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New York Imposes One-Year Moratorium on New AI Data Centers

07/15/2026 | I-Connect007 Editorial Team
New York has become the first U.S. state to impose a temporary statewide moratorium on new hyperscale data centers, following an executive order signed July 14 by Gov. Kathy Hochul. 

Delta Electronics (Americas) and X LABS Sign Technology Partnership MOU to Power Next-Gen AI Data Centers

07/15/2026 | Delta Electronics
Delta Electronics announced a Memorandum of Understanding (MOU) with X LABS, an investment manager and developer of islanded grids, to deliver energy-as-a-service (EaaS) to AI data center projects.

3 Key Takeaways: A New Approach to Die Topside Interconnection

07/15/2026 | I-Connect007
Every advance in power electronics places new demands on semiconductor packaging. As manufacturers push for greater power density, improved thermal management, and smaller form factors, even long-established interconnection methods deserve a fresh look. In its latest white paper, MacDermid Alpha Electronics Solutions examines how a sinter-ready copper foil solution could simplify die topside interconnection while improving performance.

Below the Surface: Ceramic vs PCB: When ‘Good Enough’ Becomes System Failure

07/15/2026 | Chandra Gupta -- Column: Below the Surface
Let’s start with the question engineers are increasingly asking themselves: “When should I use ceramic instead of FR-4?” It’s a fair question. FR-4 has been the backbone of electronics for decades. It’s affordable, widely available, and for many applications, it works just fine. Until it doesn’t.

Power Delivery, AI Infrastructure, and Materials Innovation: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

07/14/2026 | I-Connect007 Editorial Team
The upcoming issue of Advanced Electronics Packaging Digest examines three areas where packaging technology is increasingly defining system performance: power delivery for AI accelerators, the rapid expansion of AI data centers, and the growing importance of substrate materials in high-reliability electronics. Together, these features explore how packaging decisions influence performance, reliability, and long-term scalability across the electronics ecosystem.
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