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Signal Integrity & Metallization
Signal integrity and additive manufacturing, particularly metallization, are hot topics in PCB design and fabrication. PCB layouts are carefully engineered to achieve specific electrical and power performance targets.
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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AI, HDI, and Interconnect Optimization with MKS' ESI
April 23, 2026 | Real Time with... APEX EXPOEstimated reading time: 1 minute
This discussion revolves around the transformative impact of AI on HDI and substrate manufacturing. Casey Krueger explains the company's "Optimize the Interconnect" initiative, which features Atotech, to provide a comprehensive solution from pretreatment to laser drilling. MKS' ESI offers the innovative Geode G2 platform which is an advanced laser drilling technology that enhances productivity, reduces energy consumption, and addresses complex design challenges in processing both PCB and ICP materials.
APEX EXPO 2026 has concluded successfully. If you couldn’t make it to the show, don’t worry, the I-Connect007 team has coverage of the entire week’s events. Watch your inbox on Fridays over the next several weeks for our complete coverage, delivered directly to your inbox, or visit Real Time with… APEX EXPO 2026 now for video interviews with the movers and shakers of the electronics industry.
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Brent Fischthal - Koh YoungSuggested Items
LPKF Gets Off to a Solid Start in 2026
05/04/2026 | LPKFLPKF Laser & Electronics SE has made a solid start to the 2026 financial year despite a macroeconomic environment that remains challenging.
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Horizon Sales Adds LPKF Laser and Electronics to Its Lineup
04/21/2026 | Horizon SalesHorizon Sales, a leading manufacturers’ representative and distributor to the electronics industry, is pleased to announce a new partnership with LPKF Laser and Electronics, a global leader in precision laser technology
Future-proof Laser Depaneling for PCBs with Photonics
04/10/2026 | Real Time with... APEX EXPOBill Solari of Photonics Systems USA outlines the advantages of laser depaneling for circuit board manufacturing. We learn that this advanced technology addresses rising material costs by increasing panel yield and improving edge quality. This process provides precision, suitability for medical applications, and cost-saving benefits, including the elimination of cleaning steps. There have been significant advancements in laser depaneling, offering a competitive and efficient solution for modern electronics production.
Bold Laser Automation Introduces Precision Laser Cleaning System for Advanced Manufacturing
03/27/2026 | PRNewswireBold Laser Automation, Inc. has introduced the LPCl1820UV Laser Precision Cleaning System, a Class 1, industrial laser platform engineered for high-precision surface cleaning and thin-film removal in demanding manufacturing environments.