Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

GSME, Teradyne Announce Strategic Partnership

09/23/2026 | PRNewswire
GS Microelectronics U.S., Inc., a fast-growing semiconductor solutions provider, and Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, today announced a multi‑year strategic partnership to establish a state‑of‑the‑art semiconductor test and evaluation center designed to accelerate customer time‑to‑market.

3 Key Takeaways from The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness

09/22/2026 | I-Connect007
As PCB technology has evolved, the structures being evaluated become more complex. But have the methods used to determine their reliability evolved at the same pace? In The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness, Bob Neves challenges some long-held assumptions about how the electronics industry evaluates PCB via structures. He draws on decades of reliability experience, and examines not only how we test, but what those tests actually tell us.

Custom Interconnect to Exhibit at Microelectronics UK 2026

09/21/2026 | Custom Interconnect Ltd
Custom Interconnect is excited to exhibit at Microelectronics UK 2026 on Stand H60, at ExCeL London on 29 and 30 September.

Teradyne Introduces Iris 100 MicroLED Test System

09/21/2026 | BUSINESS WIRE
Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, announced Iris 100, a production-ready optical test platform for microLED devices.

Würth Elektronik Receives First TDAP Stage 2 Certificate for EMC Chokes

09/17/2026 | Würth Elektronik
The Würth Elektronik lab at its Quality Design Center Asia in Shenzhen has been awarded the world’s first TDAP Stage 2 certificate for the product “choke for suppressing electromagnetic interference” by VDE Prüf- und Zertifizierungsinstitut GmbH.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in