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Proper Plane Design Techniques
February 12, 2026 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
Continuing our discussion from the November issue of Design007 Magazine on proper plane design, Kris Moyer, an instructor for the Global Electronics Association, shares techniques he teaches his PCB design students to use.
Kris, you spend time on plane design in your advanced design classes. What topics do you focus on, and why is plane design so important?
Kris Moyer: When it comes to plane design, there are several challenges with modern high-speed designs. Planes, or more specifically, mirror/return paths, are critical to proper controlled impedance transmission line design. Additionally, to mitigate high-speed switching “noise,” the use of planar capacitance is now necessary and critical. A significant amount of the “noise” seen on the power and return lines of the digital signals is the result of the Vcc/Ground bounce. These bounces, in turn, are typically the result of the parasitic inductance of the digital devices’ Vcc and GND pins.
As a digital signal changes state from 0-1 or 1-0, there is a momentary demand for increased current from the power rails. This demand needs to be supplied during the transition period. The rate at which current can be supplied is dependent on the resistance (R), inductance (L), and capacitance (C) of the component leads, component values, and trace/transmission line impedance.
Due to the ever-increasing speed/decreasing time of the digital transition, the time delay of the R/L/C of the leads/devices is greater than the total transition time. This means that the classic method of adding a capacitor to the power pins of the digital devices is no longer effective for this instantaneous switching current. This is primarily due to the parasitic inductance (L) of the device leads, and the total capacitance of the power supply must still be considered in the design; therefore, physical capacitors must be included in the design. A capacitor made from a pair of planes, either using dedicated embedded capacitance material or standard PCB material, is the only device in the design with sufficiently low parasitic inductance to respond quickly enough to meet this new, extremely fast switching current demand.
To continue reading this article, which originally appeared in the January 2026 issue of I-Connect007 Magazine, click here.
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PCB Technologies to Exhibit at PCB East 2026
04/23/2026 | PCB Technologies Ltd.Issey Ende, PCB-Technolgies’ VP of Sales and Marketinghas announced that his company will be exhibiting at this year’s PCB East 2026, the premier East Coast conference and exhibition for the electronics design, fabrication, and assembly industry on Wednesday, April 29, 2026, at the DCU Convention Center in Worcester, Massachusetts.
Design for Test: A New Book from The Test Connection, Inc.
04/23/2026 | Real Time with... APEX EXPOBert Horner, president of The Test Connection Inc., shares insights on designing for testability (DFT) challenges with Kelly Dack. Horner discusses the critical need for incorporating testability early in the design process and the importance of quantifiable metrics for measuring test coverage. He highlights The Test Connection's role in transferring decades of 'tribal knowledge' to emerging engineers through training and education. Look for "The Printed Circuit Assembler's Guide to... Design for Test, A Practical Guide to Test and Inspection" in the I-007eBooks library.
Changing Times: Siemens Plans to Sell Former Mentor Graphics Wilsonville Campus
04/22/2026 | Nolan Johnson, I-Connect007Siemens announced it will be selling its Wilsonville, Oregon, property, which has served as the campus for Mentor Graphics, which was later acquired by German EDA-giant Siemens, as reported by The Oregonian on April 20. Siemens will maintain one building on the sprawling 53-acre campus, citing the move to hybrid and remote work over the past few years as a key factor in the decision.
Siemens Collaborates with TSMC to Advance AI for Semiconductor Design
04/22/2026 | SiemensSiemens announced the continuation of collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement.
Standardization, Workforce, and the Road Ahead for Flex–Packaging Integration, Part 3
04/22/2026 | Anaya Vardya, American Standard CircuitsParts 1 and 2 of this series established the technical foundation and application landscape for the convergence of flexible PCBs and advanced semiconductor packaging. Part 3 addresses what comes next: the standards frameworks, talent pipelines, and strategic imperatives that will determine whether the industry can scale this convergence reliably and competitively.