Marcy’s Musings: The Power of the Electronics Ecosystem
Powering the Future: Performance Is Won in Assembly
When I first came to the electronics industry, I was coming from the outside. Over time, I learned that this is not an industry that can be understood from just one angle. What happens in design affects manufacturing. Material choices affect reliability. Supply chain decisions influence business strategy, and advances in technology create new challenges and opportunities throughout the entire ecosystem.
That complexity is one of the things I appreciate most about covering this industry. Each week, I’m reminded that there is always another layer to explore. This week’s must-reads offer five different perspectives on where electronics manufacturing stands today, from business leadership and market opportunity to digital transformation, engineering decisions, and reliability insights.
I’m starting with the ever-optimistic Dan Beaulieu, who refuses to get discouraged about the business he’s been part of for several decades. I also highlight pieces from Summit Interconnect, a new book by Bob Neves, a webinar from Chris Jorgensen at the Global Electronics Association, and a column by Chandra Gupta of Remtec. Finally, it’s worth noting the June book-to-bill reports published this week here and here from the Global Electronics Association, which demonstrate very favorable bookings.
July is my favorite month of the year, and I’m sorry to see it’s over already, but thanks to Dan’s optimism, I know there are bright days ahead!
It’s Only Common Sense: Stop Watching the Headlines and Start Watching the Opportunity
Published July 27
It’s easy to get caught up in the uncertainty of life, and that’s equally true in the electronics industry. There’s never a shortage of trials and challenges. In his weekly column, Dan Beaulieu encourages us to look beyond the headlines and focus on the opportunities that exist for those willing to adapt, invest, and take action. His message is a timely reminder that perspective often determines whether companies see obstacles or possibilities.
Summit Interconnect Celebrates 10 Years
Published July 28
A decade of growth is always worth celebrating, but Summit Interconnect’s 10-year milestone also reflects broader changes within the North American PCB industry. In this interview Marcy LaRont did with Shane Whiteside and Gerry Partida, they look back on the journey that built Summit into one of the largest PCB manufacturers in North America while sharing their perspective on the challenges and opportunities ahead. It’s a story about growth, resilience, and the importance of building a strong domestic manufacturing foundation.
Beyond PDFs: The Next Generation of Electronics Compliance
Published July 28
In this webinar conducted by Chris Jorgensen of the Global Electronics Association, he mentions that compliance traditionally has relied heavily on documentation, but, he says, the electronics industry is moving toward a more connected, data-driven approach. This article reviews that webinar, exploring how digital transformation is changing the way companies manage compliance information, improve visibility, and support more efficient processes throughout the supply chain. As products become more complex, the ability to manage and share accurate data will become increasingly important.
Below the Surface: Ceramic vs. PCB—When ‘Good Enough’ Becomes System Failure
Published July 28
One of my newest columnists is Chandra Gupta of Remtec. This month, he writes that the decisions engineers make early in the design process can have long-term consequences. He examines the differences between ceramic substrates and traditional PCB approaches, highlighting why choosing a material or technology based only on what seems sufficient today can create challenges later. Chandra’s columns first appeared in the Advanced Electronics Packaging Digest, our monthly newsletter devoted to the latest packaging technologies. Be sure to check it out.
Will Your Vias Survive the Heat? New Book From I-Connect007 Has the Answers
Published July 29
I-Connect007 is proud to release its latest book, this time from Bob Neves, titled The Printed Circuit Assembler’s Guide to… Via Structures: Reflow Process Survivability, Reliability, and Robustness. Now, when I mentioned that I’m still peeling back the layers of this complex industry, here comes another one of those layers. Bob explores the limitations of traditional methods while introducing new ways to evaluate via performance and failure mechanisms. When Bob speaks, people listen, and this book is just another perfect example of that.
