-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Electronic Design Automation Market to Reach $17.47 Billion by 2030, Growing at a CAGR of 10.7%
March 31, 2025 | PRNewswireEstimated reading time: 4 minutes
According to a new market research report titled 'Electronic Design Automation Market Size, Share, Forecast & Trends Analysis by Offering (Solutions, Services), Deployment Mode (On-premise, Cloud-based), Tool Type (Design Tools, Verification Tools, Simulation Tools), and Geography – Global Forecast to 2030', published by Meticulous Research®, the global Electronic Design Automation (EDA) market is expected to grow from an estimated $8.96 billion in 2023 to $17.47 billion by 2030, at a CAGR of 10.7% during the forecast period.
Key Market Drivers and Trends
The growth of the EDA market is driven by the increasing complexity of integrated circuit (IC) designs, rising adoption of connected devices, and growing demand for EDA solutions in the aerospace and defense sectors. Additionally, the increasing integration of AI and machine learning in chip design is further boosting market expansion.
Cloud-based EDA solutions are gaining traction as companies seek cost-effective and scalable alternatives to traditional on-premise deployments. The ability to access design tools remotely, collaborate in real-time, and leverage cloud computing power is accelerating adoption across small and mid-sized enterprises (SMEs).
Growth Opportunities
The rapid evolution of AI and ML-based EDA tools is expected to create new growth opportunities. These advanced tools enhance automation, reduce design time, and improve performance, increasing efficiency in semiconductor and electronics manufacturing. Additionally, the growing demand for edge computing and high-performance computing (HPC) chips is driving the need for more sophisticated and automated EDA solutions.
The increasing adoption of cloud-based solutions is another major growth driver, enabling seamless collaboration and improved accessibility for global design teams. Companies are increasingly integrating AI and ML algorithms into their workflows to optimize design accuracy and efficiency, reducing costly errors and accelerating time-to-market. Moreover, the emergence of domain-specific electronic product designs and the rising focus on power-efficient chipsets for IoT and AI applications are expected to drive innovation in EDA solutions. Increased investments in R&D and strategic collaborations between semiconductor companies and EDA solution providers will further expand market potential.
Market Challenges
Despite strong growth potential, the EDA market faces several challenges. High software costs remain a major barrier, particularly for small and mid-sized companies looking to adopt advanced design tools. Licensing fees and maintenance costs can be substantial, limiting accessibility for smaller market players.
Another key challenge is the availability of open-source EDA tools, which, while cost-effective, lack the full-scale capabilities of premium solutions. As a result, companies must balance cost efficiency with performance when selecting EDA tools.
The rapid technological evolution of semiconductor manufacturing processes creates challenges in keeping EDA tools up to date. As chip designs become more complex, ensuring seamless compatibility between hardware and software tools is becoming increasingly difficult. Additionally, concerns regarding data security in cloud-based EDA deployments continue to hinder widespread adoption, especially in highly regulated industries like aerospace and defense. The industry also faces a shortage of skilled professionals with expertise in advanced EDA tools, further complicating adoption and implementation.
Segment Insights:
By Offering: The solutions segment dominates the market, accounting for approximately 72.4% of the share in 2023, driven by increasing investments in advanced IC design, verification, and semiconductor IP solutions. The services segment is anticipated to register the highest CAGR, as organizations seek expert consulting, training, and implementation support to enhance their EDA workflows.
By Deployment Mode: Cloud-based EDA solutions are expected to register the highest CAGR, with companies shifting towards flexible and cost-efficient design environments. Cloud-based deployment offers improved accessibility, real-time collaboration, and scalable computing power, making it an attractive choice for semiconductor manufacturers and electronics design firms.
By Tool Type: Design tools are the largest segment, accounting for 48.5% of the market share in 2023, due to growing complexity in ICs, printed circuit boards (PCBs), and semiconductor design processes. Verification tools are also seeing significant growth, driven by the increasing need to ensure chip reliability and performance before mass production.
Regional Analysis:
The Asia-Pacific region is expected to register the highest CAGR in the global electronic design automation market during the forecast period. The increasing presence of semiconductor foundries in China, Taiwan, South Korea, and Japan, coupled with rising investments in AI-driven chip design, is fueling market expansion in the region. Governments in these countries are also providing incentives to boost domestic semiconductor production, further driving demand for EDA solutions.
North America remains a dominant market due to the presence of major semiconductor manufacturers and EDA solution providers. The region's strong focus on R&D, coupled with high adoption rates of advanced design automation technologies, is sustaining steady growth. Europe is also witnessing a rise in EDA adoption, particularly in the automotive and aerospace industries, where the demand for high-performance and reliable chips is growing.
Competitive Insights
The global EDA market is highly competitive, with key players focusing on AI-powered solutions, strategic partnerships, and innovative product launches. Leading companies include Cadence Design Systems, Inc. (U.S.), Synopsys, Inc. (U.S.), Siemens AG (Germany), ANSYS, Inc. (U.S.), Keysight Technologies, Inc. (U.S.), Altium Limited (U.S.), Zuken (Japan), and Silvaco, Inc. (U.S.).
Recent Industry Developments
- March 2024: Cadence Design Systems launched an AI-driven chip optimization tool to improve design automation.
- January 2024: Synopsys acquired a semiconductor AI startup to enhance its ML-powered design verification tools.
- October 2023: Siemens EDA announced a partnership with a leading semiconductor foundry to streamline chip design processes.
Suggested Items
TTCI Joins Printed Circuit Engineering Association to Strengthen Design-to-Test Collaboration and Workforce Development
07/09/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its membership in the Printed Circuit Engineering Association (PCEA), further expanding the company’s efforts to support cross-functional collaboration, industry standards, and technical education in the printed circuit design and manufacturing community.
Bell to Build X-Plane for Phase 2 of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
07/09/2025 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 2 of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program with the objective to complete design, construction, ground testing and certification of an X-plane demonstrator.
Facing the Future: Time for Real Talk, Early and Often, Between Design and Fabrication
07/08/2025 | Prashant Patel -- Column: Facing the FutureThere has always been a subtle but significant divide between those who design and those who build printed circuit boards. It’s not a hostile gap, but it is a real one, and in today’s high-speed, high-complexity, high-stakes environment, that gap is costing us more than time and yield. It’s costing us innovation.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
06/26/2025 | John Watson -- Column: Elementary, Mr. WatsonThere's a story about a young woman preparing a holiday ham. Before putting it in the pan, she cuts off the ends. When asked why, she shrugs and says, "That's how my mom always did it." She asks her mother, who gives the same answer. Eventually, the question reaches Grandma, who laughs and says, "Oh, I only cut the ends off because my pan was too small." This story is a powerful analogy for how many PCB designers approach routing today.