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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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Bold Laser Automation Introduces Precision Laser Cleaning System for Advanced Manufacturing
March 27, 2026 | PRNewswireEstimated reading time: 2 minutes
High value parts demand extra care and stability for thin-film removal and cleaning of sensitive components. Bold Laser Automation, Inc. has introduced the LPCl1820UV Laser Precision Cleaning System, a Class 1, industrial laser platform engineered for high-precision surface cleaning and thin-film removal in demanding manufacturing environments. The LPCl1820UV combines UV nanosecond laser processing with precision motion control, advanced beam conditioning, and integrated machine vision to deliver repeatable, production-ready results.
At the core of the system is a 349 nm Q-switched, intra-cavity tripled Nd:YLF UV laser delivering up to 120 µJ pulse energy with excellent pulse-to-pulse stability and beam quality. The UV wavelength enables efficient removal of organic contaminants, oxides, and thin films while minimizing thermal impact on underlying materials—an essential requirement for applications where surface integrity is critical.
"This UV laser cleaning system was designed for manufacturers who need absolute control over laser energy delivery and positioning, especially when working with delicate or high-value parts," said Todd E. Lizotte, co-Founder and CEO of Bold Laser Automation. "This platform gives process engineers the tools to fine-tune cleaning performance without compromising repeatability or substrate integrity."
Applications Across High-Value Manufacturing Sectors
Built on Bold's LPC architecture, this system is suited for precision cleaning and surface preparation of sensitive components and substrates in industries such as:
- Medical devices and fluidic components
- Microelectronics and advanced packaging
- Printed circuit boards and semiconductor packaging
- Optics, glass, and precision metal components
- R&D and pilot-line manufacturing environments
Custom fixturing, trays, and docking systems are developed collaboratively with customers to ensure part protection, efficient handling, and complete integration.
Flexible CAD/CAM-Driven Workflow with Bold OptixOS™
The system is powered by Bold's OptixOS, a CAD/CAM-based NC control environment, built on an ACS motion control architecture. Engineers can import standard CAD files (DXF/DWG), define cleaning zones and layers, and assign laser recipes without requiring deep G-code expertise.
"Process data logging, system event tracking, and I/O diagnostics are standard with this system, supporting both production traceability and continuous process improvement initiatives," added Lizotte.
Production-Ready Design with Cleanroom Compatibility
The LPCI1820UV is housed in a Class 1 laser safety enclosure compliant with CDRH-FDA, OSHA, and NFPA standards. Options include cleanroom-compatible configurations with HEPA filtration, inert gas purging (N₂, CDA, or customer-specified gases), and medium-velocity debris extraction with HEPA and activated carbon filtration.
"Our customers require flexibility depending on their needs," said Lizotte. "The front-load access supports manual operation, while side access panels allow integration now or in the future for automated loading, robotics, or inline manufacturing workflows."
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Sweeney Ng - CEE PCBSuggested Items
Horizon Sales Adds LPKF Laser and Electronics to Its Lineup
04/21/2026 | Horizon SalesHorizon Sales, a leading manufacturers’ representative and distributor to the electronics industry, is pleased to announce a new partnership with LPKF Laser and Electronics, a global leader in precision laser technology
Future-proof Laser Depaneling for PCBs with Photonics
04/10/2026 | Real Time with... APEX EXPOBill Solari of Photonics Systems USA outlines the advantages of laser depaneling for circuit board manufacturing. We learn that this advanced technology addresses rising material costs by increasing panel yield and improving edge quality. This process provides precision, suitability for medical applications, and cost-saving benefits, including the elimination of cleaning steps. There have been significant advancements in laser depaneling, offering a competitive and efficient solution for modern electronics production.
CEA-Leti, NcodiN Partner to Industrialize 300 mm Silicon Photonics
03/11/2026 | NcodiNCEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled photonic interconnects, announced a strategic collaboration to industrialize NcodiN’s optical interposer technology on a 300 mm integrated photonics process.
Altus Supports Ei Electronics with LPKF Laser Depaneling Technology
03/09/2026 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics manufacturing industry, has supported Ei Electronics, Ireland’s largest manufacturer of home life-safety devices, with the installation of an LPKF CuttingMaster 2240 laser depaneling system to enhance PCB singulation and support growing production volumes.
Semtech Expands Data Center Portfolio with Acquisition of HieFo Corporation
03/05/2026 | SemtechSemtech Corporation, a leading provider of high-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service solutions, announced the acquisition of HieFo Corporation (HieFo), a California-based private manufacturer of high-efficiency Indium Phosphide (InP) optoelectronic devices for optical transceivers used across data center interconnects (DCI) and intra-data center interconnects.