial Team spoke with several first-time attendees. The following is our interview with Faith DeSaulnier, a process engineer based at TTM Technologies’ facility in Forest Grove, Oregon.
Ansys Semiconductor Solutions Certified by TSMC for Reliable, Accurate Analysis of Evolving Chip Designs
04/03/2025 | PRNewswireAnsys announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC's N2 silicon process technology. PathFinder-SC delivers a novel verification solution that provides superior capacity and performance, easily accommodating large designs in the cloud.
Real Time with... IPC APEX EXPO 2025: Insights into PCB Design and Manufacturing with Polar Instruments
04/03/2025 | Real Time with...IPC APEX EXPOErik Bateham discusses Polar's latest book, which enhances insights for PCB designers and manufacturers. The book, "The Designer's Guide to... More Secrets of High-Speed PCBs," features a guest chapter on 2D via design modeling. Erik highlights the industry's shift towards UHDI and the challenges in measuring at micron levels.
Connect the Dots: Stop Killing Your Yield—The Hidden Cost of Design Oversights
04/03/2025 | Matt Stevenson -- Column: Connect the DotsI’ve been in this industry long enough to recognize red flags in PCB designs. When designers send over PCBs that look great on the computer screen but have hidden flaws, it can lead to manufacturing problems. I have seen this happen too often: manufacturing delays, yield losses, and designers asking, “Why didn’t anyone tell me sooner?” Here’s the thing: Minor design improvements can greatly impact manufacturing yield, and design oversights can lead to expensive bottlenecks. Here’s how to find the hidden flaws in a design and avoid disaster.